Loading...

VN2222RLRA

Onsemi

VN2222RLRA by Onsemi

VN2222RLRA by Onsemi is a N-CHANNEL FET with 60V DS Breakdown Voltage. It operates in ENHANCEMENT MODE with 0.15A Drain Current and 7.5 ohm On Resistance. Ideal for low-power applications requiring small signal amplification in electronic circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 839 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

839

-

-

-

-

Vyrian

USA . 297 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

297

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Problanco Electronics

Mexico . 7,038 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,038

-

-

-

-

Kulean Microsystems

USA . 6,459 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,459

-

-

-

-

TANS Electronics

Latvia . 5,017 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,017

-

-

-

-

SupplyDigital Components

Austria . 2,493 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,493

-

-

-

-

Corphita

USA . 618 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

618

-

-

-

-

UHIMA Technologies

Türkiye . 353 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

353

-

-

-

-

Corohmni

South Africa . 64 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

64

-

-

-

-

Overview

Discover the VN2222RLRA by Onsemi, a top-quality Small Signal Field Effect Transistor that offers exceptional performance and reliability. Manufactured by Onsemi, a trusted name in the industry, this N-CHANNEL transistor is perfect for a wide range of applications. With its built-in diode, high DS Breakdown Voltage, and low power dissipation, this transistor provides excellent value and efficiency to customers. Whether you're working on automotive electronics, industrial control systems, or consumer electronics, the VN2222RLRA is the perfect choice for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package provides good insulation and protection for the transistor, ensuring reliability and durability in various operating conditions.

Minimum DS Breakdown Voltage: 60 V

With a minimum breakdown voltage of 60V, this transistor can handle higher voltages without damage, making it suitable for a wide range of applications.

Maximum Drain Current (Abs) (ID): 0.15 A

Capable of handling a maximum drain current of 0.15A, this transistor is suitable for low power applications where a small signal is required.

Maximum Power Dissipation (Abs): 0.4 W

With a maximum power dissipation of 0.4W, this transistor can operate efficiently without overheating, ensuring long term reliability.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150 °C, this transistor can withstand high temperatures without degradation, making it suitable for a variety of environments.

Maximum Drain-Source On Resistance: 7.5 ohm

The low on-resistance of 7.5 ohms ensures that the transistor operates efficiently and with minimal power loss, making it a good choice for many applications.

Maximum Feedback Capacitance (Crss): 5 pF

The low feedback capacitance of 5 pF ensures stable operation and minimal signal distortion, making this transistor suitable for high-frequency applications.

Technical Specifications

Small Signal Field Effect Transistors (FET) VN2222RLRA attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

.15 A

Maximum Drain Current (ID):

.15 A

Maximum Drain-Source On Resistance:

7.5 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

5 pF

JEDEC-95 Code:

TO-92

JESD-30 Code:

O-PBCY-T3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

ROUND

Package Style (Meter):

CYLINDRICAL

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

BOTTOM

Transistor Element Material:

SILICON

Trade Compliance

VN2222RLRA Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20