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VN2222LLRLRM

Onsemi

VN2222LLRLRM by Onsemi

VN2222LLRLRM by Onsemi is a N-CHANNEL FET with 60V DS breakdown voltage, 0.099A drain current, and 7.5 ohm on resistance. Ideal for switching applications, it operates in enhancement mode with a max power dissipation of 0.4W.

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Lifecycle Status

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1k+

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Vyrian

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Digiode

USA . 701 parts In-Stock

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Kulean Microsystems

USA . 5,205 parts In-Stock

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Problanco Electronics

Mexico . 2,924 parts In-Stock

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TANS Electronics

Latvia . 2,875 parts In-Stock

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SupplyDigital Components

Austria . 2,306 parts In-Stock

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UHIMA Technologies

Türkiye . 897 parts In-Stock

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Corphita

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Corohmni

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Overview

Enhance your electronic projects with the VN2222LLRLRM by Onsemi, a high-quality Small Signal Field Effect Transistor that offers exceptional performance and reliability. Manufactured by Onsemi, a trusted name in the industry, this N-CHANNEL transistor is perfect for switching applications, boasting a minimum DS Breakdown Voltage of 60V and a Maximum Drain Current of 0.15A. With a package shape of ROUND and a terminal position at the BOTTOM, this transistor is easy to install and use. Elevate your projects with the premium quality and cutting-edge technology of the VN2222LLRLRM, providing you with the value and benefits you need for success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the transistor, ensuring a longer lifespan.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have better performance characteristics compared to P-channel FETs, making this transistor a good choice for various applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for more efficient switching operations and protects the transistor from reverse current flow.

Transistor Application: SWITCHING

Designed specifically for switching applications, making it a reliable choice for such tasks.

Minimum DS Breakdown Voltage: 60 V

With a high breakdown voltage, this transistor can handle higher voltages without failure, increasing reliability.

Package Shape: ROUND

The round shape helps in easy mounting and handling of the transistor.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide secure connections and are easy to solder, ensuring stable operation.

Operating Mode: ENHANCEMENT MODE

Enhancement mode transistors offer better control and efficiency in switching operations.

Maximum Drain Current (Abs) (ID): 0.099 A

With a high maximum drain current, this transistor can handle higher currents, making it suitable for various applications.

No. of Terminals: 3

Having three terminals allows for more control and flexibility in circuit design.

Maximum Power Dissipation (Abs): 0.4 W

The high maximum power dissipation ensures the transistor can handle heat effectively and operate reliably under varying load conditions.

Package Style (Meter): CYLINDRICAL

The cylindrical package style is compact and saves space, ideal for applications where size is a constraint.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFETs are known for their superior performance in terms of speed and efficiency, making this transistor a good choice for demanding applications.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this transistor can withstand elevated temperatures without performance degradation.

Transistor Element Material: SILICON

Silicon is a widely-used semiconductor material known for its reliability and performance, making this transistor a suitable choice for various applications.

Terminal Finish: TIN LEAD

The tin lead finish provides good solderability and corrosion resistance, ensuring reliable connections.

Maximum Drain Current (ID): 0.15 A

With a high maximum drain current, this transistor can handle current spikes and surges effectively.

Maximum Drain-Source On Resistance: 7.5 ohm

Low drain-source on resistance ensures efficient power handling and minimal voltage drop across the transistor.

Terminal Position: BOTTOM

Bottom terminal position makes it easy for PCB mounting and ensures good thermal conductivity for heat dissipation.

Peak Reflow Temperature °C: 235

With a high peak reflow temperature, this transistor can undergo reflow soldering processes without risk of damage.

Maximum Feedback Capacitance (Crss): 5 pF

Low feedback capacitance helps in reducing signal distortion and improving high-frequency performance.

Technical Specifications

Small Signal Field Effect Transistors (FET) VN2222LLRLRM attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

.099 A

Maximum Drain Current (ID):

.15 A

Maximum Drain-Source On Resistance:

7.5 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

5 pF

JEDEC-95 Code:

TO-92

JESD-30 Code:

O-PBCY-T3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

ROUND

Package Style (Meter):

CYLINDRICAL

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

BOTTOM

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

VN2222LLRLRM Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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