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BS170G

Onsemi

BS170G by Onsemi

BS170G by Onsemi is a N-CHANNEL FET with 60V DS breakdown voltage, 0.5A max drain current, and 5 ohm max on resistance. Ideal for switching applications due to its single configuration with built-in diode. Operating in enhancement mode, it has a max power dissipation of 0.35W and can withstand temperatures up to 150°C.

Median Price

$0.081

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

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Nova Conductors

Japan . 44 parts In-Stock

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Vyrian

USA . 9,923 parts In-Stock

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VNN

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Digiode

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LIBRA Elektronik GmbH

Germany . 330 parts In-Stock

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Chip Stock

USA . 287 parts In-Stock

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ComSIT Distribution GmbH

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ComSIT USA

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ACDS - Activité Composants Distribution Service

France . 200 parts In-Stock

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Pride Electronics

USA . 126 parts In-Stock

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A&K Electronics

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Bristol Electronics

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Florida Circuit

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EMSNET

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First Choice Components Inc.

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Corohmni

South Africa . 53 parts In-Stock

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$0.079

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Continental Prestige Electronics

USA . 3,953 parts In-Stock

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$0.081

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Argo Parts USA

USA . 3,340 parts In-Stock

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$0.081

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$0.079

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Netroflash

USA . 500 parts In-Stock

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$0.081

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$0.077

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$0.075

500

$0.081

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$0.077

$0.075

Modulus Dynamics

Lithuania . 42 parts In-Stock

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$0.090

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$0.089

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$0.086

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42

$0.090

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Andel Nordic

Denmark . 447 parts In-Stock

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$0.090

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$0.061

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$0.061

447

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$0.061

Aztec Data Supply Inc.

USA . 312 parts In-Stock

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$0.610

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Advanced Electronics

New Zealand . 350 parts In-Stock

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$1.387

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$1.318

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$1.318

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$1.387

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$1.318

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AZTECH Wire

Italy . 639 parts In-Stock

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$9.704

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Semicontronic

India . 1,067 parts In-Stock

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$14.050

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$13.699

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$13.628

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Ampacity Inc.

Singapore . 822 parts In-Stock

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Lixinc

USA . 14,473 parts In-Stock

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Perfect Parts

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A-Z Elektronik GmbH

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SupplyDigital Components

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Kulean Microsystems

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Problanco Electronics

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Alle Elektronik GmbH

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Glotronic Ltd.

UK . 3,700 parts In-Stock

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TANS Electronics

Latvia . 3,462 parts In-Stock

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Corphita

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Futuretech Components

Singapore . 960 parts In-Stock

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Robosynatics

Brazil . 950 parts In-Stock

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Lucentia Tech

USA . 950 parts In-Stock

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Kepictronics

USA . 947 parts In-Stock

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UHIMA Technologies

Türkiye . 315 parts In-Stock

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GreenTree Electronics

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Authorized Procurement Solutions

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Overview

Enhance your electronic projects with the BS170G by Onsemi, a top-quality Small Signal Field Effect Transistor designed for switching applications. Manufactured by industry leader Onsemi, this N-CHANNEL transistor offers unparalleled reliability and performance. With a built-in diode and a 60V DS breakdown voltage, this transistor is perfect for enhancing circuit efficiency. Upgrade your designs with ease and trust in the superior quality of the BS170G by Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically have lower ON-resistance and higher efficiency, making them suitable for switching applications.

Minimum DS Breakdown Voltage: 60 V

With a minimum breakdown voltage of 60V, this transistor can handle higher voltages without breakdown, increasing its reliability.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring efficient performance in tasks that require frequent on/off switching.

Maximum Drain Current (ID): 0.5 A

The maximum drain current of 0.5A allows for handling moderate current loads, making it suitable for a variety of low power applications.

Maximum Power Dissipation (Abs): 0.35 W

With a maximum power dissipation of 0.35W, the transistor can effectively dissipate heat and operate reliably under varying load conditions.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology enhances the performance and reliability of the transistor, providing stable operation in different environments.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature of 150°C allows the transistor to withstand elevated temperatures, making it suitable for industrial applications.

Maximum Drain-Source On Resistance: 5 ohm

With a low drain-source on resistance of 5 ohms, the transistor minimizes power loss and heat generation, improving overall efficiency.

Technical Specifications

Small Signal Field Effect Transistors (FET) BS170G attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

.5 A

Maximum Drain Current (ID):

.5 A

Maximum Drain-Source On Resistance:

5 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-226AA

JESD-30 Code:

O-PBCY-T3

JESD-609 Code:

e1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

ROUND

Package Style (Meter):

CYLINDRICAL

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

THROUGH-HOLE

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

BS170G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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