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SMUN5211T1G

Onsemi

SMUN5211T1G by Onsemi

SMUN5211T1G by Onsemi is a NPN BJT with built-in resistor for switching applications. It has hFE of 35, VCE of 50V, and IC of 0.1A. The package is small outline with gull wing terminals, suitable for surface mount assembly.

Median Price

$0.033

Lifecycle Status

Suppliers In-Stock

23

In-Stock Inventory

1k+

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Newark

USA . 1,071,000 parts In-Stock

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Master Electronics

USA . 105,000 parts In-Stock

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Flip Electronics (Authorized)

USA . 45,000 parts In-Stock

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Verical

USA . 33,000 parts In-Stock

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Avnet

USA . 27,000 parts In-Stock

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Arrow

USA . 27,000 parts In-Stock

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Chip1Stop

Japan . 18,000 parts In-Stock

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Rochester

USA . 1,871 parts In-Stock

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$0.030

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DigiKey

USA . 504 parts In-Stock

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Digiode

USA . 1,023 parts In-Stock

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$0.024

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TME

Poland . 38 parts In-Stock

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$0.072

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$0.042

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38

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Nova Conductors

Japan . 79 parts In-Stock

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$0.291

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IBS Electronics

USA . 105,000 parts In-Stock

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Flip Electronics

USA . 78,000 parts In-Stock

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NAC Semi

USA . 78,000 parts In-Stock

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Chip Stock

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ACDS - Activité Composants Distribution Service

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Bristol Electronics

USA . 9,000 parts In-Stock

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$0.108

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Dan-Mar Components

USA . 9,000 parts In-Stock

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Vyrian

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Classic Components Corporation

USA . 6,362 parts In-Stock

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ComSIT Distribution GmbH

Germany . 1,795 parts In-Stock

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ComSIT USA

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Distributors (Availability)

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Ampacity Inc.

Singapore . 28,071 parts In-Stock

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$0.019

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Semicontronic

India . 19,042 parts In-Stock

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Corohmni

South Africa . 157 parts In-Stock

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Corphita

USA . 1,865 parts In-Stock

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Advanced Electronics

New Zealand . 100 parts In-Stock

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Argo Parts USA

USA . 3,710 parts In-Stock

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$0.282

3,710

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Netroflash

USA . 500 parts In-Stock

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$0.285

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Aztec Data Supply Inc.

USA . 4,806 parts In-Stock

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$1.929

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Authorized Procurement Solutions

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GreenTree Electronics

Israel . 561,000 parts In-Stock

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Eastek

USA . 408,000 parts In-Stock

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Perfect Parts

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Kepictronics

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Lixinc

USA . 15,214 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 14,777 parts In-Stock

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Continental Prestige Electronics

USA . 13,000 parts In-Stock

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TANS Electronics

Latvia . 8,136 parts In-Stock

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Kulean Microsystems

USA . 5,988 parts In-Stock

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Infinite Electronics LLP (Excess)

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Metaverse IC Inc.

Canada . 2,710 parts In-Stock

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Problanco Electronics

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SupplyDigital Components

Austria . 68 parts In-Stock

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UHIMA Technologies

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Overview

Experience the superior quality and reliability of Onsemi with the SMUN5211T1G, a Small Signal Bipolar Junction Transistor designed for switching applications. With a single configuration and built-in resistor, this NPN transistor offers high performance in a compact rectangular package. Ideal for a wide range of electronic devices, this product provides customers with efficient power dissipation, high collector current capacity, and excellent DC current gain. Trust Onsemi for cutting-edge technology and innovative solutions to meet your electronics needs.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This material provides durability and protection for the transistor, making it a reliable choice for various applications.

Polarity or Channel Type:

NPN - The NPN configuration allows for easy integration into circuits and systems that require this type of transistor.

Configuration:

SINGLE WITH BUILT-IN RESISTOR - The built-in resistor simplifies the design process and saves space on the circuit board.

Transistor Application:

SWITCHING - Ideal for applications that require fast switching speeds and high efficiency.

Surface Mount:

YES - Easy to install and suitable for automated manufacturing processes.

Package Shape:

RECTANGULAR - Provides a compact form factor for efficient use of space on the circuit board.

Terminal Form:

GULL WING - Allows for easy soldering and secure connection to the circuit board.

No. of Terminals:

3 - Simplifies the connections required for the transistor, reducing potential errors in assembly.

Maximum Power Dissipation (Abs):

0.31 W - Can handle a moderate amount of power without overheating, suitable for many applications.

Package Style (Meter):

SMALL OUTLINE - Compact design makes it suitable for small electronic devices and space-constrained applications.

Minimum DC Current Gain (hFE):

35 - Ensures consistent and reliable performance in various operating conditions.

Maximum Collector-Emitter Voltage:

50 V - Provides a high voltage tolerance for versatile use in different circuits.

Transistor Element Material:

SILICON - Silicon transistors are known for their reliability and stable performance.

Maximum Collector Current (IC):

0.1 A - Capable of handling moderate current levels, suitable for many low-power applications.

Terminal Finish:

Matte Tin (Sn) - annealed - Provides a durable finish for reliable solder connections and long-term stability.

Terminal Position:

DUAL - Offers flexibility in mounting and connection options for different circuit layouts.

Reference Standard:

AEC-Q101 - Meets automotive industry standards for quality and reliability, making it suitable for automotive applications.

Technical Specifications

Small Signal Bipolar Junction Transistors (BJT) SMUN5211T1G attributes and parameters. Explore more Small Signal Bipolar Junction Transistors (BJT) devices from Onsemi

Specs

Additional Features:

BUILT IN BIAS RESISTOR RATIO IS 1

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

50 V

Minimum DC Current Gain (hFE):

35

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

NPN

Maximum Power Dissipation (Abs):

Reference Standard:

AEC-Q101

Sub-Category:

BIP General Purpose Small Signal

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

SMUN5211T1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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