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SMUN2212T3

Onsemi

SMUN2212T3 by Onsemi

SMUN2212T3 by Onsemi is a NPN BJT with built-in resistor for switching applications. Features include hFE of 60, VCE of 50V, and IC of 0.1A. Its Gull Wing terminals and small outline package make it suitable for surface mount designs in various electronic circuits.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 2,251 parts In-Stock

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Vyrian

USA . 1,316 parts In-Stock

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Problanco Electronics

Mexico . 7,614 parts In-Stock

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Kulean Microsystems

USA . 6,225 parts In-Stock

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TANS Electronics

Latvia . 4,110 parts In-Stock

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SupplyDigital Components

Austria . 3,606 parts In-Stock

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UHIMA Technologies

Türkiye . 519 parts In-Stock

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519

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Corohmni

South Africa . 241 parts In-Stock

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Corphita

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Overview

Upgrade your electronics with the SMUN2212T3 by Onsemi, a high-quality Small Signal Bipolar Junction Transistor that offers exceptional performance and reliability. Manufactured by Onsemi, a trusted name in the industry, this NPN transistor is perfect for switching applications. With its built-in resistor and compact design, it provides added convenience and efficiency. Experience improved functionality and enhanced performance with the SMUN2212T3 - the smart choice for all your electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the transistor, making it suitable for a variety of applications.

Polarity or Channel Type: NPN

NPN transistors are commonly used in amplification and switching circuits, offering good performance in such applications.

Configuration: SINGLE WITH BUILT-IN RESISTOR

Simplifies circuit design by eliminating the need for an external resistor, saving space and reducing overall component count.

Transistor Application: SWITCHING

Specifically designed for switching applications, providing reliable performance in on/off control of electrical signals.

Surface Mount: YES

Allows for easy and efficient mounting on PCBs, ensuring a compact and space-saving design.

Package Shape: RECTANGULAR

Offers a standard form factor that is easy to handle and integrate into various circuit layouts.

Terminal Form: GULL WING

Facilitates smooth soldering and connection during assembly, enhancing the reliability of the product.

No. of Terminals: 3

Provides the necessary connections for input, output, and biasing in a simple and straightforward manner.

Package Style (Meter): SMALL OUTLINE

Compact package size saves space on PCBs and enables high-density circuit designs.

Minimum DC Current Gain (hFE): 60

Ensures stable and consistent amplification of signals, maintaining the integrity of the output.

Maximum Operating Temperature: 150 °C

Withstands high temperature environments, making it suitable for industrial applications where heat dissipation is crucial.

Maximum Collector-Emitter Voltage: 50 V

Provides a safe operating range for voltage handling, preventing damage to the transistor in overvoltage conditions.

Transistor Element Material: SILICON

Silicon-based transistors offer excellent performance in terms of speed, power handling, and reliability.

Maximum Collector Current (IC): 0.1 A

Capable of handling moderate current levels, making it suitable for low to medium power applications.

Terminal Finish: TIN LEAD

Ensures good solderability and conductivity, enhancing the reliability of the connections in the circuit.

Terminal Position: DUAL

Provides flexibility in circuit design and layout, allowing for easy connection to other components.

Technical Specifications

Small Signal Bipolar Junction Transistors (BJT) SMUN2212T3 attributes and parameters. Explore more Small Signal Bipolar Junction Transistors (BJT) devices from Onsemi

Specs

Additional Features:

BUILT IN BIAS RESISTOR RATIO IS 1

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

50 V

Minimum DC Current Gain (hFE):

60

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

NPN

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

SMUN2212T3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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