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NXH160T120L2Q2F2SG

Onsemi

NXH160T120L2Q2F2SG by Onsemi

NXH160T120L2Q2F2SG by Onsemi is an N-CHANNEL IGBT with 1200V VCEsat, 181A IC, and 500W power dissipation. Ideal for POWER CONTROL applications due to its fast turn-off time of 435ns and high operating temperature range from -40°C to 125°C. The COMPLEX configuration and RECTANGULAR package shape make it suitable for various industrial uses.

Median Price

$69.500

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

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Farnell

UK . 252 parts In-Stock

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$73.520

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252

$73.520

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Rochester

USA . 240 parts In-Stock

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-

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$115.230

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$103.100

10k+ parts

$97.030

240

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$115.230

$103.100

$97.030

DigiKey

USA . 240 parts In-Stock

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240

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Arrow

USA . 12 parts In-Stock

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$65.650

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Verical

USA . 12 parts In-Stock

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$65.650

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Chip1Stop

Japan . 12 parts In-Stock

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$69.500

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Distributors (In-Stock)

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Digiode

USA . 694 parts In-Stock

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$69.844

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694

$69.844

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Nova Conductors

Japan . 87 parts In-Stock

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$114.430

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Vyrian

USA . 6,126 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 550 parts In-Stock

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$9.462

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550

$9.462

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Ampacity Inc.

Singapore . 128 parts In-Stock

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$55.800

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$55.800

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Corohmni

South Africa . 308 parts In-Stock

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$65.650

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Corphita

USA . 1,260 parts In-Stock

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$66.168

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Continental Prestige Electronics

USA . 12 parts In-Stock

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$73.520

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Netroflash

USA . 2,000 parts In-Stock

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$114.430

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$114.430

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Microchip USA

USA . 392 parts In-Stock

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$195.360

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Problanco Electronics

Mexico . 7,267 parts In-Stock

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Kulean Microsystems

USA . 6,731 parts In-Stock

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TANS Electronics

Latvia . 6,715 parts In-Stock

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SupplyDigital Components

Austria . 5,411 parts In-Stock

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Argo Parts USA

USA . 3,479 parts In-Stock

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UHIMA Technologies

Türkiye . 552 parts In-Stock

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Overview

Unlock the power of efficient and reliable power control with the NXH160T120L2Q2F2SG by Onsemi. As a leading manufacturer in the industry, Onsemi ensures top-notch quality and performance in their Insulated Gate Bipolar Transistors (IGBT). Designed for N-CHANNEL applications, this transistor offers a complex configuration ideal for a wide range of power control needs. With a maximum VCEsat of 2.7V and a maximum collector-emitter voltage of 1200V, this product provides unparalleled value and benefits to customers looking for high-quality components for their projects. Experience the advantages of precision engineering and superior functionality with the NXH160T120L2Q2F2SG.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs typically have lower conduction losses and higher efficiency, making this product a good choice for power control applications.

Maximum VCEsat: 2.7 V

Low VCEsat value indicates low saturation voltage, leading to less power dissipation and higher efficiency.

Maximum Power Dissipation (Abs): 500 W

High power dissipation capability allows this IGBT to handle high power loads effectively.

Maximum Collector-Emitter Voltage: 1200 V

High VCE allows this IGBT to be used in high voltage applications for power control.

Maximum Collector Current (IC): 181 A

High IC rating enables this IGBT to handle large current flows, making it suitable for power control in high current circuits.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) NXH160T120L2Q2F2SG attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

Configuration:

Maximum Gate-Emitter Threshold Voltage:

6.4 V

Maximum Gate-Emitter Voltage:

20 V

JESD-30 Code:

R-XUFM-X56

No. of Elements:

4

No. of Terminals:

56

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

435 ns

Nominal Turn On Time (ton):

150 ns

Maximum VCEsat:

2.7 V

Trade Compliance

NXH160T120L2Q2F2SG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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