Loading...

NXH160T120L2Q1PG

Onsemi

NXH160T120L2Q1PG by Onsemi

NXH160T120L2Q1PG by Onsemi is an N-CHANNEL IGBT with 4 elements, VCEsat of 2.5V, and max power dissipation of 280W. Ideal for power control applications, it has a max VCE of 1200V and IC of 140A. Operating temp ranges from -40 to +150 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,154 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,154

-

-

-

-

Digiode

USA . 1,431 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,431

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Problanco Electronics

Mexico . 4,060 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,060

-

-

-

-

SupplyDigital Components

Austria . 1,241 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,241

-

-

-

-

UHIMA Technologies

Türkiye . 829 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

829

-

-

-

-

Corohmni

South Africa . 463 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

463

-

-

-

-

Kulean Microsystems

USA . 274 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

274

-

-

-

-

TANS Electronics

Latvia . 211 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

211

-

-

-

-

Corphita

USA . 173 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

173

-

-

-

-

Overview

Unlock the power of innovation with the NXH160T120L2Q1PG by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Insulated Gate Bipolar Transistors (IGBT) that excel in power control applications. This N-CHANNEL transistor boasts a bridge configuration with built-in diodes and a thermistor, providing unparalleled performance and reliability. With a maximum collector-emitter voltage of 1200V and a maximum collector current of 140A, this product offers exceptional value and benefits to customers seeking high-power solutions. Experience superior efficiency and precision with the NXH160T120L2Q1PG.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL IGBTs typically have lower conduction losses compared to P-CHANNEL IGBTs, making them more efficient for power control applications.

Configuration: BRIDGE, 4 ELEMENTS WITH BUILT-IN DIODE, SINGLE PHASE DIODE BRIDGE AND THERMISTOR

This configuration allows for easy integration into power control circuits and includes built-in diodes for protection against reverse voltage.

Maximum VCEsat: 2.5 V

Low VCEsat helps reduce power dissipation and improves efficiency during operation.

Package Shape: RECTANGULAR

Rectangular packages are easy to mount on circuit boards and provide good thermal performance.

Maximum Power Dissipation (Abs): 280 W

High power dissipation rating allows for handling of large currents and voltages without overheating.

Maximum Operating Temperature: 150 °C

High operating temperature range ensures stable performance even in demanding environments.

Maximum Collector-Emitter Voltage: 1200 V

High collector-emitter voltage rating makes this IGBT suitable for high voltage applications.

Maximum Gate-Emitter Voltage: 20 V

High gate-emitter voltage tolerance ensures reliable gate control for power switching.

Maximum Collector Current (IC): 140 A

High collector current rating allows for handling large current spikes and power loads.

Maximum Gate-Emitter Threshold Voltage: 6.9 V

The gate-emitter threshold voltage ensures proper turn-on and turn-off of the IGBT for efficient power control.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) NXH160T120L2Q1PG attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

Maximum Gate-Emitter Threshold Voltage:

6.9 V

Maximum Gate-Emitter Voltage:

20 V

JESD-30 Code:

R-XUFM-X30

No. of Elements:

4

No. of Terminals:

30

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Maximum VCEsat:

2.5 V

Trade Compliance

NXH160T120L2Q1PG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 11