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NXH100B120H3Q0PTG

Onsemi

NXH100B120H3Q0PTG by Onsemi

NXH100B120H3Q0PTG by Onsemi is an N-CHANNEL IGBT with 2 elements, built-in diode, and thermistor. It has a max VCEsat of 2.3V and can handle up to 50A collector current. Ideal for power control applications due to its high power dissipation of 186W and operating temperature range from -40 °C to 150°C.

Median Price

$65.100

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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Mouser Electronics

USA . 28 parts In-Stock

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$62.950

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DigiKey

USA . 22 parts In-Stock

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$67.250

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$51.236

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Flip Electronics (Authorized)

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Digiode

USA . 584 parts In-Stock

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$48.678

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Vyrian

USA . 3,106 parts In-Stock

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Flip Electronics

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Corphita

USA . 1,172 parts In-Stock

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$46.116

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Corohmni

South Africa . 72 parts In-Stock

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$51.240

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Microchip USA

USA . 7,277 parts In-Stock

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$207.276

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SupplyDigital Components

Austria . 7,780 parts In-Stock

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TANS Electronics

Latvia . 6,852 parts In-Stock

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Authorized Procurement Solutions

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Kulean Microsystems

USA . 5,647 parts In-Stock

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Problanco Electronics

Mexico . 4,722 parts In-Stock

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UHIMA Technologies

Türkiye . 306 parts In-Stock

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Overview

Upgrade your power control systems with the NXH100B120H3Q0PTG by Onsemi. This insulated gate bipolar transistor offers unmatched quality and reliability, thanks to Onsemi's reputation as a top manufacturer in the industry. Ideal for a wide range of applications, this N-CHANNEL transistor with built-in diode and thermistor provides superior performance and efficiency. Experience the benefits of faster turn on/off times and high power dissipation, all while operating at a wide temperature range. Trust Onsemi to deliver value and innovation with every product.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs have lower on-state resistance and better efficiency compared to P-channel IGBTs, making this product a good choice for power control applications.

Configuration: COMMON COLLECTOR, 2 ELEMENTS WITH BUILT-IN DIODE AND THERMISTOR

The built-in diode and thermistor provide added functionality and protection, enhancing the reliability and performance of the product in power control applications.

Maximum VCEsat: 2.3 V

The low saturation voltage of 2.3V results in lower power losses and higher efficiency, making this product suitable for power control applications where energy efficiency is important.

Nominal Turn Off Time (toff): 291 ns

The fast turn-off time of 291 ns allows for precise control and switching in power control applications, improving overall performance and reliability.

Maximum Power Dissipation (Abs): 186 W

With a high maximum power dissipation of 186W, this IGBT can handle high power levels effectively, making it a reliable choice for demanding power control applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) NXH100B120H3Q0PTG attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Additional Features:

RC-IGBT

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

Maximum Gate-Emitter Threshold Voltage:

6.5 V

Maximum Gate-Emitter Voltage:

20 V

JESD-30 Code:

R-XUFM-X22

No. of Elements:

2

No. of Terminals:

22

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

291 ns

Nominal Turn On Time (ton):

61 ns

Maximum VCEsat:

2.3 V

Trade Compliance

NXH100B120H3Q0PTG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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