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NXH160T120L2Q1SG

Onsemi

NXH160T120L2Q1SG by Onsemi

NXH160T120L2Q1SG by Onsemi is an N-CHANNEL IGBT with 4 elements, VCEsat of 2.5V, and max power dissipation of 280W. Ideal for power control applications, it has a max VCE of 1200V and max IC of 140A. Operating temp ranges from -40 to 150 °C making it suitable for various industrial uses.

Median Price

$86.235

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 21 parts In-Stock

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$82.500

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$72.820

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21

$82.500

$72.820

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DigiKey

USA . 32 parts In-Stock

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$89.970

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$72.830

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32

$89.970

$72.830

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Distributors (In-Stock)

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Digiode

USA . 545 parts In-Stock

1+ parts

$78.375

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545

$78.375

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Vyrian

USA . 5,413 parts In-Stock

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5,413

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Distributors (Availability)

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Corphita

USA . 778 parts In-Stock

1+ parts

$74.250

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778

$74.250

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Corohmni

South Africa . 375 parts In-Stock

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$82.500

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375

$82.500

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Kulean Microsystems

USA . 6,809 parts In-Stock

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6,809

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TANS Electronics

Latvia . 5,205 parts In-Stock

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5,205

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SupplyDigital Components

Austria . 2,038 parts In-Stock

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Problanco Electronics

Mexico . 878 parts In-Stock

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UHIMA Technologies

Türkiye . 398 parts In-Stock

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Overview

Unlock the power of innovation with the NXH160T120L2Q1SG by Onsemi. As a leading manufacturer in the industry, Onsemi ensures top-quality products that meet the highest standards. This insulated gate bipolar transistor (IGBT) is designed for power control applications, offering a maximum collector-emitter voltage of 1200V and a maximum collector current of 140A. With built-in diodes and a thermistor, this product provides exceptional efficiency and reliability. Trust Onsemi to deliver cutting-edge technology that drives performance and success in your projects. Elevate your power solutions with the NXH160T120L2Q1SG today.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL IGBTs typically have lower on-state voltage drop and higher switching speeds compared to P-CHANNEL IGBTs, making them more efficient for power control applications.

Configuration: BRIDGE, 4 ELEMENTS WITH BUILT-IN DIODE, SINGLE PHASE DIODE BRIDGE AND THERMISTOR

The bridge configuration with built-in diode and thermistor provides a complete solution for power control applications, simplifying the design process and enhancing system reliability.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, this IGBT is optimized for efficient and reliable performance in controlling high power loads.

Maximum VCEsat: 2.5 V

The low VCEsat value of 2.5V ensures minimal power loss and high efficiency during operation, making it suitable for high-performance power control applications.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy integration and mounting in electronic systems, providing convenience and flexibility in design.

Maximum Power Dissipation (Abs): 280 W

With a high maximum power dissipation value of 280W, this IGBT can handle significant power levels without overheating, ensuring long-term reliability and performance.

Package Style (Meter): FLANGE MOUNT

The flange mount package style allows for secure and stable mounting in industrial environments, enhancing the durability and ruggedness of the product.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature of 150 °C enables this IGBT to withstand harsh operating conditions without compromising performance, ensuring reliable operation in various environments.

Maximum Collector-Emitter Voltage: 1200 V

The high maximum collector-emitter voltage rating of 1200V makes this IGBT suitable for high-voltage power control applications, providing versatility and compatibility with a wide range of systems.

Transistor Element Material: SILICON

Silicon is a commonly used semiconductor material known for its stability, reliability, and high performance, making it an ideal choice for power control applications.

Maximum Gate-Emitter Voltage: 20 V

The maximum gate-emitter voltage of 20V ensures safe and reliable operation of the IGBT, protecting it from electrical stress and ensuring long-term durability.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40 °C allows this IGBT to function effectively in cold environments, providing reliable performance in a wide range of operating conditions.

Maximum Collector Current (IC): 140 A

With a high maximum collector current rating of 140A, this IGBT is capable of handling high current loads with ease, making it suitable for high-power applications.

Maximum Gate-Emitter Threshold Voltage: 6.9 V

The maximum gate-emitter threshold voltage of 6.9V ensures precise control and efficient operation of the IGBT, enhancing performance and reliability in power control applications.

Terminal Position: UPPER

The upper terminal position provides easy access for connecting external components and simplifies the installation process, improving the overall usability of the product.

Case Connection: ISOLATED

The isolated case connection design enhances safety and reliability by preventing electrical leakage and minimizing the risk of short circuits, ensuring secure operation in demanding environments.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) NXH160T120L2Q1SG attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

Maximum Gate-Emitter Threshold Voltage:

6.9 V

Maximum Gate-Emitter Voltage:

20 V

JESD-30 Code:

R-XUFM-X30

No. of Elements:

4

No. of Terminals:

30

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Maximum VCEsat:

2.5 V

Trade Compliance

NXH160T120L2Q1SG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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