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NXH100B120H3Q0PG

Onsemi

NXH100B120H3Q0PG by Onsemi

N-CHANNEL; Configuration: COMMON COLLECTOR, 2 ELEMENTS WITH BUILT-IN DIODE AND THERMISTOR; Surface Mount: NO; Maximum Power Dissipation (Abs): 186 W; Maximum Collector Current (IC): 50 A; Maximum Collector-Emitter Voltage: 1200 V;

Median Price

$65.075

Lifecycle Status

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11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 24 parts In-Stock

1+ parts

$52.720

100+ parts

$18.300

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-

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24

$52.720

$18.300

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DigiKey

USA . 23 parts In-Stock

1+ parts

$67.250

100+ parts

$51.236

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23

$67.250

$51.236

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Farnell

UK . 13 parts In-Stock

1+ parts

$67.860

100+ parts

$44.110

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13

$67.860

$44.110

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Newark

USA . 23 parts In-Stock

1+ parts

$69.260

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23

$69.260

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Element14

Singapore . 13 parts In-Stock

1+ parts

$87.500

100+ parts

$74.070

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13

$87.500

$74.070

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Rochester

USA . 37 parts In-Stock

1+ parts

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$51.240

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$45.850

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$43.150

37

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$51.240

$45.850

$43.150

Verical

USA . 24 parts In-Stock

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-

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$52.720

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24

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$52.720

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Chip1Stop

Japan . 24 parts In-Stock

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$62.900

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24

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$62.900

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Distributors (In-Stock)

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Digiode

USA . 1,308 parts In-Stock

1+ parts

$44.916

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1,308

$44.916

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Vyrian

USA . 5,953 parts In-Stock

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Flip Electronics

USA . 336 parts In-Stock

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336

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Corphita

USA . 2,006 parts In-Stock

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$42.552

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2,006

$42.552

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Corohmni

South Africa . 161 parts In-Stock

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$47.280

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161

$47.280

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Continental Prestige Electronics

USA . 23 parts In-Stock

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$78.270

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23

$78.270

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Microchip USA

USA . 5,597 parts In-Stock

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$207.276

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5,597

$207.276

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Problanco Electronics

Mexico . 6,706 parts In-Stock

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6,706

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SupplyDigital Components

Austria . 2,600 parts In-Stock

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2,600

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TANS Electronics

Latvia . 2,489 parts In-Stock

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2,489

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Kulean Microsystems

USA . 707 parts In-Stock

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707

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UHIMA Technologies

Türkiye . 30 parts In-Stock

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30

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Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) NXH100B120H3Q0PG attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Additional Features:

RC-IGBT

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

Maximum Gate-Emitter Threshold Voltage:

6.5 V

Maximum Gate-Emitter Voltage:

20 V

JESD-30 Code:

R-XUFM-X22

No. of Elements:

2

No. of Terminals:

22

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

291 ns

Nominal Turn On Time (ton):

61 ns

Maximum VCEsat:

2.3 V

Trade Compliance

NXH100B120H3Q0PG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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