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NVTYS010N04CLTWG

Onsemi

NVTYS010N04CLTWG by Onsemi

NVTYS010N04CLTWG by Onsemi is a Power FET with 40V DS Breakdown Voltage, 163A IDM, and 0.0155 ohm RDS(on). Ideal for power management applications due to its N-CHANNEL configuration and 30W Pdiss. Operating in Enhancement Mode, it offers high performance in a small outline package.

Median Price

$0.896

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 2,940 parts In-Stock

1+ parts

$1.360

100+ parts

$0.566

1k+ parts

$0.402

10k+ parts

$0.351

2,940

$1.360

$0.566

$0.402

$0.351

DigiKey

USA . 2,369 parts In-Stock

1+ parts

$1.360

100+ parts

$0.566

1k+ parts

$0.402

10k+ parts

$0.313

2,369

$1.360

$0.566

$0.402

$0.313

Rochester

USA . 1,890 parts In-Stock

1+ parts

-

100+ parts

$0.417

1k+ parts

$0.346

10k+ parts

$0.308

1,890

-

$0.417

$0.346

$0.308

Verical

USA . 1,890 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.432

10k+ parts

$0.386

1,890

-

-

$0.432

$0.386

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,159 parts In-Stock

1+ parts

$0.324

100+ parts

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2,159

$0.324

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Vyrian

USA . 2,290 parts In-Stock

1+ parts

$0.341

100+ parts

-

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2,290

$0.341

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Flip Electronics

USA . 200,000 parts In-Stock

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200,000

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 645 parts In-Stock

1+ parts

$0.307

100+ parts

-

1k+ parts

-

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645

$0.307

-

-

-

Corohmni

South Africa . 282 parts In-Stock

1+ parts

$0.341

100+ parts

-

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282

$0.341

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Microchip USA

USA . 5,715 parts In-Stock

1+ parts

$3.802

100+ parts

-

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5,715

$3.802

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Kulean Microsystems

USA . 5,781 parts In-Stock

1+ parts

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5,781

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TANS Electronics

Latvia . 5,064 parts In-Stock

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5,064

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Problanco Electronics

Mexico . 1,037 parts In-Stock

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1,037

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SupplyDigital Components

Austria . 734 parts In-Stock

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734

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UHIMA Technologies

Türkiye . 491 parts In-Stock

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491

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Overview

Unleash the power of innovation with the NVTYS010N04CLTWG Power Field Effect Transistor by Onsemi. Crafted with precision and expertise, this N-CHANNEL FET offers unparalleled performance and reliability for a wide range of applications. From enhancing efficiency to ensuring safety, this transistor is designed to exceed expectations and provide value to customers. Experience the advantages of cutting-edge technology in a compact package, making it the ideal choice for your next project. Choose Onsemi for quality you can trust and results you can depend on.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Polarity or Channel Type: N-CHANNEL

Allows for efficient current flow in one direction, making it suitable for various electronic applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Includes a built-in diode for protection against reverse voltage, enhancing the reliability of the product.

Maximum Operating Temperature: 175 °C

Can operate efficiently at high temperatures, suitable for industrial or high-performance applications.

Maximum Pulsed Drain Current (IDM): 163 A

Handles high peak currents effectively, making it suitable for applications requiring power handling capabilities.

Maximum Drain-Source On Resistance: 0.0155 ohm

Low on-resistance ensures efficient power transfer and minimal voltage drop during operation.

Technical Specifications

Power Field Effect Transistors (FET) NVTYS010N04CLTWG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

66 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

12 A

Maximum Drain Current (ID):

12 A

Maximum Drain-Source On Resistance:

.0155 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

12 pF

JESD-30 Code:

R-PDSO-X5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

163 A

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

UNSPECIFIED

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NVTYS010N04CLTWG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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