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NVTYS010N06CLTWG

Onsemi

NVTYS010N06CLTWG by Onsemi

NVTYS010N06CLTWG by Onsemi is a Power FET with 60V DS Breakdown Voltage, 290A IDM, and 0.015 ohm RDS(on). It's an N-CHANNEL transistor in PLASTIC/EPOXY package for applications requiring high power dissipation and low on-resistance. Ideal for automotive electronics due to AEC-Q101 compliance and 175 °C operating temperature.

Median Price

$1.020

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 2,990 parts In-Stock

1+ parts

$1.530

100+ parts

$0.642

1k+ parts

$0.459

10k+ parts

$0.361

2,990

$1.530

$0.642

$0.459

$0.361

Chip1Stop

Japan . 2,900 parts In-Stock

1+ parts

$3.570

100+ parts

$1.130

1k+ parts

$0.776

10k+ parts

-

2,900

$3.570

$1.130

$0.776

-

Rochester

USA . 1,879 parts In-Stock

1+ parts

-

100+ parts

$0.490

1k+ parts

$0.407

10k+ parts

$0.363

1,879

-

$0.490

$0.407

$0.363

Verical

USA . 1,879 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.509

10k+ parts

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1,879

-

-

$0.509

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Distributors (In-Stock)

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Digiode

USA . 549 parts In-Stock

1+ parts

$0.381

100+ parts

-

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549

$0.381

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Vyrian

USA . 923 parts In-Stock

1+ parts

$0.401

100+ parts

-

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923

$0.401

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Flip Electronics

USA . 1,109 parts In-Stock

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1,109

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Distributors (Availability)

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Corphita

USA . 1,115 parts In-Stock

1+ parts

$0.361

100+ parts

-

1k+ parts

-

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1,115

$0.361

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Corohmni

South Africa . 299 parts In-Stock

1+ parts

$0.401

100+ parts

-

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299

$0.401

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Microchip USA

USA . 330 parts In-Stock

1+ parts

$4.345

100+ parts

-

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330

$4.345

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QUARKTWIN TECHNOLOGY LTD

USA . 16,204 parts In-Stock

1+ parts

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16,204

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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SupplyDigital Components

Austria . 5,905 parts In-Stock

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5,905

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Kulean Microsystems

USA . 5,481 parts In-Stock

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5,481

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GreenTree Electronics

Israel . 3,000 parts In-Stock

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TANS Electronics

Latvia . 1,260 parts In-Stock

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1,260

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UHIMA Technologies

Türkiye . 349 parts In-Stock

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349

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Problanco Electronics

Mexico . 80 parts In-Stock

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80

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Overview

Unleash the power of innovation with the NVTYS010N06CLTWG Power Field Effect Transistor by Onsemi. Crafted with precision and quality, this N-CHANNEL FET offers a built-in diode for enhanced performance. Ideal for a variety of applications, this transistor is designed to deliver maximum efficiency and reliability. Trust in Onsemi's expertise to provide you with high-quality components that exceed expectations. Elevate your projects with the NVTYS010N06CLTWG and experience the value and benefits it brings to your work.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a durable and lightweight housing for the FET, making it suitable for a wide range of applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally have lower on-resistance and higher switching speeds, making them efficient for power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for easy implementation of reverse polarity protection in the circuitry.

Surface Mount: YES

Makes it easier to mount the FET on a PCB, saving space and reducing assembly time.

Minimum DS Breakdown Voltage: 60 V

Provides a high level of voltage protection, making the FET suitable for high-power applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs require only a small gate voltage to turn on, making them efficient for switching applications.

Maximum Pulsed Drain Current (IDM): 290 A

Can handle high current pulses, suitable for power applications that require high peak current handling.

Avalanche Energy Rating (EAS): 88 mJ

Good avalanche energy rating ensures reliable operation in high-energy transient conditions.

Maximum Drain Current (Abs) (ID): 13 A

Able to handle high continuous drain current, suitable for power applications.

No. of Terminals: 5

Provides multiple connection points for easy integration into the circuit.

Maximum Power Dissipation (Abs): 46 W

Can dissipate significant power without overheating, suitable for high-power applications.

Package Style (Meter): SMALL OUTLINE

Compact package style saves space on the PCB and allows for high-density circuit design.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Common and reliable FET technology, providing good performance and stability.

Maximum Operating Temperature: 175 °C

Can operate at high temperatures without performance degradation, suitable for harsh environments.

Transistor Element Material: SILICON

Silicon is a widely used semiconductor material known for its reliability and performance in electronic devices.

Minimum Operating Temperature: -55 °C

Can operate in low-temperature environments, making it versatile for a variety of applications.

Terminal Finish: Matte Tin (Sn) - annealed

Matte tin finish provides good solderability and reliability in solder joints.

Maximum Drain-Source On Resistance: 0.015 ohm

Low on-resistance helps minimize power loss and improve efficiency in power applications.

Terminal Position: DUAL

Dual terminal position allows for flexible connection options in the circuit.

Case Connection: DRAIN

Drain case connection provides convenient mounting and connection options in the circuit.

Maximum Time At Peak Reflow Temperature (s): 30

Short reflow time helps prevent heat damage during assembly process.

Peak Reflow Temperature °C: 260

High reflow temperature ensures reliable solder joints during the assembly process.

Maximum Feedback Capacitance (Crss): 11 pF

Low feedback capacitance minimizes signal distortion in the circuit.

Reference Standard: AEC-Q101

Complies with automotive electronic council standards, ensuring quality and reliability for automotive applications.

Technical Specifications

Power Field Effect Transistors (FET) NVTYS010N06CLTWG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

88 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

13 A

Maximum Drain Current (ID):

13 A

Maximum Drain-Source On Resistance:

.015 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

11 pF

JESD-30 Code:

R-PDSO-X5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

290 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

UNSPECIFIED

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NVTYS010N06CLTWG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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