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NVTYS025P04M8LTWG

Onsemi

NVTYS025P04M8LTWG by Onsemi

NVTYS025P04M8LTWG by Onsemi is a P-CHANNEL FET with 40V DS Breakdown Voltage and 171A IDM. Ideal for power applications, it operates in Enhancement Mode with a max power dissipation of 44.1W. Its small outline package and -55 to 175 °C operating temperature range make it suitable for various electronic designs.

Median Price

$0.992

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 2,900 parts In-Stock

1+ parts

$1.450

100+ parts

$0.627

1k+ parts

$0.454

10k+ parts

$0.380

2,900

$1.450

$0.627

$0.454

$0.380

DigiKey

USA . 1,357 parts In-Stock

1+ parts

$1.540

100+ parts

$0.649

1k+ parts

$0.465

10k+ parts

-

1,357

$1.540

$0.649

$0.465

-

Rochester

USA . 12,791 parts In-Stock

1+ parts

-

100+ parts

$0.515

1k+ parts

$0.428

10k+ parts

$0.381

12,791

-

$0.515

$0.428

$0.381

Verical

USA . 12,791 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.534

10k+ parts

$0.476

12,791

-

-

$0.534

$0.476

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,561 parts In-Stock

1+ parts

$0.401

100+ parts

-

1k+ parts

-

10k+ parts

-

1,561

$0.401

-

-

-

Vyrian

USA . 6,819 parts In-Stock

1+ parts

-

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-

1k+ parts

-

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6,819

-

-

-

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NAC Semi

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.755

6,000

-

-

-

$0.755

Nova Conductors

Japan . 51 parts In-Stock

1+ parts

-

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-

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-

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51

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 6,938 parts In-Stock

1+ parts

$0.359

100+ parts

-

1k+ parts

-

10k+ parts

-

6,938

$0.359

-

-

-

Corphita

USA . 1,730 parts In-Stock

1+ parts

$0.380

100+ parts

-

1k+ parts

-

10k+ parts

-

1,730

$0.380

-

-

-

Corohmni

South Africa . 124 parts In-Stock

1+ parts

$0.422

100+ parts

-

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-

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124

$0.422

-

-

-

Continental Prestige Electronics

USA . 6,382 parts In-Stock

1+ parts

-

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6,382

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-

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Problanco Electronics

Mexico . 4,313 parts In-Stock

1+ parts

-

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4,313

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-

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SupplyDigital Components

Austria . 3,745 parts In-Stock

1+ parts

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3,745

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-

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

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100+ parts

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3,000

-

-

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TANS Electronics

Latvia . 2,827 parts In-Stock

1+ parts

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2,827

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-

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Argo Parts USA

USA . 2,519 parts In-Stock

1+ parts

-

100+ parts

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2,519

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-

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Aranea Global

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,000

-

-

-

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UHIMA Technologies

Türkiye . 259 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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259

-

-

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Kulean Microsystems

USA . 110 parts In-Stock

1+ parts

-

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110

-

-

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-

Overview

Experience the superior quality and reliability of the NVTYS025P04M8LTWG by Onsemi, a leading manufacturer in the Power Field Effect Transistors (FET) category. This P-CHANNEL transistor with a built-in diode offers unmatched performance in a variety of applications. With a minimum DS breakdown voltage of 40V and maximum pulsing drain current of 171A, this transistor is designed to handle high power dissipation with ease. Trust Onsemi for innovative technology and exceptional value that exceeds customer expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Polarity or Channel Type: P-CHANNEL

Offers efficient power handling capabilities and good performance characteristics in various applications.

Minimum DS Breakdown Voltage: 40 V

Ensures reliable operation and protection against voltage spikes, making it suitable for a wide range of power applications.

Maximum Pulsed Drain Current (IDM): 171 A

Capable of handling high current pulses, making it ideal for power switching and motor control applications.

Maximum Power Dissipation (Abs): 44.1 W

Can handle high power dissipation, allowing for efficient performance and thermal management.

Maximum Operating Temperature: 175 °C

Can operate under high temperature conditions, making it suitable for demanding environments.

Maximum Drain-Source On Resistance: 0.025 ohm

Low on-resistance helps to minimize power loss and improve efficiency in power switching applications.

Peak Reflow Temperature °C: 260

Can withstand high reflow temperatures during assembly processes, ensuring reliability and quality.

Reference Standard: AEC-Q101

Meets automotive industry standards for quality and reliability, making it suitable for automotive applications.

Technical Specifications

Power Field Effect Transistors (FET) NVTYS025P04M8LTWG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

67.1 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (ID):

9.4 A

Maximum Drain-Source On Resistance:

.025 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

13 pF

JESD-30 Code:

R-PDSO-X8

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

171 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

UNSPECIFIED

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NVTYS025P04M8LTWG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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