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NVTYS003N04CTWG

Onsemi

NVTYS003N04CTWG by Onsemi

NVTYS003N04CTWG by Onsemi is a Power FET with 40V DS Breakdown Voltage, 740A IDM, and 0.0031 ohm RDS(ON). It's an N-CHANNEL transistor in PLASTIC/EPOXY package for applications requiring high power dissipation and low on-resistance. Ideal for automotive electronics due to AEC-Q101 compliance and 175 °C operating temperature.

Median Price

$1.800

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

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DigiKey

USA . 2,910 parts In-Stock

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$1.800

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$0.770

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$0.558

10k+ parts

$0.456

2,910

$1.800

$0.770

$0.558

$0.456

Distributors (In-Stock)

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Flip Electronics

USA . 200,000 parts In-Stock

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Vyrian

USA . 6,179 parts In-Stock

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Digiode

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Microchip USA

USA . 278 parts In-Stock

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$5.191

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AZTECH Wire

Italy . 487 parts In-Stock

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$13.530

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iodParts Technologies Inc.

India . 200,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 10,780 parts In-Stock

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Problanco Electronics

Mexico . 8,060 parts In-Stock

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Kulean Microsystems

USA . 5,570 parts In-Stock

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SupplyDigital Components

Austria . 3,695 parts In-Stock

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Corphita

USA . 828 parts In-Stock

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UHIMA Technologies

Türkiye . 764 parts In-Stock

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Corohmni

South Africa . 355 parts In-Stock

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TANS Electronics

Latvia . 206 parts In-Stock

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Overview

Unleash the power of innovation with the NVTYS003N04CTWG by Onsemi! Crafted with precision by industry-leading experts, this Power Field Effect Transistor is designed for maximum performance and reliability. Perfect for a wide range of applications, this N-CHANNEL FET offers unrivaled efficiency and durability. Elevate your projects with its single configuration and built-in diode, delivering exceptional value and benefits to customers. Experience the difference with Onsemi's cutting-edge technology and unleash the potential of your designs today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and protection for the internal components of the power FET.

Minimum DS Breakdown Voltage: 40 V

A higher breakdown voltage allows the FET to handle higher voltage applications with more reliability.

Maximum Pulsed Drain Current (IDM): 740 A

High pulsed drain current rating allows the FET to handle large current spikes without getting damaged.

Maximum Power Dissipation (Abs): 68 W

Higher power dissipation rating ensures the FET can handle high power applications without overheating.

Maximum Operating Temperature: 175 °C

With a high operating temperature range, the FET can withstand elevated temperatures without malfunctioning.

Technical Specifications

Power Field Effect Transistors (FET) NVTYS003N04CTWG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

215 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

107 A

Maximum Drain Current (ID):

107 A

Maximum Drain-Source On Resistance:

.0031 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

42 pF

JESD-30 Code:

R-PDSO-X5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

740 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

UNSPECIFIED

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NVTYS003N04CTWG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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