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NVTYS004N03CLTWG

Onsemi

NVTYS004N03CLTWG by Onsemi

NVTYS004N03CLTWG by Onsemi is a Power FET with 30V DS Breakdown Voltage, 369A IDM, and 0.0061 ohm RDS(on). Ideal for automotive applications due to AEC-Q101 standard compliance.

Median Price

$0.535

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 2,965 parts In-Stock

1+ parts

$1.580

100+ parts

$0.668

1k+ parts

$0.479

10k+ parts

$0.380

2,965

$1.580

$0.668

$0.479

$0.380

Rochester

USA . 5,950 parts In-Stock

1+ parts

-

100+ parts

$0.516

1k+ parts

$0.428

10k+ parts

$0.382

5,950

-

$0.516

$0.428

$0.382

Verical

USA . 5,950 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.535

10k+ parts

$0.477

5,950

-

-

$0.535

$0.477

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,451 parts In-Stock

1+ parts

$0.401

100+ parts

-

1k+ parts

-

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1,451

$0.401

-

-

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Vyrian

USA . 974 parts In-Stock

1+ parts

$0.422

100+ parts

-

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-

10k+ parts

-

974

$0.422

-

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-

Flip Electronics

USA . 3,000 parts In-Stock

1+ parts

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3,000

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,263 parts In-Stock

1+ parts

$0.380

100+ parts

-

1k+ parts

-

10k+ parts

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2,263

$0.380

-

-

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Corohmni

South Africa . 62 parts In-Stock

1+ parts

$0.422

100+ parts

-

1k+ parts

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-

62

$0.422

-

-

-

Component Stockers USA

USA . 2,049 parts In-Stock

1+ parts

$0.980

100+ parts

$0.620

1k+ parts

$0.430

10k+ parts

-

2,049

$0.980

$0.620

$0.430

-

Microchip USA

USA . 8,263 parts In-Stock

1+ parts

$4.573

100+ parts

-

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8,263

$4.573

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iodParts Technologies Inc.

India . 144,000 parts In-Stock

1+ parts

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100+ parts

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144,000

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

1+ parts

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10,000

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Kulean Microsystems

USA . 7,215 parts In-Stock

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7,215

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Problanco Electronics

Mexico . 4,793 parts In-Stock

1+ parts

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4,793

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SupplyDigital Components

Austria . 3,887 parts In-Stock

1+ parts

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3,887

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TANS Electronics

Latvia . 717 parts In-Stock

1+ parts

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717

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UHIMA Technologies

Türkiye . 641 parts In-Stock

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641

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Overview

Discover the power of the NVTYS004N03CLTWG by Onsemi, a top-of-the-line Power Field Effect Transistor designed for superior performance and reliability. With its cutting-edge technology and high-quality materials, this N-CHANNEL FET offers exceptional efficiency and versatility in various applications. From enhancing power management systems to optimizing circuit designs, this transistor delivers unbeatable value, benefits, and advantages to customers seeking top-notch solutions. Trust in Onsemi's reputation for excellence and take your projects to the next level with the NVTYS004N03CLTWG.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the FET durable and resistant to external factors, ensuring a longer lifespan.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are known for their high efficiency and fast switching speeds, making them ideal for various power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode enhances the product's performance and provides protection against reverse voltage.

Surface Mount: YES

Being surface mountable makes installation easier and saves space on PCBs.

Minimum DS Breakdown Voltage: 30 V

The high breakdown voltage ensures the FET can handle a range of power supply voltages.

Maximum Pulsed Drain Current (IDM): 369 A

The high pulsed drain current rating allows the FET to handle sudden surges in power without damage.

Maximum Power Dissipation (Abs): 51.5 W

The high power dissipation rating ensures the FET can handle high power loads without overheating.

Maximum Operating Temperature: 175 °C

The high operating temperature range allows the FET to be used in a variety of environments without performance degradation.

Maximum Drain-Source On Resistance: 0.0061 ohm

Low on-resistance leads to less power loss and better efficiency in power applications.

Technical Specifications

Power Field Effect Transistors (FET) NVTYS004N03CLTWG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

121 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

13.3 A

Maximum Drain Current (ID):

21 A

Maximum Drain-Source On Resistance:

.0061 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

26 pF

JESD-30 Code:

R-PDSO-X8

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

369 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

UNSPECIFIED

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NVTYS004N03CLTWG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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