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NVTYD015N04CLT1G

Onsemi

NVTYD015N04CLT1G by Onsemi

NVTYD015N04CLT1G by Onsemi is a Power FET with 40V DS Breakdown Voltage, 29A Drain Current, and 0.025 ohm On Resistance. Ideal for applications requiring high power efficiency in automotive electronics due to AEC-Q101 standard compliance.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Digiode

USA . 1,079 parts In-Stock

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Vyrian

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TANS Electronics

Latvia . 6,409 parts In-Stock

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Problanco Electronics

Mexico . 5,163 parts In-Stock

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Kulean Microsystems

USA . 4,357 parts In-Stock

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SupplyDigital Components

Austria . 3,213 parts In-Stock

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Corphita

USA . 498 parts In-Stock

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UHIMA Technologies

Türkiye . 460 parts In-Stock

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Corohmni

South Africa . 261 parts In-Stock

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Overview

Enhance your power management solutions with the NVTYD015N04CLT1G by Onsemi. This high-quality Power FET offers exceptional performance and reliability, thanks to its innovative design and advanced technology. Perfect for a wide range of applications, this N-channel transistor provides efficient power switching capabilities with a maximum drain current of 29A. Its small outline package and separate configuration make it easy to integrate into your designs. Trust Onsemi for top-notch components that deliver superior value and benefits to meet your power management needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection to the internal components of the FET, ensuring a longer lifespan.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower on-resistance and higher conductivity compared to P-channel FETs, making them more efficient.

Minimum DS Breakdown Voltage: 40 V

Suitable for applications requiring a higher breakdown voltage, ensuring reliable performance.

Maximum Drain Current (ID): 29 A

High drain current rating allows the FET to handle high power applications effectively.

Maximum Drain-Source On Resistance: 0.025 ohm

Low on-resistance results in minimal power loss and improved efficiency in the circuit.

Maximum Operating Temperature: 175 °C

Can operate effectively in high-temperature environments, expanding its range of applications.

Technical Specifications

Power Field Effect Transistors (FET) NVTYD015N04CLT1G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

29 A

Maximum Drain Current (ID):

29 A

Maximum Drain-Source On Resistance:

.025 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

9 pF

JESD-30 Code:

R-PDSO-X6

No. of Elements:

2

No. of Terminals:

6

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Form:

UNSPECIFIED

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Element Material:

SILICON

Trade Compliance

NVTYD015N04CLT1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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