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NVTYS009N08HLTWG

Onsemi

NVTYS009N08HLTWG by Onsemi

NVTYS009N08HLTWG by Onsemi is a Power FET with 80V DS Breakdown Voltage, 300A IDM, and 0.0095 ohm RDS(on). It is used in automotive applications due to AEC-Q101 standard compliance and 175 °C max operating temp.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Digiode

USA . 1,477 parts In-Stock

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Vyrian

USA . 1,439 parts In-Stock

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SupplyDigital Components

Austria . 7,542 parts In-Stock

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Kulean Microsystems

USA . 1,412 parts In-Stock

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TANS Electronics

Latvia . 947 parts In-Stock

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UHIMA Technologies

Türkiye . 570 parts In-Stock

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Problanco Electronics

Mexico . 471 parts In-Stock

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Corohmni

South Africa . 307 parts In-Stock

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Corphita

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Overview

Experience unparalleled quality and performance with the NVTYS009N08HLTWG by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-notch power Field Effect Transistors (FET) with a single configuration and built-in diode for added convenience. Perfect for a wide range of applications, this N-CHANNEL transistor offers customers exceptional value, benefits, and advantages. From its high operating temperature to its low on-resistance, this product is designed to meet all your power needs with efficiency and reliability. Trust Onsemi for superior electronic components that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and protection for the internal components, making the product reliable for long-term use.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower ON-resistance and higher current capabilities compared to P-channel FETs, making this product suitable for high-performance applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and provides reverse polarity protection, enhancing the product's efficiency and safety.

Surface Mount: YES

The surface-mount capability allows for easy and convenient installation on PCBs, saving space and making the product suitable for compact electronic devices.

Minimum DS Breakdown Voltage: 80 V

The high breakdown voltage of 80 V ensures reliable operation in high-voltage circuits, making this product suitable for a wide range of applications.

Package Shape: RECTANGULAR

The rectangular package shape facilitates easy integration into circuit designs and assemblies, providing versatility in usage.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for easier voltage control and higher efficiency in switching applications, making this product energy-efficient.

Maximum Pulsed Drain Current (IDM): 300 A

The high pulsed drain current rating of 300 A enables the product to handle heavy transient loads, making it suitable for high-power applications.

Avalanche Energy Rating (EAS): 271 mJ

The high avalanche energy rating indicates the product's ability to withstand voltage spikes and surges, ensuring protection in harsh environments.

Maximum Drain Current (Abs) (ID): 11 A

The maximum drain current rating of 11 A allows for reliable current flow in normal operating conditions, ensuring stable performance.

No. of Terminals: 5

The 5-terminal design provides flexibility in circuit connections and configurations, allowing for versatile usage in different electronic setups.

Maximum Power Dissipation (Abs): 107 W

The high power dissipation rating of 107 W indicates the product's ability to handle heat dissipation efficiently, ensuring reliable operation under high load conditions.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB, making the product suitable for compact electronic designs where board real estate is limited.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high reliability and performance in FETs, making this product a dependable choice for critical applications.

Maximum Operating Temperature: 175 °C

The high maximum operating temperature of 175 °C ensures the product can withstand elevated temperatures, making it suitable for industrial and automotive applications.

Transistor Element Material: SILICON

Silicon transistors are known for their high efficiency and reliability, making this product a durable and long-lasting choice for various electronic applications.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature of -55 °C allows the product to function reliably in cold environments, expanding its usability in diverse conditions.

Maximum Drain Current (ID): 11 A

The maximum drain current rating of 11 A ensures stable and efficient current flow through the FET, providing reliable operation in different load conditions.

Maximum Drain-Source On Resistance: 0.0095 ohm

The low drain-source on resistance of 0.0095 ohms reduces power losses and improves efficiency in the FET, making it suitable for high-current applications.

Terminal Position: DUAL

The dual terminal position allows for versatile connection options and easier integration into various circuit layouts, providing flexibility in design.

Case Connection: DRAIN

The drain case connection simplifies the grounding and thermal management of the FET, enhancing its reliability and performance in demanding applications.

Maximum Feedback Capacitance (Crss): 10 pF

The low feedback capacitance of 10 pF reduces the risk of oscillations and improves the stability of the FET in high-frequency applications, ensuring reliable performance.

Reference Standard: AEC-Q101

Compliance with the AEC-Q101 standard ensures the FET meets automotive-grade quality and reliability requirements, making it a suitable choice for automotive electronic systems.

Technical Specifications

Power Field Effect Transistors (FET) NVTYS009N08HLTWG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

271 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

80 V

Maximum Drain Current (Abs) (ID):

11 A

Maximum Drain Current (ID):

11 A

Maximum Drain-Source On Resistance:

.0095 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

10 pF

JESD-30 Code:

R-PDSO-X5

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

300 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Form:

UNSPECIFIED

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Element Material:

SILICON

Trade Compliance

NVTYS009N08HLTWG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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