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NVTYS005N06CLTWG

Onsemi

NVTYS005N06CLTWG by Onsemi

NVTYS005N06CLTWG by Onsemi is a Power FET with 60V DS Breakdown Voltage, 430A IDM, and 155mJ EAS. Ideal for applications requiring high power dissipation in small outline packages, such as automotive electronics or industrial control systems.

Median Price

$0.676

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,898 parts In-Stock

1+ parts

-

100+ parts

$0.663

1k+ parts

$0.550

10k+ parts

$0.490

1,898

-

$0.663

$0.550

$0.490

Verical

USA . 1,898 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.688

10k+ parts

$0.613

1,898

-

-

$0.688

$0.613

Distributors (In-Stock)

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Digiode

USA . 1,245 parts In-Stock

1+ parts

$0.515

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-

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1,245

$0.515

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Flip Electronics

USA . 200,000 parts In-Stock

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Vyrian

USA . 7,989 parts In-Stock

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7,989

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Distributors (Availability)

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Corphita

USA . 2,401 parts In-Stock

1+ parts

$0.488

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-

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2,401

$0.488

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Corohmni

South Africa . 287 parts In-Stock

1+ parts

$0.542

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287

$0.542

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Microchip USA

USA . 2,083 parts In-Stock

1+ parts

$5.502

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2,083

$5.502

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AZTECH Wire

Italy . 150 parts In-Stock

1+ parts

$17.520

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150

$17.520

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iodParts Technologies Inc.

India . 200,000 parts In-Stock

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TANS Electronics

Latvia . 7,963 parts In-Stock

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Problanco Electronics

Mexico . 5,597 parts In-Stock

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5,597

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SupplyDigital Components

Austria . 5,048 parts In-Stock

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5,048

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Kulean Microsystems

USA . 4,886 parts In-Stock

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4,886

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UHIMA Technologies

Türkiye . 776 parts In-Stock

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776

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Overview

Discover the power and efficiency of the NVTYS005N06CLTWG by Onsemi, a top-of-the-line Power Field Effect Transistor designed to elevate your electronic projects. With a reputation for quality and reliability, Onsemi delivers a product that exceeds expectations in terms of performance and durability. Whether you're working on automotive applications or industrial systems, this N-CHANNEL FET with a built-in diode offers unmatched value with its high maximum drain current, low drain-source on resistance, and wide operating temperature range. Trust Onsemi to provide the cutting-edge technology you need to take your designs to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection, making the FET suitable for various operating conditions.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower on-resistance and better performance compared to P-channel FETs, making this product efficient.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and can protect against reverse current flow, enhancing the overall functionality of the FET.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation in compact electronic devices, saving space and improving overall design aesthetics.

Maximum Pulsed Drain Current (IDM): 430 A

The high pulsed drain current rating allows the FET to handle large current spikes, making it suitable for applications with high power requirements.

Maximum Power Dissipation (Abs): 76 W

With a high power dissipation rating, this FET can handle significant power levels without overheating, ensuring reliable performance.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high efficiency and switching speeds, making this FET ideal for applications where performance is critical.

Maximum Operating Temperature: 175 °C

The wide operating temperature range allows the FET to function reliably in diverse environments, expanding its potential applications.

Maximum Drain-Source On Resistance: 0.0073 ohm

The low on-resistance results in reduced power losses and improved efficiency, making this FET an excellent choice for high-performance circuits.

Maximum Feedback Capacitance (Crss): 11 pF

The low feedback capacitance helps minimize signal distortion and improve high-frequency performance, making this FET suitable for fast-switching applications.

Technical Specifications

Power Field Effect Transistors (FET) NVTYS005N06CLTWG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

155 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (ID):

18 A

Maximum Drain-Source On Resistance:

.0073 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

11 pF

JESD-30 Code:

R-PDSO-X8

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

430 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

UNSPECIFIED

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NVTYS005N06CLTWG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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