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NVTYS010N04CTWG

Onsemi

NVTYS010N04CTWG by Onsemi

NVTYS010N04CTWG by Onsemi is a Power FET with 40V DS Breakdown Voltage, 163A IDM, and 0.009 ohm RDS(on). Ideal for automotive applications due to AEC-Q101 standard compliance.

Median Price

$0.431

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 2,490 parts In-Stock

1+ parts

$1.350

100+ parts

$0.564

1k+ parts

$0.401

10k+ parts

$0.312

2,490

$1.350

$0.564

$0.401

$0.312

Rochester

USA . 14,940 parts In-Stock

1+ parts

-

100+ parts

$0.416

1k+ parts

$0.345

10k+ parts

$0.307

14,940

-

$0.416

$0.345

$0.307

Verical

USA . 14,940 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.431

10k+ parts

$0.384

14,940

-

-

$0.431

$0.384

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,789 parts In-Stock

1+ parts

$0.339

100+ parts

-

1k+ parts

-

10k+ parts

-

1,789

$0.339

-

-

-

Vyrian

USA . 243 parts In-Stock

1+ parts

$0.357

100+ parts

-

1k+ parts

-

10k+ parts

-

243

$0.357

-

-

-

Flip Electronics

USA . 12,000 parts In-Stock

1+ parts

-

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12,000

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 454 parts In-Stock

1+ parts

$0.321

100+ parts

-

1k+ parts

-

10k+ parts

-

454

$0.321

-

-

-

Corohmni

South Africa . 403 parts In-Stock

1+ parts

$0.357

100+ parts

-

1k+ parts

-

10k+ parts

-

403

$0.357

-

-

-

Component Stockers USA

USA . 2,758 parts In-Stock

1+ parts

$1.280

100+ parts

$0.770

1k+ parts

$0.540

10k+ parts

-

2,758

$1.280

$0.770

$0.540

-

Microchip USA

USA . 6,987 parts In-Stock

1+ parts

$3.799

100+ parts

-

1k+ parts

-

10k+ parts

-

6,987

$3.799

-

-

-

TANS Electronics

Latvia . 6,778 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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6,778

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-

-

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SupplyDigital Components

Austria . 4,449 parts In-Stock

1+ parts

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100+ parts

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4,449

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-

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Problanco Electronics

Mexico . 1,822 parts In-Stock

1+ parts

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100+ parts

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1,822

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-

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Kulean Microsystems

USA . 1,004 parts In-Stock

1+ parts

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100+ parts

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1,004

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-

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UHIMA Technologies

Türkiye . 723 parts In-Stock

1+ parts

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100+ parts

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723

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-

Overview

Experience the superior performance and reliability of the NVTYS010N04CTWG by Onsemi, a leading manufacturer in the power field effect transistor category. This single N-channel FET with a built-in diode offers countless applications and benefits for our customers. With a high operating temperature range, low on-resistance, and high drain current capabilities, this transistor is ideal for a wide range of electronic devices. Trust Onsemi for quality products that deliver exceptional value and performance. Elevate your designs with the NVTYS010N04CTWG.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This lightweight and durable material provides protection for the internal components of the FET, ensuring reliability and longevity.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower ON-resistance and higher mobility, making them efficient for power management applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for reverse voltage protection, preventing damage to the FET and other components in the circuit.

Surface Mount: YES

Surface mount FETs are space-saving, easy to assemble, and suitable for high-density circuit designs.

Maximum Drain-Source On Resistance: 0.009 ohm

Low ON-resistance results in less power dissipation and improved efficiency in power switching applications.

Maximum Power Dissipation (Abs): 30 W

The high power dissipation rating allows the FET to handle high current loads while maintaining stable operation.

Technical Specifications

Power Field Effect Transistors (FET) NVTYS010N04CTWG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

66 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

12 A

Maximum Drain Current (ID):

12 A

Maximum Drain-Source On Resistance:

.009 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

12 pF

JESD-30 Code:

R-PDSO-X5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

163 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

UNSPECIFIED

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NVTYS010N04CTWG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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