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NVTYS007N04CLTWG

Onsemi

NVTYS007N04CLTWG by Onsemi

NVTYS007N04CLTWG by Onsemi is a Power FET with 40V DS Breakdown Voltage, 214A IDM, and 0.012 ohm RDS(ON). Ideal for automotive applications due to AEC-Q101 standard compliance.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Flip Electronics

USA . 200,000 parts In-Stock

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Digiode

USA . 2,379 parts In-Stock

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Vyrian

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Microchip USA

USA . 4,652 parts In-Stock

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iodParts Technologies Inc.

India . 200,000 parts In-Stock

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SupplyDigital Components

Austria . 4,667 parts In-Stock

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TANS Electronics

Latvia . 3,694 parts In-Stock

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Problanco Electronics

Mexico . 2,314 parts In-Stock

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Kulean Microsystems

USA . 1,171 parts In-Stock

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UHIMA Technologies

Türkiye . 362 parts In-Stock

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Corohmni

South Africa . 145 parts In-Stock

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Corphita

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Overview

Unleash the power of innovation with the NVTYS007N04CLTWG by Onsemi. As a leading manufacturer in the field of Power Field Effect Transistors (FET), Onsemi delivers top-notch quality and reliability. This N-CHANNEL transistor with a single configuration and built-in diode offers unparalleled performance in various applications. From consumer electronics to automotive systems, this transistor ensures optimal efficiency and functionality. Experience the value of superior technology with the NVTYS007N04CLTWG by Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and protection to the FET, making it suitable for a variety of applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have faster switching speeds and lower ON resistances compared to P-channel FETs, making them efficient for power applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs require a positive voltage to switch them 'ON', allowing for easier control and use in many electronic circuits.

Maximum Power Dissipation (Abs): 38 W

With a high maximum power dissipation rating, this FET can handle substantial power levels without overheating, ensuring reliability in demanding applications.

Maximum Drain-Source On Resistance: 0.012 ohm

The low ON resistance of 0.012 ohm allows for efficient power flow and minimal voltage drop across the FET, making it ideal for high-current applications.

Technical Specifications

Power Field Effect Transistors (FET) NVTYS007N04CLTWG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

72 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

51 A

Maximum Drain Current (ID):

14 A

Maximum Drain-Source On Resistance:

.012 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-X5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

214 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

UNSPECIFIED

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NVTYS007N04CLTWG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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