Loading...

NVTFS8D1N08HTAG

Onsemi

NVTFS8D1N08HTAG by Onsemi

NVTFS8D1N08HTAG by Onsemi is a Power FET with 80V DS Breakdown Voltage, 216A IDM, and 0.0083 ohm RDS(on). Ideal for automotive applications due to AEC-Q101 compliance.

Median Price

$1.830

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 899 parts In-Stock

1+ parts

$1.830

100+ parts

$0.783

1k+ parts

$0.620

10k+ parts

$0.465

899

$1.830

$0.783

$0.620

$0.465

Flip Electronics (Authorized)

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,573 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,573

-

-

-

-

Flip Electronics

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

Digiode

USA . 1,323 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,323

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 7,786 parts In-Stock

1+ parts

$3.847

100+ parts

-

1k+ parts

-

10k+ parts

-

7,786

$3.847

-

-

-

AZTECH Wire

Italy . 86 parts In-Stock

1+ parts

$9.230

100+ parts

-

1k+ parts

-

10k+ parts

-

86

$9.230

-

-

-

Problanco Electronics

Mexico . 8,162 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,162

-

-

-

-

Kulean Microsystems

USA . 7,031 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,031

-

-

-

-

TANS Electronics

Latvia . 2,424 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,424

-

-

-

-

Corphita

USA . 1,196 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,196

-

-

-

-

SupplyDigital Components

Austria . 496 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

496

-

-

-

-

UHIMA Technologies

Türkiye . 454 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

454

-

-

-

-

Corohmni

South Africa . 326 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

326

-

-

-

-

Overview

Enhance your power management systems with the NVTFS8D1N08HTAG by Onsemi. Crafted with precision and quality by a trusted manufacturer, this N-Channel Power Field Effect Transistor (FET) offers unparalleled performance in a variety of applications. With its built-in diode, small outline package style, and impressive maximum drain current of 61A, this transistor provides reliable power control and efficiency. Trust in Onsemi's expertise and innovation to elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable and lightweight material makes the product suitable for a wide range of applications while also ensuring its longevity.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically offer better performance and efficiency compared to P-channel transistors, making this product a good choice for high-power applications.

Surface Mount: YES

The surface mount capability makes it easier to integrate this FET into compact electronic devices or applications with limited space.

Minimum DS Breakdown Voltage: 80 V

The high breakdown voltage ensures reliable operation and protection against voltage spikes in demanding environments.

Maximum Pulsed Drain Current (IDM): 216 A

The high pulsed drain current rating allows for handling peak power demands without the risk of damage or overheating.

Maximum Power Dissipation (Abs): 75 W

With a high power dissipation rating, this FET can handle significant power loads while maintaining stable performance.

Maximum Operating Temperature: 175 °C

The wide operating temperature range ensures the FET remains reliable and efficient even in harsh environmental conditions.

Technical Specifications

Power Field Effect Transistors (FET) NVTFS8D1N08HTAG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

113 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

80 V

Maximum Drain Current (ID):

61 A

Maximum Drain-Source On Resistance:

.0083 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

46 pF

JESD-30 Code:

S-PDSO-F8

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

216 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NVTFS8D1N08HTAG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20