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NVTFS4C06NTWG

Onsemi

NVTFS4C06NTWG by Onsemi

NVTFS4C06NTWG by Onsemi is a Power FET with 30V DS Breakdown Voltage, 71A Max ID, and 0.0061 ohm RDS(ON). Ideal for automotive applications due to AEC-Q101 standard compliance. Operating in enhancement mode, it offers high power dissipation of 37W in a small outline package.

Median Price

$2.430

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 5,000 parts In-Stock

1+ parts

$2.430

100+ parts

$1.560

1k+ parts

$1.140

10k+ parts

$0.679

5,000

$2.430

$1.560

$1.140

$0.679

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 69 parts In-Stock

1+ parts

$0.783

100+ parts

-

1k+ parts

-

10k+ parts

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69

$0.783

-

-

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Digiode

USA . 1,849 parts In-Stock

1+ parts

$1.482

100+ parts

-

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10k+ parts

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1,849

$1.482

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Flip Electronics

USA . 200,000 parts In-Stock

1+ parts

-

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200,000

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Chip Stock

USA . 39,000 parts In-Stock

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39,000

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Vyrian

USA . 4,822 parts In-Stock

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4,822

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 327 parts In-Stock

1+ parts

$0.752

100+ parts

-

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327

$0.752

-

-

-

Aranea Global

USA . 100 parts In-Stock

1+ parts

$0.767

100+ parts

-

1k+ parts

$0.737

10k+ parts

-

100

$0.767

-

$0.737

-

Continental Prestige Electronics

USA . 4,408 parts In-Stock

1+ parts

$0.783

100+ parts

-

1k+ parts

-

10k+ parts

$0.767

4,408

$0.783

-

-

$0.767

Argo Parts USA

USA . 3,536 parts In-Stock

1+ parts

$0.783

100+ parts

-

1k+ parts

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10k+ parts

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3,536

$0.783

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Ampacity Inc.

Singapore . 4,906 parts In-Stock

1+ parts

$1.330

100+ parts

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1k+ parts

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10k+ parts

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4,906

$1.330

-

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Semicontronic

India . 4,826 parts In-Stock

1+ parts

$1.330

100+ parts

$1.297

1k+ parts

$1.290

10k+ parts

-

4,826

$1.330

$1.297

$1.290

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Aztec Data Supply Inc.

USA . 1,299 parts In-Stock

1+ parts

$1.340

100+ parts

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1,299

$1.340

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Corphita

USA . 1,904 parts In-Stock

1+ parts

$1.404

100+ parts

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1,904

$1.404

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Microchip USA

USA . 5,140 parts In-Stock

1+ parts

$4.296

100+ parts

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5,140

$4.296

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iodParts Technologies Inc.

India . 200,000 parts In-Stock

1+ parts

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200,000

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Kulean Microsystems

USA . 6,835 parts In-Stock

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6,835

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TANS Electronics

Latvia . 6,393 parts In-Stock

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6,393

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Problanco Electronics

Mexico . 6,104 parts In-Stock

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6,104

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Perfect Parts

USA . 3,920 parts In-Stock

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3,920

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

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3,000

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SupplyDigital Components

Austria . 2,012 parts In-Stock

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2,012

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UHIMA Technologies

Türkiye . 135 parts In-Stock

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135

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Overview

Unlock the full potential of your power applications with the NVTFS4C06NTWG by Onsemi. Crafted with precision and expertise, this N-CHANNEL Power FET boasts a single configuration with a built-in diode, offering unparalleled efficiency and reliability. Ideal for a wide range of devices, this FET ensures optimal performance with its high maximum drain current and low on-resistance. Experience the difference with Onsemi's cutting-edge technology and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material offers good resistance to heat and chemicals, making the product durable and reliable in various environments.

Polarity or Channel Type: N-CHANNEL

N-Channel FETs generally have higher mobility and conductivity, making them suitable for high-performance applications.

Minimum DS Breakdown Voltage: 30 V

The high breakdown voltage ensures that the FET can handle higher voltages without breakdown, enhancing the product's reliability.

Maximum Pulsed Drain Current (IDM): 367 A

The high pulsed drain current capability allows the FET to handle large transient currents, making it suitable for power applications.

Maximum Power Dissipation (Abs): 37 W

With a high power dissipation rating, this FET can handle high power levels without overheating, ensuring reliable operation.

Maximum Operating Temperature: 175 °C

The high operating temperature range makes this FET suitable for use in applications where temperature variations are common.

Technical Specifications

Power Field Effect Transistors (FET) NVTFS4C06NTWG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

34 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

71 A

Maximum Drain Current (ID):

71 A

Maximum Drain-Source On Resistance:

.0061 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

S-PDSO-F5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

367 A

Reference Standard:

AEC-Q101

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NVTFS4C06NTWG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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