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NVTFS4C06NTAG

Onsemi

NVTFS4C06NTAG by Onsemi

NVTFS4C06NTAG by Onsemi is a Power FET with 30V DS Breakdown Voltage, 367A IDM, and 0.0061 ohm RDS(on). Ideal for automotive applications due to AEC-Q101 standard compliance. Operating in enhancement mode, it features a single configuration with built-in diode and can handle up to 37W power dissipation.

Median Price

$3.350

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 1,394 parts In-Stock

1+ parts

$2.430

100+ parts

$1.040

1k+ parts

$0.756

10k+ parts

$0.674

1,394

$2.430

$1.040

$0.756

$0.674

Chip1Stop

Japan . 1,400 parts In-Stock

1+ parts

$4.270

100+ parts

$1.790

1k+ parts

$1.150

10k+ parts

-

1,400

$4.270

$1.790

$1.150

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$0.944

100+ parts

-

1k+ parts

-

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50

$0.944

-

-

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Digiode

USA . 746 parts In-Stock

1+ parts

$1.662

100+ parts

-

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-

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746

$1.662

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Chip Stock

USA . 47,000 parts In-Stock

1+ parts

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47,000

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Flip Electronics

USA . 45,000 parts In-Stock

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-

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45,000

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Vyrian

USA . 1,901 parts In-Stock

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-

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1,901

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 336 parts In-Stock

1+ parts

$0.925

100+ parts

-

1k+ parts

-

10k+ parts

-

336

$0.925

-

-

-

Continental Prestige Electronics

USA . 2,141 parts In-Stock

1+ parts

$0.944

100+ parts

-

1k+ parts

-

10k+ parts

$0.925

2,141

$0.944

-

-

$0.925

Argo Parts USA

USA . 1,053 parts In-Stock

1+ parts

$0.944

100+ parts

-

1k+ parts

-

10k+ parts

-

1,053

$0.944

-

-

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Netroflash

USA . 100 parts In-Stock

1+ parts

$0.944

100+ parts

-

1k+ parts

$0.897

10k+ parts

$0.878

100

$0.944

-

$0.897

$0.878

Aztec Data Supply Inc.

USA . 1,018 parts In-Stock

1+ parts

$1.340

100+ parts

-

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1,018

$1.340

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Ampacity Inc.

Singapore . 2,135 parts In-Stock

1+ parts

$1.490

100+ parts

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2,135

$1.490

-

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Semicontronic

India . 1,912 parts In-Stock

1+ parts

$1.490

100+ parts

$1.453

1k+ parts

$1.445

10k+ parts

-

1,912

$1.490

$1.453

$1.445

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Corphita

USA . 743 parts In-Stock

1+ parts

$1.575

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743

$1.575

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Microchip USA

USA . 341 parts In-Stock

1+ parts

$4.845

100+ parts

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341

$4.845

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QUARKTWIN TECHNOLOGY LTD

USA . 28,066 parts In-Stock

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28,066

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Authorized Procurement Solutions

USA . 7,000 parts In-Stock

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7,000

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Problanco Electronics

Mexico . 5,892 parts In-Stock

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5,892

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SupplyDigital Components

Austria . 5,192 parts In-Stock

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5,192

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GreenTree Electronics

Israel . 1,500 parts In-Stock

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1,500

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Kepictronics

USA . 1,183 parts In-Stock

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1,183

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Kulean Microsystems

USA . 1,028 parts In-Stock

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1,028

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UHIMA Technologies

Türkiye . 721 parts In-Stock

1+ parts

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721

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TANS Electronics

Latvia . 18 parts In-Stock

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18

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Overview

Power up your applications with the NVTFS4C06NTAG by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-notch quality and reliability. This N-channel Power FET is designed for enhanced performance and efficiency, making it perfect for a wide range of applications. With its built-in diode and high power dissipation capabilities, this transistor offers unbeatable value and benefits to customers looking for a reliable solution. Upgrade your projects with the NVTFS4C06NTAG and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally have better conductivity and switching speed compared to P-channel FETs, making them ideal for high-performance applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for efficient and safe handling of reverse current, protecting the circuit from damage.

Surface Mount: YES

Easily mountable on circuit boards, saving space and making installation more convenient.

Maximum Pulsed Drain Current (IDM): 367 A

High current rating allows for handling of heavy loads without the risk of overheating or damage.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers improved performance characteristics such as low leakage current and high efficiency.

Maximum Operating Temperature: 175 °C

The high operating temperature range ensures stable performance even in demanding environments.

Minimum Operating Temperature: -55 °C

Wide temperature range allows for usage in both extreme cold and hot conditions.

Technical Specifications

Power Field Effect Transistors (FET) NVTFS4C06NTAG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

34 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

71 A

Maximum Drain Current (ID):

71 A

Maximum Drain-Source On Resistance:

.0061 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

S-PDSO-F5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

367 A

Reference Standard:

AEC-Q101

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NVTFS4C06NTAG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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