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NVTFS5C658NLTAG

Onsemi

NVTFS5C658NLTAG by Onsemi

NVTFS5C658NLTAG by Onsemi is a N-CHANNEL FET with 60V DS Breakdown Voltage, 440A IDM, and 0.073 ohm RDS(ON). Ideal for power applications in automotive industry due to AEC-Q101 standard compliance.

Median Price

$1.092

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 459 parts In-Stock

1+ parts

$0.718

100+ parts

$0.695

1k+ parts

$0.688

10k+ parts

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459

$0.718

$0.695

$0.688

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Chip1Stop

Japan . 700 parts In-Stock

1+ parts

$1.465

100+ parts

$0.956

1k+ parts

$0.646

10k+ parts

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700

$1.465

$0.956

$0.646

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Mouser Electronics

USA . 24,501 parts In-Stock

1+ parts

$2.280

100+ parts

$0.929

1k+ parts

$0.773

10k+ parts

$0.720

24,501

$2.280

$0.929

$0.773

$0.720

Verical

USA . 459 parts In-Stock

1+ parts

-

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$0.695

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$0.688

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459

-

$0.695

$0.688

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 78 parts In-Stock

1+ parts

$0.870

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78

$0.870

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Digiode

USA . 2,225 parts In-Stock

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$1.378

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2,225

$1.378

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Vyrian

USA . 864 parts In-Stock

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864

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Distributors (Availability)

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Corohmni

South Africa . 163 parts In-Stock

1+ parts

$0.629

100+ parts

-

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163

$0.629

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Semicontronic

India . 847 parts In-Stock

1+ parts

$0.790

100+ parts

$0.770

1k+ parts

$0.766

10k+ parts

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847

$0.790

$0.770

$0.766

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Ampacity Inc.

Singapore . 668 parts In-Stock

1+ parts

$0.790

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668

$0.790

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Argo Parts USA

USA . 3,355 parts In-Stock

1+ parts

$0.870

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3,355

$0.870

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Continental Prestige Electronics

USA . 2,144 parts In-Stock

1+ parts

$0.870

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10k+ parts

$0.853

2,144

$0.870

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-

$0.853

Corphita

USA . 1,627 parts In-Stock

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$1.305

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1,627

$1.305

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Aztec Data Supply Inc.

USA . 4,968 parts In-Stock

1+ parts

$1.900

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4,968

$1.900

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Component Stockers USA

USA . 12,610 parts In-Stock

1+ parts

$10.010

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12,610

$10.010

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iodParts Technologies Inc.

India . 200,000 parts In-Stock

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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Kulean Microsystems

USA . 7,735 parts In-Stock

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7,735

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Problanco Electronics

Mexico . 7,637 parts In-Stock

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7,637

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Perfect Parts

USA . 4,939 parts In-Stock

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4,939

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

$0.853

1k+ parts

$0.827

10k+ parts

$0.810

2,000

-

$0.853

$0.827

$0.810

TANS Electronics

Latvia . 1,875 parts In-Stock

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1,875

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Lixinc

USA . 638 parts In-Stock

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638

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SupplyDigital Components

Austria . 537 parts In-Stock

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537

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UHIMA Technologies

Türkiye . 177 parts In-Stock

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177

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Overview

Discover the NVTFS5C658NLTAG by Onsemi, a high-quality Power Field Effect Transistor that offers unmatched performance and reliability. Manufactured by Onsemi, a trusted name in semiconductor technology, this N-CHANNEL FET boasts a built-in diode and operates in enhancement mode for efficient power management. With a minimum DS breakdown voltage of 60V and a maximum drain current of 18A, this transistor is ideal for a wide range of applications requiring precise control and high efficiency. Experience the value and benefits of the NVTFS5C658NLTAG and elevate your projects to new heights with Onsemi's cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good thermal conductivity and mechanical stability, ensuring reliable performance in various applications.

Polarity or Channel Type: N-CHANNEL

Offers higher electron mobility and conductivity compared to P-channel FETs, making it suitable for high-performance applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies circuit design and saves space by integrating a diode within the FET package.

Surface Mount: YES

Allows for easy and efficient PCB assembly, reducing manufacturing costs and time.

Minimum DS Breakdown Voltage: 60 V

Ensures reliable operation under high voltage conditions, making it suitable for a wide range of applications.

Package Shape: SQUARE

Optimizes space utilization on the PCB and allows for efficient heat dissipation.

Terminal Form: FLAT

Provides a stable connection with the PCB, enhancing reliability in harsh operating environments.

Operating Mode: ENHANCEMENT MODE

Allows for easy control of the FET with a low voltage signal, improving efficiency and performance.

Maximum Pulsed Drain Current (IDM): 440 A

Can handle high current surges without damage, making it suitable for power applications.

Avalanche Energy Rating (EAS): 142 mJ

Provides protection against voltage spikes and transient events, increasing the reliability of the system.

No. of Terminals: 8

Offers versatile connectivity options for various circuit configurations and applications.

Package Style (Meter): SMALL OUTLINE

Saves space on the PCB and allows for efficient heat dissipation, enhancing overall system performance.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Provides good switching characteristics, low on-resistance, and high efficiency, making it suitable for power applications.

Maximum Operating Temperature: 175 °C

Can operate in high-temperature environments without performance degradation, ensuring reliable operation under harsh conditions.

Transistor Element Material: SILICON

Offers good thermal stability, high breakdown voltage, and low on-resistance, making it suitable for power applications.

Minimum Operating Temperature: -55 °C

Can operate in low-temperature environments without performance degradation, ensuring reliable operation in extreme conditions.

Terminal Finish: MATTE TIN

Provides good solderability and resistance to corrosion, ensuring reliable electrical connections.

Maximum Drain Current (ID): 18 A

Can handle high continuous currents without damage, making it suitable for power applications.

Maximum Drain-Source On Resistance: 0.073 ohm

Allows for low power dissipation and high efficiency operation, making it suitable for power applications.

Terminal Position: DUAL

Provides flexibility in circuit design and layout, allowing for easy integration into various systems.

Case Connection: DRAIN

Simplifies circuit design and layout by connecting the case to the drain terminal for improved thermal performance.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand high-temperature soldering processes, ensuring reliable solder joints during manufacturing.

Peak Reflow Temperature °C: 260

Can withstand high-temperature soldering processes, ensuring reliable solder joints during manufacturing.

Reference Standard: AEC-Q101

Compliance with automotive industry standards ensures high reliability and quality for automotive applications.

Technical Specifications

Power Field Effect Transistors (FET) NVTFS5C658NLTAG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

142 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (ID):

18 A

Maximum Drain-Source On Resistance:

.073 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

S-PDSO-F8

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

440 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NVTFS5C658NLTAG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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