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NVTFS4C06NWFTAG

Onsemi

NVTFS4C06NWFTAG by Onsemi

NVTFS4C06NWFTAG by Onsemi is a Power FET with 30V DS Breakdown Voltage, 71A Drain Current, and 0.0061 ohm On Resistance. Ideal for automotive applications due to AEC-Q101 standard compliance, it operates in Enhancement Mode with 175°C max temperature and features a built-in diode.

Median Price

$1.029

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 450 parts In-Stock

1+ parts

$1.029

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450

$1.029

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Flip Electronics

USA . 200,000 parts In-Stock

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Chip Stock

USA . 24,000 parts In-Stock

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24,000

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Vyrian

USA . 10,181 parts In-Stock

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10,181

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Digiode

USA . 525 parts In-Stock

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525

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 88 parts In-Stock

1+ parts

$1.009

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88

$1.009

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Continental Prestige Electronics

USA . 4,528 parts In-Stock

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$1.029

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$1.009

4,528

$1.029

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$1.009

Argo Parts USA

USA . 4,164 parts In-Stock

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$1.029

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4,164

$1.029

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Netroflash

USA . 50 parts In-Stock

1+ parts

$1.029

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$1.009

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50

$1.029

$1.009

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Aztec Data Supply Inc.

USA . 4,403 parts In-Stock

1+ parts

$1.280

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4,403

$1.280

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Microchip USA

USA . 5,939 parts In-Stock

1+ parts

$5.543

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5,939

$5.543

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AZTECH Wire

Italy . 345 parts In-Stock

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$5.893

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345

$5.893

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Ampacity Inc.

Singapore . 886 parts In-Stock

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$10.050

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886

$10.050

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Semicontronic

India . 1,104 parts In-Stock

1+ parts

$45.050

100+ parts

$43.924

1k+ parts

$43.698

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1,104

$45.050

$43.924

$43.698

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Perfect Parts

USA . 32,880 parts In-Stock

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32,880

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Lixinc

USA . 12,546 parts In-Stock

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SupplyDigital Components

Austria . 8,303 parts In-Stock

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Kulean Microsystems

USA . 5,680 parts In-Stock

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5,680

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Problanco Electronics

Mexico . 4,979 parts In-Stock

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4,979

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TANS Electronics

Latvia . 3,442 parts In-Stock

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3,442

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UHIMA Technologies

Türkiye . 764 parts In-Stock

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764

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Corphita

USA . 698 parts In-Stock

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698

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Overview

Experience superior power performance with the NVTFS4C06NWFTAG by Onsemi. As a leader in the industry, Onsemi delivers top-quality Power Field Effect Transistors (FET) like no other. This N-CHANNEL transistor offers a single configuration with a built-in diode, providing unmatched reliability and efficiency. Ideal for a range of applications, this product is a game-changer in enhancing your electronic devices. Trust Onsemi's expertise and innovation to elevate your projects to new heights with the NVTFS4C06NWFTAG.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection for the FET, making it suitable for a variety of applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are commonly used for high efficiency and low power consumption, making this FET a good choice for energy-efficient devices.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and protects against reverse current flow, making this FET convenient and reliable.

Surface Mount: YES

The surface mount capability allows for easy and efficient PCB assembly, saving time and reducing production costs.

Minimum DS Breakdown Voltage: 30 V

With a minimum breakdown voltage of 30V, this FET can handle higher voltages, making it suitable for a wide range of applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer high input impedance and easier control of current flow, making this FET ideal for switching applications.

Maximum Pulsed Drain Current (IDM): 367 A

The high pulsed drain current rating allows for handling brief power surges, making this FET suitable for high-power applications.

Avalanche Energy Rating (EAS): 34 mJ

The high avalanche energy rating indicates the FET's ability to withstand transient voltage spikes, ensuring reliability in harsh operating conditions.

Maximum Power Dissipation (Abs): 37 W

The high power dissipation rating enables this FET to handle higher power levels without overheating, making it reliable in demanding environments.

Maximum Operating Temperature: 175 °C

With a high maximum operating temperature, this FET can operate in elevated temperature environments without performance degradation.

Technical Specifications

Power Field Effect Transistors (FET) NVTFS4C06NWFTAG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

34 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

71 A

Maximum Drain Current (ID):

71 A

Maximum Drain-Source On Resistance:

.0061 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

S-PDSO-F5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

367 A

Reference Standard:

AEC-Q101

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NVTFS4C06NWFTAG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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