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NVTFS4C06NWFTWG

Onsemi

NVTFS4C06NWFTWG by Onsemi

NVTFS4C06NWFTWG by Onsemi is a Power FET with 30V DS Breakdown Voltage, 367A IDM, and 0.0061 ohm RDS(on). It is an N-CHANNEL MOSFET suitable for automotive applications due to its AEC-Q101 reference standard certification.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Flip Electronics

USA . 200,000 parts In-Stock

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Chip Stock

USA . 40,000 parts In-Stock

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40,000

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Vyrian

USA . 7,506 parts In-Stock

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7,506

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Digiode

USA . 1,214 parts In-Stock

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1,214

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 3,922 parts In-Stock

1+ parts

$0.740

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3,922

$0.740

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Ampacity Inc.

Singapore . 1,129 parts In-Stock

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$2.050

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$2.050

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Microchip USA

USA . 9,793 parts In-Stock

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$4.969

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9,793

$4.969

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Semicontronic

India . 162 parts In-Stock

1+ parts

$5.050

100+ parts

$4.924

1k+ parts

$4.898

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162

$5.050

$4.924

$4.898

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AZTECH Wire

Italy . 524 parts In-Stock

1+ parts

$12.599

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524

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Problanco Electronics

Mexico . 7,366 parts In-Stock

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TANS Electronics

Latvia . 6,581 parts In-Stock

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Argo Parts USA

USA . 4,157 parts In-Stock

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Perfect Parts

USA . 3,920 parts In-Stock

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Continental Prestige Electronics

USA . 3,340 parts In-Stock

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SupplyDigital Components

Austria . 2,584 parts In-Stock

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Kulean Microsystems

USA . 1,431 parts In-Stock

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Corphita

USA . 911 parts In-Stock

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UHIMA Technologies

Türkiye . 780 parts In-Stock

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780

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Corohmni

South Africa . 325 parts In-Stock

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325

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Bastille Electronics

Australia . 200 parts In-Stock

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200

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Overview

Discover the power of efficiency and reliability with the NVTFS4C06NWFTWG by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Power Field Effect Transistors designed for a variety of applications. With a focus on enhancement mode operation and a built-in diode, this N-Channel transistor offers customers unmatched value and performance. Whether you're working on automotive electronics or industrial machinery, trust Onsemi to provide the innovation and durability you need. Elevate your projects with the NVTFS4C06NWFTWG and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body makes the FET lightweight and durable, ensuring reliable performance in various applications.

Minimum DS Breakdown Voltage: 30 V

With a minimum breakdown voltage of 30 V, this FET is suitable for handling higher power applications while providing protection against voltage spikes.

Maximum Pulsed Drain Current (IDM): 367 A

The high maximum pulsed drain current rating of 367 A allows the FET to handle large current surges without compromising its performance.

Avalanche Energy Rating (EAS): 34 mJ

The avalanche energy rating of 34 mJ indicates that the FET can withstand high energy levels during transient events, ensuring long-term reliability.

Maximum Power Dissipation (Abs): 37 W

The high maximum power dissipation rating of 37 W ensures that the FET can effectively dissipate heat and operate at optimal performance levels under high power conditions.

Maximum Operating Temperature: 175 °C

With a maximum operating temperature of 175°C, this FET can withstand elevated temperatures without experiencing thermal breakdown, making it suitable for demanding environments.

Technical Specifications

Power Field Effect Transistors (FET) NVTFS4C06NWFTWG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

34 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

71 A

Maximum Drain Current (ID):

71 A

Maximum Drain-Source On Resistance:

.0061 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

S-PDSO-F5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

367 A

Reference Standard:

AEC-Q101

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NVTFS4C06NWFTWG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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