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NVTFS4C10NTAG

Onsemi

NVTFS4C10NTAG by Onsemi

NVTFS4C10NTAG by Onsemi is a Power FET with N-CHANNEL polarity, 30V DS Breakdown Voltage, and 196A IDM. Ideal for automotive applications due to AEC-Q101 standard compliance and 175°C max operating temp.

Median Price

$1.700

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,450 parts In-Stock

1+ parts

$1.700

100+ parts

$0.725

1k+ parts

$0.573

10k+ parts

-

1,450

$1.700

$0.725

$0.573

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$0.613

100+ parts

-

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100

$0.613

-

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Digiode

USA . 2,104 parts In-Stock

1+ parts

$1.112

100+ parts

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2,104

$1.112

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Flip Electronics

USA . 40,500 parts In-Stock

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40,500

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Chip Stock

USA . 30,000 parts In-Stock

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30,000

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Vyrian

USA . 1,457 parts In-Stock

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1,457

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Distributors (Availability)

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Advanced Electronics

New Zealand . 20 parts In-Stock

1+ parts

$0.598

100+ parts

$0.598

1k+ parts

$0.598

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-

20

$0.598

$0.598

$0.598

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Corohmni

South Africa . 170 parts In-Stock

1+ parts

$0.601

100+ parts

-

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170

$0.601

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-

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Argo Parts USA

USA . 2,895 parts In-Stock

1+ parts

$0.607

100+ parts

-

1k+ parts

-

10k+ parts

$0.589

2,895

$0.607

-

-

$0.589

Continental Prestige Electronics

USA . 659 parts In-Stock

1+ parts

$0.607

100+ parts

-

1k+ parts

-

10k+ parts

$0.595

659

$0.607

-

-

$0.595

Netroflash

USA . 500 parts In-Stock

1+ parts

$0.613

100+ parts

-

1k+ parts

$0.582

10k+ parts

$0.570

500

$0.613

-

$0.582

$0.570

Ampacity Inc.

Singapore . 1,458 parts In-Stock

1+ parts

$0.990

100+ parts

-

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1,458

$0.990

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Semicontronic

India . 1,446 parts In-Stock

1+ parts

$0.990

100+ parts

$0.965

1k+ parts

$0.960

10k+ parts

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1,446

$0.990

$0.965

$0.960

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Corphita

USA . 752 parts In-Stock

1+ parts

$1.053

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752

$1.053

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Aztec Data Supply Inc.

USA . 298 parts In-Stock

1+ parts

$1.170

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298

$1.170

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Microchip USA

USA . 6,438 parts In-Stock

1+ parts

$3.626

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6,438

$3.626

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iodParts Technologies Inc.

India . 200,000 parts In-Stock

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Lixinc

USA . 6,152 parts In-Stock

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6,152

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Problanco Electronics

Mexico . 4,933 parts In-Stock

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4,933

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Kulean Microsystems

USA . 4,671 parts In-Stock

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4,671

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SupplyDigital Components

Austria . 3,496 parts In-Stock

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3,496

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TANS Electronics

Latvia . 2,277 parts In-Stock

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2,277

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Kepictronics

USA . 1,459 parts In-Stock

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1,459

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UHIMA Technologies

Türkiye . 420 parts In-Stock

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420

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Overview

Experience superior performance and reliability with the NVTFS4C10NTAG Power Field Effect Transistor by Onsemi. Designed with cutting-edge technology and high-quality materials, this N-CHANNEL FET offers enhanced efficiency and control in various applications. With a built-in diode and a maximum drain current of 15.3 A, this transistor provides exceptional power dissipation and performance. Trust Onsemi's reputation for excellence and choose the NVTFS4C10NTAG for your next project to unlock unparalleled value and benefits.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a durable and lightweight housing for the FET, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically offer better performance and efficiency compared to P-channel FETs.

Configuration: SINGLE WITH BUILT-IN DIODE

Built-in diode helps in protecting the circuit from reverse voltage and enhances overall reliability.

Surface Mount: YES

Allows for easy and convenient PCB assembly, saving time and effort.

Minimum DS Breakdown Voltage: 30 V

Provides a suitable level of voltage protection, ensuring the FET can handle various power requirements.

Maximum Pulsed Drain Current (IDM): 196 A

Capable of handling high current pulses, making it suitable for power applications with intermittent high loads.

Maximum Power Dissipation (Abs): 28 W

Can dissipate heat effectively, ensuring stable operation even under high power conditions.

Maximum Operating Temperature: 175 °C

Can operate in high temperature environments without compromising performance.

Maximum Drain-Source On Resistance: 0.0074 ohm

Low on-resistance results in minimal power loss and increased efficiency.

Reference Standard: AEC-Q101

Compliance with automotive quality standards ensures reliability in demanding applications.

Technical Specifications

Power Field Effect Transistors (FET) NVTFS4C10NTAG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

26 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

47 A

Maximum Drain Current (ID):

15.3 A

Maximum Drain-Source On Resistance:

.0074 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

S-PDSO-F5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

196 A

Reference Standard:

AEC-Q101

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NVTFS4C10NTAG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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