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NVMYS003N08LHTWG

Onsemi

NVMYS003N08LHTWG by Onsemi

NVMYS003N08LHTWG by Onsemi is a N-channel Power FET with 80V DS Breakdown Voltage, 132A Drain Current, and 0.0043 ohm On Resistance. Ideal for applications requiring high power dissipation in small outline packages, such as automotive electronics due to AEC-Q101 standard compliance.

Median Price

$2.111

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 2,445 parts In-Stock

1+ parts

$2.960

100+ parts

$1.326

1k+ parts

$1.102

10k+ parts

$0.900

2,445

$2.960

$1.326

$1.102

$0.900

Mouser Electronics

USA . 1,817 parts In-Stock

1+ parts

$2.960

100+ parts

$1.330

1k+ parts

$1.060

10k+ parts

$1.030

1,817

$2.960

$1.330

$1.060

$1.030

Rochester

USA . 8,239 parts In-Stock

1+ parts

-

100+ parts

$1.220

1k+ parts

$1.010

10k+ parts

$0.903

8,239

-

$1.220

$1.010

$0.903

Verical

USA . 8,239 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.262

10k+ parts

$1.129

8,239

-

-

$1.262

$1.129

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,167 parts In-Stock

1+ parts

$0.950

100+ parts

-

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2,167

$0.950

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Vyrian

USA . 742 parts In-Stock

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$1.000

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742

$1.000

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Flip Electronics

USA . 9,000 parts In-Stock

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9,000

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Distributors (Availability)

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Corphita

USA . 909 parts In-Stock

1+ parts

$0.900

100+ parts

-

1k+ parts

-

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909

$0.900

-

-

-

Corohmni

South Africa . 113 parts In-Stock

1+ parts

$1.000

100+ parts

-

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113

$1.000

-

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Microchip USA

USA . 7,341 parts In-Stock

1+ parts

$6.701

100+ parts

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7,341

$6.701

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Problanco Electronics

Mexico . 7,743 parts In-Stock

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7,743

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TANS Electronics

Latvia . 7,482 parts In-Stock

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7,482

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Kulean Microsystems

USA . 2,582 parts In-Stock

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2,582

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SupplyDigital Components

Austria . 454 parts In-Stock

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454

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UHIMA Technologies

Türkiye . 372 parts In-Stock

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372

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Overview

Unleash the power of innovation with the NVMYS003N08LHTWG by Onsemi. This high-quality Power FET offers unparalleled performance and reliability, making it perfect for a wide range of applications. With Onsemi's reputation for excellence in semiconductor technology, you can trust that this N-channel transistor will exceed your expectations. Experience the benefits of enhanced mode operation, built-in diode configuration, and a rugged design that can handle up to 900A of pulsed drain current. Trust Onsemi to deliver cutting-edge solutions that provide maximum value and efficiency for your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body provides durability and protection for the internal components of the Power FET.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower ON-resistance and higher efficiency compared to P-channel FETs, making them a good choice for high-power applications.

Maximum Pulsed Drain Current (IDM): 900 A

The high maximum pulsed drain current rating allows the FET to handle transient high-current demands effectively, making it suitable for power electronics applications.

Maximum Power Dissipation (Abs): 137 W

The high power dissipation capability ensures that the FET can operate reliably under high power loads without overheating.

Maximum Operating Temperature: 175 °C

The high maximum operating temperature range allows the FET to function effectively in harsh environmental conditions without the risk of thermal breakdown.

Technical Specifications

Power Field Effect Transistors (FET) NVMYS003N08LHTWG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

1211 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

80 V

Maximum Drain Current (Abs) (ID):

132 A

Maximum Drain Current (ID):

132 A

Maximum Drain-Source On Resistance:

.0043 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

19 pF

JESD-30 Code:

R-PSSO-G4

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

900 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NVMYS003N08LHTWG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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