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NVMYS1D7N04CTWG

Onsemi

NVMYS1D7N04CTWG by Onsemi

NVMYS1D7N04CTWG by Onsemi is a Power FET with 40V DS Breakdown Voltage, 1237A IDM, and 0.0017 ohm RDS(on). Ideal for automotive applications due to AEC-Q101 standard compliance.

Median Price

$1.657

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,892 parts In-Stock

1+ parts

$2.500

100+ parts

$1.098

1k+ parts

$0.871

10k+ parts

$0.712

1,892

$2.500

$1.098

$0.871

$0.712

Verical

USA . 12,000 parts In-Stock

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$0.814

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$0.814

Distributors (In-Stock)

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Digiode

USA . 1,651 parts In-Stock

1+ parts

$1.615

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1,651

$1.615

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Vyrian

USA . 1,902 parts In-Stock

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$1.700

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1,902

$1.700

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Flip Electronics

USA . 12,000 parts In-Stock

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12,000

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Distributors (Availability)

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Corphita

USA . 462 parts In-Stock

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$1.530

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462

$1.530

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Corohmni

South Africa . 450 parts In-Stock

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$1.700

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450

$1.700

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Microchip USA

USA . 326 parts In-Stock

1+ parts

$7.629

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326

$7.629

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Problanco Electronics

Mexico . 7,363 parts In-Stock

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7,363

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SupplyDigital Components

Austria . 7,144 parts In-Stock

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TANS Electronics

Latvia . 3,658 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Kulean Microsystems

USA . 1,196 parts In-Stock

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1,196

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UHIMA Technologies

Türkiye . 472 parts In-Stock

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472

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Overview

Meet the NVMYS1D7N04CTWG by Onsemi, a top-of-the-line Power Field Effect Transistor that guarantees premium quality and reliability. Manufactured by Onsemi, a trusted industry leader, this N-CHANNEL transistor boasts a single configuration with a built-in diode, making it perfect for a wide range of applications. With a maximum pulsed drain current of 1237 A and an avalanche energy rating of 512 mJ, this transistor offers unmatched performance and efficiency. Say goodbye to overheating and hello to optimal power dissipation with the NVMYS1D7N04CTWG. Upgrade your electronics today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have higher electron mobility and lower on-resistance compared to P-channel FETs, making them more efficient.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and protects against reverse current flow.

Surface Mount: YES

Allows for easier and more efficient PCB assembly.

Minimum DS Breakdown Voltage: 40 V

Ensures reliable operation under high voltage conditions.

Package Shape: RECTANGULAR

Enables compact and space-efficient PCB layout.

Terminal Form: GULL WING

Facilitates easy soldering and PCB mounting.

Operating Mode: ENHANCEMENT MODE

Allows for precise control of the transistor's conductivity and switching speed.

Maximum Pulsed Drain Current (IDM): 1237 A

Suitable for high-power applications that require short pulses of high current.

Avalanche Energy Rating (EAS): 512 mJ

Can withstand high energy spikes and provide protection against voltage transients.

Maximum Power Dissipation (Abs): 107.1 W

High power dissipation capability allows for handling high power loads efficiently.

Package Style (Meter): SMALL OUTLINE

Space-saving package design for compact electronic devices.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Offers good high-frequency performance and low power consumption.

Maximum Operating Temperature: 175 °C

Can operate reliably under high-temperature conditions.

Transistor Element Material: SILICON

Provides good thermal conductivity and stability for long-term performance.

Minimum Operating Temperature: -55 °C

Operates in extreme low-temperature environments.

Maximum Drain Current (ID): 190 A

High drain current rating for handling large loads.

Maximum Drain-Source On Resistance: 0.0017 ohm

Low on-resistance minimizes power loss and heat generation.

Terminal Position: SINGLE

Simplified connection and layout design on the PCB.

Case Connection: DRAIN

Provides easy access to the drain terminal for convenient connection.

Maximum Feedback Capacitance (Crss): 30 pF

Low feedback capacitance for improved high-frequency performance.

Reference Standard: AEC-Q101

Compliance with automotive electronics quality standards for reliability and durability.

Technical Specifications

Power Field Effect Transistors (FET) NVMYS1D7N04CTWG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

512 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (ID):

190 A

Maximum Drain-Source On Resistance:

.0017 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

30 pF

JESD-30 Code:

R-PSSO-G4

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

1237 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Element Material:

SILICON

Trade Compliance

NVMYS1D7N04CTWG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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