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NVMYS2D1N04CLTWG

Onsemi

NVMYS2D1N04CLTWG by Onsemi

NVMYS2D1N04CLTWG by Onsemi is a Power FET with 40V DS Breakdown Voltage, 780A IDM, and 0.0037 ohm RDS(on). It is an N-CHANNEL transistor in PLASTIC/EPOXY package ideal for automotive applications due to AEC-Q101 compliance.

Median Price

$1.825

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,851 parts In-Stock

1+ parts

$2.100

100+ parts

$0.908

1k+ parts

$0.687

10k+ parts

$0.561

1,851

$2.100

$0.908

$0.687

$0.561

Mouser Electronics

USA . 1,403 parts In-Stock

1+ parts

$2.100

100+ parts

$0.909

1k+ parts

$0.674

10k+ parts

$0.642

1,403

$2.100

$0.909

$0.674

$0.642

Rochester

USA . 4,096 parts In-Stock

1+ parts

-

100+ parts

$1.490

1k+ parts

$1.240

10k+ parts

$1.100

4,096

-

$1.490

$1.240

$1.100

Verical

USA . 2,298 parts In-Stock

1+ parts

-

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$1.550

10k+ parts

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2,298

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-

$1.550

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Distributors (In-Stock)

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Digiode

USA . 1,119 parts In-Stock

1+ parts

$0.592

100+ parts

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1,119

$0.592

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Vyrian

USA . 2,482 parts In-Stock

1+ parts

$0.623

100+ parts

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2,482

$0.623

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Flip Electronics

USA . 2,413 parts In-Stock

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2,413

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 841 parts In-Stock

1+ parts

$0.561

100+ parts

-

1k+ parts

-

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841

$0.561

-

-

-

Corohmni

South Africa . 493 parts In-Stock

1+ parts

$0.623

100+ parts

-

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493

$0.623

-

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Component Stockers USA

USA . 2,953 parts In-Stock

1+ parts

$1.510

100+ parts

$0.960

1k+ parts

$0.650

10k+ parts

-

2,953

$1.510

$0.960

$0.650

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Microchip USA

USA . 4,908 parts In-Stock

1+ parts

$6.048

100+ parts

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4,908

$6.048

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iodParts Technologies Inc.

India . 200,000 parts In-Stock

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Problanco Electronics

Mexico . 6,695 parts In-Stock

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6,695

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Kulean Microsystems

USA . 2,556 parts In-Stock

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2,556

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SupplyDigital Components

Austria . 1,687 parts In-Stock

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1,687

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UHIMA Technologies

Türkiye . 876 parts In-Stock

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876

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TANS Electronics

Latvia . 690 parts In-Stock

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690

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Overview

Unleash the power of innovation with the NVMYS2D1N04CLTWG by Onsemi. Crafted with precision and expertise, this Power Field Effect Transistor boasts a robust design that ensures reliability and efficiency. Ideal for a wide range of applications, this N-CHANNEL FET offers unparalleled performance and versatility. Embrace cutting-edge technology without compromising on quality. Elevate your projects with the superior capabilities of the NVMYS2D1N04CLTWG.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and cost-effective.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are commonly used in power electronics and are known for their high efficiency.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode helps protect the circuit from voltage spikes and reverse polarity, improving reliability.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and space.

Maximum Pulsed Drain Current (IDM): 780 A

The high pulsed drain current rating allows for handling sudden surges in power, making it suitable for high-power applications.

Maximum Power Dissipation (Abs): 83 W

The high power dissipation capability ensures the FET can handle high amounts of power without overheating.

Maximum Operating Temperature: 175 °C

The high operating temperature range makes this FET suitable for applications where high temperatures are a concern.

Technical Specifications

Power Field Effect Transistors (FET) NVMYS2D1N04CLTWG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

265 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

132 A

Maximum Drain Current (ID):

132 A

Maximum Drain-Source On Resistance:

.0037 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G4

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

780 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NVMYS2D1N04CLTWG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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