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NVMYS010N04CLTWG

Onsemi

NVMYS010N04CLTWG by Onsemi

N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 28 W; Transistor Element Material: SILICON; Minimum DS Breakdown Voltage: 40 V;

Median Price

$1.380

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 2,035 parts In-Stock

1+ parts

$1.370

100+ parts

$0.571

1k+ parts

$0.406

10k+ parts

$0.316

2,035

$1.370

$0.571

$0.406

$0.316

Mouser Electronics

USA . 1,494 parts In-Stock

1+ parts

$1.380

100+ parts

$0.588

1k+ parts

$0.418

10k+ parts

$0.374

1,494

$1.380

$0.588

$0.418

$0.374

Newark

USA . 2,786 parts In-Stock

1+ parts

$1.500

100+ parts

$0.700

1k+ parts

$0.535

10k+ parts

-

2,786

$1.500

$0.700

$0.535

-

Element14

Singapore . 2,876 parts In-Stock

1+ parts

$1.630

100+ parts

$0.788

1k+ parts

$0.513

10k+ parts

$0.503

2,876

$1.630

$0.788

$0.513

$0.503

Chip1Stop

Japan . 2,900 parts In-Stock

1+ parts

$3.180

100+ parts

$1.060

1k+ parts

$0.689

10k+ parts

-

2,900

$3.180

$1.060

$0.689

-

Future Electronics

Canada . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.290

3,000

-

-

-

$0.290

Farnell

UK . 2,876 parts In-Stock

1+ parts

-

100+ parts

$0.461

1k+ parts

$0.343

10k+ parts

$0.300

2,876

-

$0.461

$0.343

$0.300

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,250 parts In-Stock

1+ parts

$0.388

100+ parts

-

1k+ parts

-

10k+ parts

-

1,250

$0.388

-

-

-

Digiode

USA . 1,853 parts In-Stock

1+ parts

$0.884

100+ parts

-

1k+ parts

-

10k+ parts

-

1,853

$0.884

-

-

-

Flip Electronics

USA . 200,000 parts In-Stock

1+ parts

-

100+ parts

-

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-

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200,000

-

-

-

-

NAC Semi

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.462

6,000

-

-

-

$0.462

IBS Electronics

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.715

3,000

-

-

-

$0.715

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 60 parts In-Stock

1+ parts

$0.388

100+ parts

-

1k+ parts

-

10k+ parts

-

60

$0.388

-

-

-

Corphita

USA . 2,379 parts In-Stock

1+ parts

$0.837

100+ parts

-

1k+ parts

-

10k+ parts

-

2,379

$0.837

-

-

-

Microchip USA

USA . 383 parts In-Stock

1+ parts

$4.420

100+ parts

-

1k+ parts

-

10k+ parts

-

383

$4.420

-

-

-

Component Stockers USA

USA . 24,704 parts In-Stock

1+ parts

$5.040

100+ parts

-

1k+ parts

-

10k+ parts

-

24,704

$5.040

-

-

-

Problanco Electronics

Mexico . 7,926 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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7,926

-

-

-

-

SupplyDigital Components

Austria . 5,478 parts In-Stock

1+ parts

-

100+ parts

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-

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5,478

-

-

-

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TANS Electronics

Latvia . 4,911 parts In-Stock

1+ parts

-

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4,911

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-

-

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Kulean Microsystems

USA . 4,176 parts In-Stock

1+ parts

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4,176

-

-

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,000

-

-

-

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iodParts Technologies Inc.

India . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

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-

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3,000

-

-

-

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UHIMA Technologies

Türkiye . 566 parts In-Stock

1+ parts

-

100+ parts

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566

-

-

-

-

Technical Specifications

Power Field Effect Transistors (FET) NVMYS010N04CLTWG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

62 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

38 A

Maximum Drain Current (ID):

14 A

Maximum Drain-Source On Resistance:

.0176 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G4

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

187 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NVMYS010N04CLTWG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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