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NVMYS016N06CTWG

Onsemi

NVMYS016N06CTWG by Onsemi

NVMYS016N06CTWG by Onsemi is a Power FET with 60V DS Breakdown Voltage, 166A IDM, and 0.016 ohm RDS(ON). Ideal for automotive applications due to AEC-Q101 standard compliance. Enhances performance in power management systems with its N-CHANNEL configuration and built-in diode.

Median Price

$0.472

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 16,791 parts In-Stock

1+ parts

-

100+ parts

$0.463

1k+ parts

$0.385

10k+ parts

$0.343

16,791

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$0.463

$0.385

$0.343

Verical

USA . 16,791 parts In-Stock

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$0.481

10k+ parts

$0.429

16,791

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$0.481

$0.429

Distributors (In-Stock)

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Digiode

USA . 943 parts In-Stock

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$0.361

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943

$0.361

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Vyrian

USA . 1,109 parts In-Stock

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$0.380

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$0.380

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Flip Electronics

USA . 15,000 parts In-Stock

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Corphita

USA . 914 parts In-Stock

1+ parts

$0.342

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914

$0.342

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Corohmni

South Africa . 263 parts In-Stock

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$0.380

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263

$0.380

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TANS Electronics

Latvia . 7,072 parts In-Stock

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Kulean Microsystems

USA . 5,314 parts In-Stock

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SupplyDigital Components

Austria . 3,423 parts In-Stock

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Problanco Electronics

Mexico . 1,451 parts In-Stock

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UHIMA Technologies

Türkiye . 986 parts In-Stock

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Overview

Experience superior performance with the NVMYS016N06CTWG by Onsemi, a top-tier manufacturer known for its quality products. This power FET offers reliability and efficiency, making it ideal for a wide range of applications. Its N-channel configuration and built-in diode provide added convenience, while its small outline package ensures ease of installation. With a maximum pulsing drain current of 166A and an avalanche energy rating of 50mJ, this transistor delivers exceptional power dissipation capabilities. Upgrade your electronics with the NVMYS016N06CTWG and enjoy enhanced functionality and durability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides a good balance between durability and cost-effectiveness.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are known for their high switching speeds and low ON resistance, making them suitable for many high-performance applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and can help protect against reverse voltage spikes.

Surface Mount: YES

Being surface mountable makes this FET easy to integrate into modern PCB designs.

Maximum Pulsed Drain Current (IDM): 166 A

The high pulsed drain current rating allows for reliable operation in high-power applications.

Avalanche Energy Rating (EAS): 50 mJ

The high avalanche energy rating ensures the FET can handle sudden surges in voltage without damage.

Maximum Operating Temperature: 175 °C

The high maximum operating temperature allows for use in harsh environments without risking overheating.

Maximum Drain-Source On Resistance: 0.016 ohm

The low ON resistance helps minimize power losses and improve efficiency in the circuit.

Technical Specifications

Power Field Effect Transistors (FET) NVMYS016N06CTWG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

50 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (ID):

33 A

Maximum Drain-Source On Resistance:

.016 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

7 pF

JESD-30 Code:

R-PSSO-G4

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

166 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Element Material:

SILICON

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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