Loading...

NVMYS011N04CTWG

Onsemi

NVMYS011N04CTWG by Onsemi

NVMYS011N04CTWG by Onsemi is a Power FET with 40V DS Breakdown Voltage, 173A IDM, and 0.012 ohm RDS(on). Ideal for automotive applications due to AEC-Q101 standard compliance. Single N-Channel configuration with built-in diode in a small outline package.

Median Price

$0.922

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 3,000 parts In-Stock

1+ parts

$1.370

100+ parts

$0.571

1k+ parts

$0.405

10k+ parts

$0.373

3,000

$1.370

$0.571

$0.405

$0.373

DigiKey

USA . 2,984 parts In-Stock

1+ parts

$1.370

100+ parts

$0.570

1k+ parts

$0.405

10k+ parts

$0.315

2,984

$1.370

$0.570

$0.405

$0.315

Flip Electronics (Authorized)

USA . 24,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

24,000

-

-

-

-

Rochester

USA . 962 parts In-Stock

1+ parts

-

100+ parts

$0.421

1k+ parts

$0.349

10k+ parts

$0.312

962

-

$0.421

$0.349

$0.312

Verical

USA . 962 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.474

10k+ parts

-

962

-

-

$0.474

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,358 parts In-Stock

1+ parts

$0.327

100+ parts

-

1k+ parts

-

10k+ parts

-

2,358

$0.327

-

-

-

Vyrian

USA . 1,728 parts In-Stock

1+ parts

$0.344

100+ parts

-

1k+ parts

-

10k+ parts

-

1,728

$0.344

-

-

-

Flip Electronics

USA . 42,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

42,000

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,937 parts In-Stock

1+ parts

$0.310

100+ parts

-

1k+ parts

-

10k+ parts

-

1,937

$0.310

-

-

-

Corohmni

South Africa . 126 parts In-Stock

1+ parts

$0.344

100+ parts

-

1k+ parts

-

10k+ parts

-

126

$0.344

-

-

-

Microchip USA

USA . 311 parts In-Stock

1+ parts

$4.370

100+ parts

-

1k+ parts

-

10k+ parts

-

311

$4.370

-

-

-

Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

iodParts Technologies Inc.

India . 2,900 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,900

-

-

-

-

Problanco Electronics

Mexico . 2,439 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,439

-

-

-

-

Kulean Microsystems

USA . 1,860 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,860

-

-

-

-

UHIMA Technologies

Türkiye . 955 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

955

-

-

-

-

TANS Electronics

Latvia . 662 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

662

-

-

-

-

SupplyDigital Components

Austria . 505 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

505

-

-

-

-

Overview

Experience unparalleled power and efficiency with the NVMYS011N04CTWG by Onsemi. As a leading manufacturer in the field of Power FETs, Onsemi delivers top-notch quality and reliability. Ideal for a wide range of applications, this N-channel transistor offers enhanced performance and a built-in diode for added convenience. With a maximum drain current of 35A and an incredibly low on-resistance of 0.012 ohm, this product ensures optimal functionality and durability. Upgrade your power systems today with the NVMYS011N04CTWG and enjoy the benefits of superior technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good thermal and electrical insulation, which can help in preventing overheating and potential short circuits.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower on-state resistance compared to P-channel FETs, making them more efficient for power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for efficient protection against reverse current flow in the circuit, increasing reliability.

Maximum Pulsed Drain Current (IDM): 173 A

High current handling capability allows this FET to be used in applications requiring high power output.

Avalanche Energy Rating (EAS): 75 mJ

This FET can withstand high energy spikes, making it suitable for applications where transient overvoltage protection is needed.

Maximum Power Dissipation (Abs): 28 W

The high power dissipation rating ensures that the FET can handle large power loads without overheating.

Maximum Operating Temperature: 175 °C

The high operating temperature range allows this FET to be used in harsh environmental conditions.

Technical Specifications

Power Field Effect Transistors (FET) NVMYS011N04CTWG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

75 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

35 A

Maximum Drain Current (ID):

13 A

Maximum Drain-Source On Resistance:

.012 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G4

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

173 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NVMYS011N04CTWG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 19