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NVMYS005N10MCLT1G

Onsemi

NVMYS005N10MCLT1G by Onsemi

NVMYS005N10MCLT1G by Onsemi is a N-channel Power FET with 100V DS breakdown voltage, 674A IDM, and 0.005 ohm RDS(on). Ideal for automotive applications due to AEC-Q101 standard compliance.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 2,045 parts In-Stock

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Digiode

USA . 679 parts In-Stock

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Kulean Microsystems

USA . 5,531 parts In-Stock

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TANS Electronics

Latvia . 5,302 parts In-Stock

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SupplyDigital Components

Austria . 2,477 parts In-Stock

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Corphita

USA . 1,893 parts In-Stock

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Problanco Electronics

Mexico . 1,122 parts In-Stock

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UHIMA Technologies

Türkiye . 430 parts In-Stock

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Corohmni

South Africa . 259 parts In-Stock

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Overview

Experience the power of innovation with the NVMYS005N10MCLT1G by Onsemi. This high-quality Power Field Effect Transistor (FET) offers unparalleled performance and reliability, making it ideal for a wide range of applications. With its N-CHANNEL configuration, built-in diode, and small outline package style, this transistor delivers exceptional efficiency and versatility. Trust Onsemi's reputation for excellence and choose the NVMYS005N10MCLT1G for all your power management needs. Unlock new possibilities and unleash the potential of your projects with this superior component.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the FET, ensuring a longer lifespan.

Polarity or Channel Type: N-CHANNEL

Offers efficient operation and high performance in various applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies circuit design and allows for easy integration into existing systems.

Surface Mount: YES

Enables easy and compact PCB assembly, ideal for space-constrained applications.

Minimum DS Breakdown Voltage: 100 V

Ensures reliable operation and protection against voltage spikes.

Maximum Pulsed Drain Current (IDM): 674 A

Suitable for high-power applications where temporary high current levels are required.

Maximum Power Dissipation (Abs): 131 W

Allows for efficient heat dissipation and ensures stable performance under high load conditions.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Provides high switching speeds and low power consumption, making it ideal for energy-efficient designs.

Maximum Operating Temperature: 175 °C

Can withstand high temperature environments, ensuring reliable performance in demanding conditions.

Maximum Drain-Source On Resistance: 0.005 ohm

Offers low conduction losses and efficient power transfer.

Maximum Feedback Capacitance (Crss): 21 pF

Minimizes parasitic capacitance and ensures stable operation at high frequencies.

Reference Standard: AEC-Q101

Complies with automotive industry standards, making it suitable for automotive applications.

Technical Specifications

Power Field Effect Transistors (FET) NVMYS005N10MCLT1G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (Abs) (ID):

109 A

Maximum Drain Current (ID):

109 A

Maximum Drain-Source On Resistance:

.005 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

21 pF

JESD-30 Code:

R-PSSO-G4

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

674 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Element Material:

SILICON

Trade Compliance

NVMYS005N10MCLT1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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