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NVMYS006N08LHTWG

Onsemi

NVMYS006N08LHTWG by Onsemi

NVMYS006N08LHTWG by Onsemi is a N-CHANNEL FET with 80V DS Breakdown Voltage, 449A IDM, and 0.0078 ohm RDS(ON). Ideal for SWITCHING applications in automotive (AEC-Q101) due to its 653mJ EAS rating and -55 to 175 °C operating temperature range.

Median Price

$0.846

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 2,960 parts In-Stock

1+ parts

$2.200

100+ parts

$0.959

1k+ parts

$0.735

10k+ parts

$0.601

2,960

$2.200

$0.959

$0.735

$0.601

Rochester

USA . 18,723 parts In-Stock

1+ parts

-

100+ parts

$0.816

1k+ parts

$0.677

10k+ parts

$0.604

18,723

-

$0.816

$0.677

$0.604

Verical

USA . 12,000 parts In-Stock

1+ parts

-

100+ parts

-

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$0.846

10k+ parts

$0.754

12,000

-

-

$0.846

$0.754

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 288 parts In-Stock

1+ parts

$0.634

100+ parts

-

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288

$0.634

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Vyrian

USA . 1,732 parts In-Stock

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$0.667

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1,732

$0.667

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Flip Electronics

USA . 78,000 parts In-Stock

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78,000

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Distributors (Availability)

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Corphita

USA . 2,418 parts In-Stock

1+ parts

$0.600

100+ parts

-

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2,418

$0.600

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Corohmni

South Africa . 291 parts In-Stock

1+ parts

$0.667

100+ parts

-

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291

$0.667

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Component Stockers USA

USA . 3,727 parts In-Stock

1+ parts

$1.660

100+ parts

$1.160

1k+ parts

$0.750

10k+ parts

-

3,727

$1.660

$1.160

$0.750

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Microchip USA

USA . 7,340 parts In-Stock

1+ parts

$5.095

100+ parts

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7,340

$5.095

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SupplyDigital Components

Austria . 6,409 parts In-Stock

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6,409

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Kulean Microsystems

USA . 4,786 parts In-Stock

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4,786

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TANS Electronics

Latvia . 1,418 parts In-Stock

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1,418

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UHIMA Technologies

Türkiye . 727 parts In-Stock

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727

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Problanco Electronics

Mexico . 403 parts In-Stock

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Overview

Discover the NVMYS006N08LHTWG by Onsemi, a superior Power FET designed for switching applications. With high-quality construction and reliable performance, this N-CHANNEL transistor offers customers unparalleled value and benefits. Its single configuration with built-in diode ensures efficiency, while the enhancement mode operation guarantees optimal functionality. Ideal for various power management tasks, this FET boasts a robust design that can handle demanding requirements with ease. Trust Onsemi for top-of-the-line components that deliver unmatched performance and reliability in every application.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material offers good durability and protection for the transistor, making it suitable for various environmental conditions.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower ON resistance and higher current-carrying capability compared to P-channel FETs, making this transistor suitable for high power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for efficient protection against reverse currents, enhancing the reliability of the transistor in switching applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this transistor offers fast switching speeds and low power loss, making it ideal for power management.

Maximum Power Dissipation (Abs): 89 W

With a high power dissipation rating, this transistor can handle significant amounts of power without overheating, ensuring reliable performance under high load conditions.

Maximum Operating Temperature: 175 °C

The high operating temperature range allows this transistor to be used in a wide range of applications, providing versatility and reliability in various operating environments.

Technical Specifications

Power Field Effect Transistors (FET) NVMYS006N08LHTWG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

653 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

80 V

Maximum Drain Current (Abs) (ID):

77 A

Maximum Drain Current (ID):

77 A

Maximum Drain-Source On Resistance:

.0078 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G4

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

449 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NVMYS006N08LHTWG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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