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NVMYS014N06CLTWG

Onsemi

NVMYS014N06CLTWG by Onsemi

NVMYS014N06CLTWG by Onsemi is a Power FET with 60V DS Breakdown Voltage, 185A IDM, and 0.0215 ohm RDS(on). Ideal for automotive applications due to AEC-Q101 compliance.

Median Price

$0.699

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Newark

USA . 141 parts In-Stock

1+ parts

$0.699

100+ parts

$0.627

1k+ parts

$0.447

10k+ parts

-

141

$0.699

$0.627

$0.447

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Farnell

UK . 141 parts In-Stock

1+ parts

$0.879

100+ parts

$0.429

1k+ parts

$0.328

10k+ parts

-

141

$0.879

$0.429

$0.328

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Element14

Singapore . 1,893 parts In-Stock

1+ parts

$1.270

100+ parts

$1.190

1k+ parts

$1.150

10k+ parts

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1,893

$1.270

$1.190

$1.150

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Verical

USA . 5,849 parts In-Stock

1+ parts

-

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$0.399

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5,849

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-

$0.399

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Rochester

USA . 53 parts In-Stock

1+ parts

-

100+ parts

$0.459

1k+ parts

$0.381

10k+ parts

$0.340

53

-

$0.459

$0.381

$0.340

Distributors (In-Stock)

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Digiode

USA . 828 parts In-Stock

1+ parts

$0.357

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-

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828

$0.357

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Vyrian

USA . 1,386 parts In-Stock

1+ parts

$0.376

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1,386

$0.376

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Flip Electronics

USA . 6,000 parts In-Stock

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6,000

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Distributors (Availability)

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Corphita

USA . 810 parts In-Stock

1+ parts

$0.338

100+ parts

-

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810

$0.338

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-

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Corohmni

South Africa . 230 parts In-Stock

1+ parts

$0.376

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-

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230

$0.376

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Continental Prestige Electronics

USA . 2,249 parts In-Stock

1+ parts

$0.920

100+ parts

$0.640

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-

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2,249

$0.920

$0.640

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Microchip USA

USA . 8,017 parts In-Stock

1+ parts

$4.053

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8,017

$4.053

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Problanco Electronics

Mexico . 5,293 parts In-Stock

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5,293

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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5,000

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TANS Electronics

Latvia . 1,353 parts In-Stock

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1,353

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Kulean Microsystems

USA . 384 parts In-Stock

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384

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UHIMA Technologies

Türkiye . 115 parts In-Stock

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SupplyDigital Components

Austria . 6 parts In-Stock

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6

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Overview

Experience the power of innovation with the NVMYS014N06CLTWG by Onsemi. This high-quality Power Field Effect Transistor offers unparalleled performance and reliability, making it perfect for a wide range of applications. With its N-CHANNEL configuration and built-in diode, this transistor delivers seamless operation and maximum efficiency. Whether you're designing automotive electronics or industrial machinery, this product provides exceptional value, benefits, and advantages that will exceed your expectations. Trust Onsemi to deliver cutting-edge technology that empowers your projects to reach new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides good durability and protection for the internal components of the FET, making it a reliable choice for long-term use.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are known for their high efficiency and fast switching capabilities, making this FET suitable for high-performance applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and provides added protection against voltage spikes, enhancing the overall reliability of the FET.

Surface Mount: YES

Being surface mountable enables easy integration on circuit boards, saving space and facilitating automated assembly processes.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer precise control over the flow of current, making this FET suitable for applications that require accurate power management.

Maximum Pulsed Drain Current (IDM): 185 A

With a high pulsed drain current rating, this FET can handle sudden spikes in current without any issues, ensuring reliable performance under heavy load conditions.

Maximum Power Dissipation (Abs): 37 W

The high power dissipation capability of this FET allows it to efficiently handle power dissipation, reducing the risk of overheating in demanding applications.

Maximum Operating Temperature: 175 °C

The wide operating temperature range ensures that this FET can perform reliably in various environmental conditions without compromising its performance.

Technical Specifications

Power Field Effect Transistors (FET) NVMYS014N06CLTWG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

65 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

36 A

Maximum Drain Current (ID):

12 A

Maximum Drain-Source On Resistance:

.0215 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G4

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

185 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NVMYS014N06CLTWG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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