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NVD5863NLT4G

Onsemi

NVD5863NLT4G by Onsemi

NVD5863NLT4G by Onsemi is a Power FET with 60V DS Breakdown Voltage, 442A IDM, and 0.011 ohm RDS(on). It is an N-CHANNEL transistor in PLASTIC/EPOXY package ideal for power applications requiring high current handling capabilities.

Median Price

$0.440

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,840 parts In-Stock

1+ parts

$0.440

100+ parts

$0.430

1k+ parts

$0.420

10k+ parts

-

1,840

$0.440

$0.430

$0.420

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,078 parts In-Stock

1+ parts

$0.418

100+ parts

-

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2,078

$0.418

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Vyrian

USA . 7,784 parts In-Stock

1+ parts

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7,784

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Distributors (Availability)

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Corphita

USA . 1,532 parts In-Stock

1+ parts

$0.396

100+ parts

-

1k+ parts

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1,532

$0.396

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-

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Corohmni

South Africa . 221 parts In-Stock

1+ parts

$0.440

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-

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221

$0.440

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Component Stockers USA

USA . 4,066 parts In-Stock

1+ parts

$0.620

100+ parts

$9.680

1k+ parts

$9.380

10k+ parts

-

4,066

$0.620

$9.680

$9.380

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AZTECH Wire

Italy . 266 parts In-Stock

1+ parts

$12.370

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266

$12.370

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Perfect Parts

USA . 53,133 parts In-Stock

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53,133

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Kepictronics

USA . 13,000 parts In-Stock

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13,000

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SupplyDigital Components

Austria . 7,673 parts In-Stock

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7,673

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Kulean Microsystems

USA . 5,861 parts In-Stock

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5,861

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Problanco Electronics

Mexico . 3,319 parts In-Stock

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3,319

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A-Z Elektronik GmbH

Germany . 3,000 parts In-Stock

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3,000

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TANS Electronics

Latvia . 1,001 parts In-Stock

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1,001

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UHIMA Technologies

Türkiye . 816 parts In-Stock

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816

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Overview

Unleash the power of innovation with the NVD5863NLT4G by Onsemi! Designed with cutting-edge technology and superior quality materials, this N-CHANNEL Power FET offers unparalleled performance and reliability. Whether you're in need of high-speed switching or efficient power management, this single-configured transistor with a built-in diode is the ideal solution. With a maximum drain current of 13A and a low on-resistance of 0.011 ohm, this FET delivers exceptional value and benefits for a wide range of applications. Upgrade your designs today with the Onsemi NVD5863NLT4G and experience the difference firsthand!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and protection, making the product durable and reliable.

Polarity or Channel Type: N-CHANNEL

N-Channel FETs typically have better performance and are more commonly used in various applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and can provide additional protection for the system.

Surface Mount: YES

Surface mount technology allows for compact and efficient PCB design, saving space and reducing assembly costs.

Minimum DS Breakdown Voltage: 60 V

Having a higher breakdown voltage ensures the FET can withstand higher voltages, making it suitable for a wider range of applications.

Package Shape: RECTANGULAR

Rectangular shape provides easy mounting and handling, facilitating the manufacturing process.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs have better control and efficiency in switching applications.

Maximum Pulsed Drain Current (IDM): 442 A

High current rating allows for handling large current spikes and peak loads without risking damage to the FET.

Avalanche Energy Rating (EAS): 320 mJ

Good avalanche energy rating means the FET can handle high-energy transients safely.

Maximum Drain Current (Abs) (ID): 82 A

High drain current rating ensures the FET can deliver sufficient power in demanding applications.

Maximum Power Dissipation (Abs): 96 W

High power dissipation capability allows the FET to operate at higher power levels without overheating.

Package Style (Meter): SMALL OUTLINE

Small outline package is space-efficient, ideal for compact designs and tight spaces.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology offers high efficiency and fast switching speeds, making it suitable for various applications.

Maximum Operating Temperature: 175 °C

High operating temperature rating ensures the FET can handle elevated temperatures without performance degradation.

Transistor Element Material: SILICON

Silicon-based FETs offer good performance and reliability compared to other materials.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and ensures reliable electrical connections.

Maximum Drain Current (ID): 13 A

Moderate drain current rating makes it suitable for a wide range of low to medium power applications.

Maximum Drain-Source On Resistance: 0.011 ohm

Low on-resistance (RDS(on)) leads to reduced power loss and improved efficiency in the circuit.

Terminal Position: SINGLE

Single terminal position simplifies PCB layout and reduces assembly complexity.

Case Connection: DRAIN

Drain connection simplifies the circuit design and helps in efficient heat dissipation.

Maximum Time At Peak Reflow Temperature (s): 30

Specified time for peak reflow temperature ensures proper soldering and reliable connections during manufacturing.

Peak Reflow Temperature °C: 260

High peak reflow temperature allows for reliable solder joint formation during the assembly process.

Technical Specifications

Power Field Effect Transistors (FET) NVD5863NLT4G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

320 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

82 A

Maximum Drain Current (ID):

13 A

Maximum Drain-Source On Resistance:

.011 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

442 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NVD5863NLT4G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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