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NVD5865NLT4G

Onsemi

NVD5865NLT4G by Onsemi

NVD5865NLT4G by Onsemi is a Power FET with 60V DS Breakdown Voltage, 203A IDM, and 0.019 ohm RDS(on). Ideal for automotive applications due to AEC-Q101 standard compliance. Enhances performance in power management systems with its high current handling capabilities.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Sensible Micro Corp

USA . 8,504 parts In-Stock

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8,504

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Vyrian

USA . 3,240 parts In-Stock

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3,240

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Chip Stock

USA . 2,630 parts In-Stock

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2,630

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Digiode

USA . 843 parts In-Stock

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843

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Nova Conductors

Japan . 500 parts In-Stock

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500

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Distributors (Availability)

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Advanced Electronics

New Zealand . 10 parts In-Stock

1+ parts

$0.325

100+ parts

$0.299

1k+ parts

$0.280

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10

$0.325

$0.299

$0.280

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Aztec Data Supply Inc.

USA . 3,187 parts In-Stock

1+ parts

$0.600

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3,187

$0.600

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AZTECH Wire

Italy . 419 parts In-Stock

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$18.788

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419

$18.788

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Ampacity Inc.

Singapore . 692 parts In-Stock

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$64.050

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692

$64.050

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Perfect Parts

USA . 38,886 parts In-Stock

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38,886

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Kepictronics

USA . 15,000 parts In-Stock

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15,000

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SupplyDigital Components

Austria . 8,163 parts In-Stock

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Problanco Electronics

Mexico . 6,661 parts In-Stock

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Kulean Microsystems

USA . 5,840 parts In-Stock

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Argo Parts USA

USA . 4,917 parts In-Stock

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Continental Prestige Electronics

USA . 2,647 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,291 parts In-Stock

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2,291

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Corphita

USA . 1,830 parts In-Stock

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1,830

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UHIMA Technologies

Türkiye . 567 parts In-Stock

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567

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Futuretech Components

Singapore . 500 parts In-Stock

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500

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Corohmni

South Africa . 327 parts In-Stock

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327

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TANS Electronics

Latvia . 149 parts In-Stock

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149

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Bastille Electronics

Australia . 40 parts In-Stock

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40

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Overview

Experience unparalleled power and efficiency with the NVD5865NLT4G by Onsemi. As a leading manufacturer in the industry, Onsemi guarantees top-notch quality and reliability for all their products. This Power Field Effect Transistor (FET) is the perfect solution for various applications, offering customers exceptional value and performance. Say goodbye to power limitations and hello to limitless possibilities with this innovative product from Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the FET, making it suitable for various operating environments.

Polarity or Channel Type: N-CHANNEL

Allows for efficient current flow and control in electronic circuits, enhancing overall performance.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies circuit design by integrating a diode, reducing space requirements and costs for additional components.

Surface Mount: YES

Enables easy and secure mounting on PCBs, saving time and effort during assembly.

Minimum DS Breakdown Voltage: 60 V

Provides a high voltage tolerance, making the FET suitable for applications requiring reliable operation under varying voltage conditions.

Package Shape: RECTANGULAR

Allows for efficient utilization of space on the PCB, enabling compact design and integration.

Terminal Form: GULL WING

Facilitates easy soldering and connection to the PCB, ensuring secure electrical contact.

Operating Mode: ENHANCEMENT MODE

Enhances the control and efficiency of the FET in electronic circuits, improving overall performance.

Maximum Pulsed Drain Current (IDM): 203 A

Can handle high current pulses effectively, making it suitable for power applications with transient load requirements.

Avalanche Energy Rating (EAS): 36 mJ

Provides protection against avalanche breakdown, ensuring reliable operation in harsh conditions.

Maximum Drain Current (Abs) (ID): 38 A

Can handle high continuous current, making it suitable for power delivery applications.

No. of Terminals: 2

Simplifies circuit connection and integration, reducing complexity in circuit layout.

Maximum Power Dissipation (Abs): 49 W

Can dissipate heat effectively, enabling continuous operation under high power conditions without overheating.

Package Style (Meter): SMALL OUTLINE

Enables compact and space-efficient PCB layout, ideal for applications with limited space constraints.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Provides reliable and efficient performance in electronic circuits, ensuring stable operation over extended periods.

Maximum Operating Temperature: 175 °C

Can operate in high-temperature environments, expanding the range of applications where the FET can be used.

Transistor Element Material: SILICON

Offers excellent electrical properties and reliability, ensuring consistent performance in electronic circuits.

Minimum Operating Temperature: -55 °C

Can operate in low-temperature environments, making it suitable for applications in a wide range of operating conditions.

Terminal Finish: MATTE TIN

Provides a secure and reliable electrical connection, ensuring long-term performance and durability.

Maximum Drain Current (ID): 10 A

Can handle high current levels, making it suitable for power applications with varying load requirements.

Maximum Drain-Source On Resistance: 0.019 ohm

Offers low on-resistance, minimizing power loss and improving efficiency in power delivery applications.

Terminal Position: SINGLE

Simplifies circuit connection and layout, reducing complexity in PCB design.

Case Connection: DRAIN

Provides efficient heat dissipation and electrical connection, ensuring reliable performance under high power conditions.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper soldering and assembly of the FET on the PCB, preventing damage during the manufacturing process.

Peak Reflow Temperature °C: 260

Supports high-temperature soldering processes, ensuring secure and reliable connections during PCB assembly.

Reference Standard: AEC-Q101

Meets automotive industry standards for quality and reliability, making it suitable for automotive applications.

Technical Specifications

Power Field Effect Transistors (FET) NVD5865NLT4G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

36 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

38 A

Maximum Drain Current (ID):

10 A

Maximum Drain-Source On Resistance:

.019 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

203 A

Qualification:

Not Qualified

Reference Standard:

AEC-Q101

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NVD5865NLT4G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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