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NVD5117PLT4G-VF01

Onsemi

NVD5117PLT4G-VF01 by Onsemi

NVD5117PLT4G-VF01 by Onsemi is a P-CHANNEL power FET with a min DS breakdown voltage of 60V. It has a max pulsed drain current of 419A and an avalanche energy rating of 240mJ. This transistor is commonly used in automotive applications due to its AEC-Q101 reference standard and enhanced temperature range (-55°C to 175°C).

Median Price

$2.885

Lifecycle Status

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22

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1k+

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Farnell

UK . 3,303 parts In-Stock

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$3.150

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$1.450

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$1.240

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Newark

USA . 3,066 parts In-Stock

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$1.720

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DigiKey

USA . 3,598 parts In-Stock

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$3.920

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$1.794

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$1.472

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Mouser Electronics

USA . 2,372 parts In-Stock

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Flip Electronics (Authorized)

USA . 24,600 parts In-Stock

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Arrow

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Verical

USA . 9,773 parts In-Stock

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Rochester

USA . 9,773 parts In-Stock

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$1.200

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$1.070

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$1.010

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Element14

Singapore . 2,667 parts In-Stock

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$2.620

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Distributors (In-Stock)

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Digiode

USA . 115 parts In-Stock

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$1.273

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Nova Conductors

Japan . 10 parts In-Stock

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$1.535

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$1.535

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Bristol Electronics

USA . 30 parts In-Stock

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$2.700

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30

$2.700

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Maritex

Poland . 1,132 parts In-Stock

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$2.737

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$1.651

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$1.395

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1,132

$2.737

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Chip Stock

USA . 108,258 parts In-Stock

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Flip Electronics

USA . 30,000 parts In-Stock

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DigiKey Marketplace

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IBS Electronics

USA . 20,000 parts In-Stock

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NAC Semi

USA . 12,500 parts In-Stock

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Vyrian

USA . 11,241 parts In-Stock

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ComSIT Distribution GmbH

Germany . 6,446 parts In-Stock

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Semtec, LLC

USA . 2,500 parts In-Stock

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Microfarads

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Ampacity Inc.

Singapore . 10,898 parts In-Stock

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$0.970

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Semicontronic

India . 11,184 parts In-Stock

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$0.980

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$0.956

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$0.951

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Corohmni

South Africa . 181 parts In-Stock

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Corphita

USA . 1,169 parts In-Stock

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Aranea Global

USA . 100 parts In-Stock

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$1.444

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Continental Prestige Electronics

USA . 6,676 parts In-Stock

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$1.505

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$1.475

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Argo Parts USA

USA . 4,977 parts In-Stock

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Advanced Electronics

New Zealand . 15 parts In-Stock

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$1.558

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15

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Aztec Data Supply Inc.

USA . 1,660 parts In-Stock

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$1.820

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Microchip USA

USA . 7,418 parts In-Stock

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$8.950

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Perfect Parts

USA . 137,166 parts In-Stock

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GreenTree Electronics

Israel . 104,920 parts In-Stock

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iodParts Technologies Inc.

India . 29,370 parts In-Stock

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Lixinc

USA . 16,931 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 7,737 parts In-Stock

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Kulean Microsystems

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SupplyDigital Components

Austria . 5,377 parts In-Stock

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Problanco Electronics

Mexico . 3,023 parts In-Stock

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TANS Electronics

Latvia . 1,960 parts In-Stock

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UHIMA Technologies

Türkiye . 236 parts In-Stock

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Robosynatics

Brazil . 200 parts In-Stock

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Lucentia Tech

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Overview

Introducing the NVD5117PLT4G-VF01 by Onsemi, a high-quality power field effect transistor (FET) that offers numerous advantages for your applications. With its single configuration and built-in diode, this transistor ensures seamless functionality and easy integration. Manufactured by Onsemi, a renowned leader in semiconductor technology, you can trust the reliability and performance of this product. Ideal for various power applications, this transistor provides exceptional value, delivering benefits such as enhanced efficiency and durability. Experience the advantages of the NVD5117PLT4G-VF01 and take your projects to new heights with Onsemi's cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material of this Power FET ensures durability and reliable performance, making it a great choice for various applications.

Polarity or Channel Type: P-CHANNEL

The P-channel configuration of this Power FET allows for efficient power management and excellent switching characteristics, making it suitable for power control applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The single configuration with a built-in diode simplifies circuit design, reduces component count, and enhances overall system efficiency.

Surface Mount: YES

With surface mount capability, this Power FET is easy to integrate into PCB designs, saving space and facilitating automated assembly processes.

Minimum DS Breakdown Voltage: 60 V

With a minimum breakdown voltage of 60V, this Power FET can handle high voltage applications safely, ensuring reliable operation and protection against voltage spikes.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient heat dissipation and easy mounting, ensuring optimal thermal performance.

Terminal Form: GULL WING

The gull-wing terminal form enhances solder joint reliability, making it suitable for applications with high mechanical stress and temperature cycling.

Operating Mode: ENHANCEMENT MODE

The enhancement mode of this Power FET ensures low power consumption and simplifies control circuitry, making it ideal for power-saving applications.

Maximum Pulsed Drain Current (IDM): 419 A

With a high maximum pulsed drain current of 419A, this Power FET can handle high power demands, making it suitable for applications requiring strong power delivery.

Avalanche Energy Rating (EAS): 240 mJ

The high avalanche energy rating of 240mJ allows this Power FET to withstand energy surges, ensuring reliable operation in rugged environments.

No. of Terminals: 2

With only two terminals, this Power FET simplifies circuit design, reduces component count, and improves system reliability.

Package Style (Meter): SMALL OUTLINE

The small outline package style offers space efficiency and compatibility with standard PCB footprints, enabling easy integration into various system designs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

The metal-oxide semiconductor technology used in this Power FET ensures low power consumption, high switching speed, and excellent temperature stability, making it a reliable choice for various applications.

Maximum Operating Temperature: 175 °C

With a maximum operating temperature of 175°C, this Power FET can withstand demanding thermal conditions, ensuring reliable operation even in high-temperature environments.

Transistor Element Material: SILICON

The silicon transistor element material offers high conductivity, low power loss, and enhanced durability, making this Power FET an excellent choice for demanding applications.

Minimum Operating Temperature: -55 °C

With a minimum operating temperature of -55°C, this Power FET can withstand extreme cold environments, making it suitable for a wide range of operating conditions.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin (Sn) annealed terminal finish provides excellent solderability and longevity, ensuring reliable electrical connections over the product's lifespan.

Maximum Drain Current (ID): 11 A

With a maximum drain current of 11A, this Power FET can handle high power flow, making it suitable for applications requiring efficient power management.

Maximum Drain-Source On Resistance: 0.022 ohm

The low maximum drain-source on resistance of 0.022 ohm minimizes power losses and heat dissipation, improving overall system efficiency.

Terminal Position: SINGLE

With a single terminal position, this Power FET simplifies circuit layout and improves assembly efficiency, making it a preferred choice for designs with restricted space.

Case Connection: DRAIN

The case connection to the drain terminal simplifies heat dissipation and allows for efficient thermal management, ensuring reliable operation even in high-power applications.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum time of 30 seconds at the peak reflow temperature, this Power FET can withstand the reflow soldering process, facilitating easy and reliable assembly during PCB manufacturing.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, this Power FET is compatible with standard reflow soldering profiles, making it easy to integrate into existing manufacturing processes.

Reference Standard: AEC-Q101

Compliant with the AEC-Q101 automotive standard, this Power FET meets stringent reliability and quality requirements, making it suitable for automotive applications that demand high performance and durability.

Technical Specifications

Power Field Effect Transistors (FET) NVD5117PLT4G-VF01 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

240 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (ID):

11 A

Maximum Drain-Source On Resistance:

.022 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

419 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NVD5117PLT4G-VF01 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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