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NVD5C684NLT4G

Onsemi

NVD5C684NLT4G by Onsemi

NVD5C684NLT4G by Onsemi is a power FET with a min DS breakdown voltage of 60V and max pulsed drain current of 130A. It is an N-channel transistor with a built-in diode, suitable for enhancement mode applications.

Median Price

$1.458

Lifecycle Status

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19

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1k+

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Mouser Electronics

USA . 3,470 parts In-Stock

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$2.610

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$1.150

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$2.610

$1.150

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DigiKey

USA . 1,187 parts In-Stock

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$2.610

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$1.148

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$0.846

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1,187

$2.610

$1.148

$0.846

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Chip1Stop

Japan . 2,395 parts In-Stock

1+ parts

$5.200

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$2.190

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$1.400

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2,395

$5.200

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$1.400

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Arrow

USA . 37,500 parts In-Stock

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$0.679

37,500

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$0.679

Verical

USA . 2,500 parts In-Stock

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$0.974

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$0.869

2,500

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$0.869

Master Electronics

USA . 2,500 parts In-Stock

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$1.458

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$0.826

10k+ parts

$0.671

2,500

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$1.458

$0.826

$0.671

Rochester

USA . 2,500 parts In-Stock

1+ parts

-

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$0.939

1k+ parts

$0.779

10k+ parts

$0.695

2,500

-

$0.939

$0.779

$0.695

Distributors (In-Stock)

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DF Sales Co.

USA . 5,000 parts In-Stock

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$0.400

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5,000

$0.400

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DF Sales Co.

USA . 5,000 parts In-Stock

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$0.400

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$0.400

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Nova Conductors

Japan . 10 parts In-Stock

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$0.882

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10

$0.882

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Digiode

USA . 74 parts In-Stock

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$1.796

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74

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Chip Stock

USA . 102,477 parts In-Stock

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Flip Electronics

USA . 89,423 parts In-Stock

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Vyrian

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Sensible Micro Corp

USA . 17,008 parts In-Stock

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Cyclops Electronics Ltd

UK . 5,000 parts In-Stock

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IBS Electronics

USA . 2,500 parts In-Stock

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$1.917

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$1.098

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$0.945

2,500

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$1.917

$1.098

$0.945

Bristol Electronics

USA . 2,400 parts In-Stock

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$0.684

1k+ parts

$0.474

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2,400

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$0.684

$0.474

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Dan-Mar Components

USA . 2,400 parts In-Stock

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2,400

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Distributors (Availability)

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Corohmni

South Africa . 445 parts In-Stock

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$0.400

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445

$0.400

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Semicontronic

India . 16,986 parts In-Stock

1+ parts

$0.580

100+ parts

$0.566

1k+ parts

$0.563

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16,986

$0.580

$0.566

$0.563

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Ampacity Inc.

Singapore . 16,940 parts In-Stock

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$0.580

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16,940

$0.580

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Aranea Global

USA . 50 parts In-Stock

1+ parts

$0.864

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$0.830

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50

$0.864

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$0.830

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Argo Parts USA

USA . 3,769 parts In-Stock

1+ parts

$0.882

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3,769

$0.882

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Continental Prestige Electronics

USA . 1,177 parts In-Stock

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$0.882

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$0.864

1,177

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$0.864

Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$0.883

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$0.883

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$0.883

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500

$0.883

$0.883

$0.883

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Aztec Data Supply Inc.

USA . 348 parts In-Stock

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$1.570

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348

$1.570

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Component Stockers USA

USA . 7,711 parts In-Stock

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$1.590

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$1.050

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$0.750

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7,711

$1.590

$1.050

$0.750

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Corphita

USA . 169 parts In-Stock

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$1.701

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Microchip USA

USA . 7,063 parts In-Stock

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Lixinc

USA . 14,225 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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Authorized Procurement Solutions

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Problanco Electronics

Mexico . 7,995 parts In-Stock

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Kulean Microsystems

USA . 5,025 parts In-Stock

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TANS Electronics

Latvia . 4,068 parts In-Stock

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Infinite Electronics LLP (Excess)

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GreenTree Electronics

Israel . 2,495 parts In-Stock

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SupplyDigital Components

Austria . 1,359 parts In-Stock

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UHIMA Technologies

Türkiye . 303 parts In-Stock

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Overview

Discover the NVD5C684NLT4G by Onsemi, a high-quality Power Field Effect Transistor (FET) that offers endless possibilities. With its N-CHANNEL polarity and SINGLE configuration, this product stands out in its category. Its surface mount capability and small outline package shape make it easy to integrate into any application. But what sets this product apart is its exceptional value. It boasts a minimum DS Breakdown Voltage of 60V and a maximum Pulsed Drain Current of 130A, ensuring reliable performance even in demanding conditions. Trust Onsemi's expertise in Metal-Oxide Semiconductor technology and their dedication to producing top-notch products. Say yes to reliability, efficiency, and unparalleled quality - choose the NVD5C684NLT4G today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the power field effect transistor, making it suitable for various applications and environments.

Polarity or Channel Type: N-CHANNEL

The N-channel configuration allows for efficient current flow and low power consumption, making this transistor ideal for power management and switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit designs and provides reverse voltage protection, enhancing the efficiency and reliability of the overall system.

Surface Mount: YES

The surface mount capability allows for easy and efficient assembly on printed circuit boards, saving valuable space and simplifying manufacturing processes.

Minimum DS Breakdown Voltage: 60 V

With a high breakdown voltage, this power field effect transistor can handle higher voltage applications, ensuring reliable performance and protection against voltage spikes.

Package Shape: RECTANGULAR

The rectangular package shape enables space-saving installation and compatibility with standard electronic component placement, facilitating integration into existing systems.

Terminal Form: GULL WING

The gull wing terminal form provides reliable solder connections and secure electrical connections, ensuring stable performance and longevity.

Operating Mode: ENHANCEMENT MODE

The enhancement mode allows for precise control of the transistor's conductivity, resulting in improved efficiency and power handling capabilities.

No. of Elements: 1

The single-element design simplifies circuitry and reduces complexity, making it easier to integrate this power field effect transistor into various electronic systems.

Maximum Pulsed Drain Current (IDM): 130 A

With a high maximum pulsed drain current, this transistor can handle heavy load requirements, making it suitable for power-hungry applications.

No. of Terminals: 2

The two-terminal design simplifies circuit connections and allows for easy integration into various electronic circuits.

Package Style (Meter): SMALL OUTLINE

The small outline package style offers space-saving benefits and compatibility with automated manufacturing processes, increasing efficiency and reducing costs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

The metal-oxide semiconductor technology provides low power consumption, high switching speeds, and excellent thermal stability, making this transistor ideal for high-performance applications.

Transistor Element Material: SILICON

Silicon offers superior electrical properties, high temperature stability, and wide availability, making it a reliable and popular choice for power field effect transistors.

Minimum Operating Temperature: -55 °C

With a minimum operating temperature of -55°C, this transistor can withstand extreme conditions, making it suitable for harsh environments.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin finish enhances solderability and ensures reliable electrical connections, improving the overall performance and longevity of the transistor.

Maximum Drain-Source On Resistance: 0.0245 ohm

This low drain-source on resistance minimizes power losses and improves efficiency in power management applications.

Terminal Position: SINGLE

The single terminal position simplifies circuit layout and ensures proper connection orientation, facilitating ease of use and compatibility.

Moisture Sensitivity Level (MSL): 1

With a moisture sensitivity level of 1, this transistor is highly resistant to moisture and provides superior performance and reliability in humid environments.

Case Connection: DRAIN

The drain connection allows for efficient dissipation of heat, ensuring optimal thermal management and reliability.

Maximum Time At Peak Reflow Temperature (s): 30

This transistor can withstand a maximum time of 30 seconds at the peak reflow temperature, ensuring safe and reliable soldering during manufacturing processes.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, this transistor can withstand typical reflow soldering processes, ensuring reliable manufacturing and assembly.

Reference Standard: AEC-Q101

This transistor complies with the AEC-Q101 automotive qualification standard, guaranteeing its reliability, durability, and suitability for automotive applications.

Technical Specifications

Power Field Effect Transistors (FET) NVD5C684NLT4G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain-Source On Resistance:

.0245 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

130 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NVD5C684NLT4G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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