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NVD5C668NLT4G

Onsemi

NVD5C668NLT4G by Onsemi

NVD5C668NLT4G by Onsemi is a single N-channel power FET with a 60V DS breakdown voltage. It features a max IDM of 250A and an EAS rating of 104mJ, making it suitable for high-power applications in automotive electronics and industrial systems. The device operates in enhancement mode with a low RDS(on) of 0.0128 ohm, offering efficient power management in harsh environments.

Median Price

$0.832

Lifecycle Status

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11

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1k+

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DigiKey

USA . 822 parts In-Stock

1+ parts

$2.720

100+ parts

$1.205

1k+ parts

$0.979

10k+ parts

$0.799

822

$2.720

$1.205

$0.979

$0.799

Mouser Electronics

USA . 99 parts In-Stock

1+ parts

$2.740

100+ parts

$1.260

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$0.979

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$0.926

99

$2.740

$1.260

$0.979

$0.926

RS (Exports)

UK . 19,465 parts In-Stock

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-

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$0.774

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$0.774

Arrow

USA . 7,500 parts In-Stock

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$0.799

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$0.799

Chip1Stop

Japan . 7,500 parts In-Stock

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$0.865

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$0.865

Verical

USA . 7,500 parts In-Stock

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$0.795

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$0.795

Distributors (In-Stock)

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Nova Conductors

Japan . 71 parts In-Stock

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$1.025

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$1.025

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Digiode

USA . 50 parts In-Stock

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$1.814

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$1.814

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Chip Stock

USA . 8,500 parts In-Stock

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Vyrian

USA . 6,697 parts In-Stock

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NAC Semi

USA . 2,500 parts In-Stock

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$1.550

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$1.550

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Aztec Data Supply Inc.

USA . 836 parts In-Stock

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$0.480

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836

$0.480

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Ampacity Inc.

Singapore . 6,583 parts In-Stock

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$0.660

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$0.660

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Corohmni

South Africa . 121 parts In-Stock

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$0.774

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$0.774

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Continental Prestige Electronics

USA . 1,941 parts In-Stock

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$0.783

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$0.406

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$0.251

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$0.783

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Argo Parts USA

USA . 4,102 parts In-Stock

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$1.007

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Semicontronic

India . 7,371 parts In-Stock

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$1.430

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$1.394

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$1.387

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7,371

$1.430

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$1.387

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Corphita

USA . 2,247 parts In-Stock

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$1.719

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$1.719

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Microchip USA

USA . 5,331 parts In-Stock

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$5.949

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$5.949

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Allen Electronics Distributors

USA . 22,475 parts In-Stock

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$0.789

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Lixinc

USA . 19,623 parts In-Stock

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TANS Electronics

Latvia . 6,796 parts In-Stock

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SupplyDigital Components

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A-Z Elektronik GmbH

Germany . 6,174 parts In-Stock

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Kulean Microsystems

USA . 3,674 parts In-Stock

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Problanco Electronics

Mexico . 3,187 parts In-Stock

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UHIMA Technologies

Türkiye . 583 parts In-Stock

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Bastille Electronics

Australia . 50 parts In-Stock

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Overview

Upgrade your power management system with the NVD5C668NLT4G by Onsemi. This N-channel Power FET offers unparalleled quality and reliability, thanks to Onsemi's reputation as a leading manufacturer in the industry. Ideal for a wide range of applications, this transistor provides enhanced performance and efficiency. Say goodbye to power interruptions and hello to seamless operations with the NVD5C668NLT4G. Experience the value and benefits that only Onsemi can deliver.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material provides durability and can withstand high temperatures, making this FET suitable for a variety of applications.

Minimum DS Breakdown Voltage: 60 V

With a minimum breakdown voltage of 60V, this FET ensures reliable performance and protection against overvoltage situations.

Maximum Pulsed Drain Current (IDM): 250 A

A high maximum pulsed drain current rating of 250A allows this FET to handle high current pulses effectively, making it a good choice for power applications.

Maximum Power Dissipation (Abs): 44 W

The high power dissipation rating of 44W indicates the FET's ability to handle power efficiently, making it suitable for high-power applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation offers easier control over the FET's switching characteristics, making it a preferred choice for many designs.

Maximum Drain-Source On Resistance: 0.0128 ohm

The low on-resistance of 0.0128 ohm results in minimal power loss and heat generation in the FET, improving overall efficiency.

Technical Specifications

Power Field Effect Transistors (FET) NVD5C668NLT4G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

104 mJ

Case Connection:

DRAIN

Configuration:

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

49 A

Maximum Drain Current (ID):

49 A

Maximum Drain-Source On Resistance:

.0128 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

18 pF

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

250 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NVD5C668NLT4G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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