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NVD5490NLT4G

Onsemi

NVD5490NLT4G by Onsemi

NVD5490NLT4G by Onsemi is a Power FET with 60V DS Breakdown Voltage, 71A IDM, and 0.085 ohm RDS(on). Ideal for automotive applications due to AEC-Q101 standard compliance.

Median Price

$0.286

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 173,478 parts In-Stock

1+ parts

-

100+ parts

$0.309

1k+ parts

$0.257

10k+ parts

$0.229

173,478

-

$0.309

$0.257

$0.229

Verical

USA . 166,490 parts In-Stock

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$0.286

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$0.286

Flip Electronics (Authorized)

USA . 64,326 parts In-Stock

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64,326

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DigiKey

USA . 62,241 parts In-Stock

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$0.240

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$0.240

Distributors (In-Stock)

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Vyrian

USA . 924 parts In-Stock

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$0.240

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924

$0.240

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Flip Electronics

USA . 64,326 parts In-Stock

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64,326

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Digiode

USA . 246 parts In-Stock

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Bas Electronics GmbH & Co. KG

Germany . 32 parts In-Stock

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Corohmni

South Africa . 178 parts In-Stock

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$0.240

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178

$0.240

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Metaverse IC Inc.

Canada . 50,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 24,064 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,125 parts In-Stock

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Problanco Electronics

Mexico . 5,892 parts In-Stock

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Assy Fe

Spain . 3,947 parts In-Stock

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Kepictronics

USA . 3,531 parts In-Stock

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TANS Electronics

Latvia . 3,169 parts In-Stock

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Perfect Parts

USA . 2,666 parts In-Stock

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Kulean Microsystems

USA . 2,365 parts In-Stock

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SupplyDigital Components

Austria . 1,520 parts In-Stock

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Corphita

USA . 1,118 parts In-Stock

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Futuretech Components

Singapore . 500 parts In-Stock

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UHIMA Technologies

Türkiye . 176 parts In-Stock

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Overview

Elevate your power management capabilities with the NVD5490NLT4G by Onsemi. Crafted with precision and reliability in mind, this N-CHANNEL Power Field Effect Transistor is designed to deliver exceptional performance in a wide range of applications. With a built-in diode and high voltage tolerance, this transistor is a versatile solution for enhancing power efficiency and control. Experience peace of mind knowing that you are investing in a top-tier product from a reputable manufacturer like Onsemi. Upgrade your power systems today with the NVD5490NLT4G and unlock a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the Power FET, ensuring long-term reliability.

Polarity or Channel Type: N-CHANNEL

N-Channel FETs typically have better performance characteristics compared to P-Channel FETs, making this product a good choice for power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode improves efficiency and protects against reverse voltage, making this FET suitable for a wide range of applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs are easier to use in circuit design and offer better controllability, enhancing the overall performance of the product.

Maximum Power Dissipation (Abs): 49 W

With a high power dissipation rating, this FET can handle heavy loads and high power applications effectively.

Maximum Operating Temperature: 175 °C

The high operating temperature range allows for reliable performance in various environmental conditions.

Transistor Element Material: SILICON

Silicon is a commonly used material for transistors due to its high efficiency and reliability, ensuring optimal performance of the FET.

Technical Specifications

Power Field Effect Transistors (FET) NVD5490NLT4G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

41 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

17 A

Maximum Drain Current (ID):

5 A

Maximum Drain-Source On Resistance:

.085 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

71 A

Reference Standard:

AEC-Q101

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NVD5490NLT4G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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