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NVD5818NT4G

Onsemi

NVD5818NT4G by Onsemi

NVD5818NT4G by Onsemi is a Power FET with 40V DS Breakdown Voltage, 125A IDM, and 0.0073 ohm RDS. Ideal for switching applications in automotive electronics due to AEC-Q101 standard compliance and 195mJ EAS rating.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

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Vyrian

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Problanco Electronics

Mexico . 5,080 parts In-Stock

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TANS Electronics

Latvia . 3,890 parts In-Stock

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Kulean Microsystems

USA . 2,664 parts In-Stock

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SupplyDigital Components

Austria . 904 parts In-Stock

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Corphita

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Corohmni

South Africa . 496 parts In-Stock

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UHIMA Technologies

Türkiye . 103 parts In-Stock

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Overview

Unlock the power of efficiency and reliability with the NVD5818NT4G by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-notch quality in Power Field Effect Transistors (FET). This single N-CHANNEL transistor boasts a built-in diode for seamless switching applications. With a high maximum drain current of 70A and low on-resistance, this transistor offers unmatched performance. Whether you're looking to enhance your electronic devices or optimize power management systems, the NVD5818NT4G provides the value and benefits you need to stay ahead of the curve. Elevate your projects with Onsemi's cutting-edge technology today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components, ensuring a longer lifespan for the power FET.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally have better performance characteristics compared to P-channel FETs, making this product suitable for high-performance applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for more efficient switching and can protect the circuit from voltage spikes, making this product a reliable choice for various applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this power FET can handle high currents and voltages with minimal power loss, making it a reliable choice for power management.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and costs for manufacturers.

Maximum Operating Temperature: 175 °C

With a high maximum operating temperature, this power FET can withstand high temperatures without sacrificing performance, ensuring reliability in harsh environments.

Technical Specifications

Power Field Effect Transistors (FET) NVD5818NT4G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

195 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

70 A

Maximum Drain Current (ID):

70 A

Maximum Drain-Source On Resistance:

.0073 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

125 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NVD5818NT4G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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