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NVD5802NT4G

Onsemi

NVD5802NT4G by Onsemi

NVD5802NT4G by Onsemi is a N-CHANNEL FET with 40V DS Breakdown Voltage, ideal for SWITCHING applications. It features a max IDM of 300A and EAS of 240mJ, making it suitable for high-power operations. With a compact SMALL OUTLINE package and 0.0078 ohm RDS(on), it offers efficient performance in various electronic devices.

Median Price

$0.790

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

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DigiKey

USA . 2,813 parts In-Stock

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Vyrian

USA . 807 parts In-Stock

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USA . 2,813 parts In-Stock

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Digiode

USA . 320 parts In-Stock

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Corohmni

South Africa . 435 parts In-Stock

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Perfect Parts

USA . 25,200 parts In-Stock

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Kulean Microsystems

USA . 7,913 parts In-Stock

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TANS Electronics

Latvia . 7,603 parts In-Stock

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Problanco Electronics

Mexico . 2,683 parts In-Stock

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Corphita

USA . 2,439 parts In-Stock

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SupplyDigital Components

Austria . 1,921 parts In-Stock

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UHIMA Technologies

Türkiye . 728 parts In-Stock

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Overview

Unleash the power of innovation with the NVD5802NT4G by Onsemi. This cutting-edge Power Field Effect Transistor boasts unparalleled quality and reliability, making it a top choice for switching applications. With its N-Channel configuration, enhanced mode operation, and built-in diode, this transistor delivers unmatched performance. Whether you're looking to optimize your power management system or enhance your electronic designs, the NVD5802NT4G offers the value, efficiency, and durability that customers demand. Elevate your projects with Onsemi's industry-leading technology and experience the difference firsthand.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection, making the product suitable for various environments.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have higher mobility and lower resistance compared to P-channel FETs, making them more efficient for switching applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring optimal performance in controlling power flow.

Minimum DS Breakdown Voltage: 40 V

With a minimum breakdown voltage of 40V, this FET can handle higher voltage levels, providing a wider range of applications.

Maximum Pulsed Drain Current (IDM): 300 A

Capable of handling high current requirements during peak operations, making it suitable for demanding power applications.

Maximum Power Dissipation (Abs): 93.75 W

With a high power dissipation rating, this FET can effectively manage heat dissipation, ensuring stable performance under heavy loads.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Utilizing MOSFET technology offers high switching speeds, low power consumption, and improved efficiency compared to other technologies.

Maximum Operating Temperature: 175 °C

Capable of operating at high temperatures without performance degradation, ideal for industrial or automotive applications.

Technical Specifications

Power Field Effect Transistors (FET) NVD5802NT4G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

240 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

101 A

Maximum Drain Current (ID):

16.4 A

Maximum Drain-Source On Resistance:

.0078 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

300 A

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NVD5802NT4G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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