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NVD5484NLT4G-VF01

Onsemi

NVD5484NLT4G-VF01 by Onsemi

NVD5484NLT4G-VF01 by Onsemi is a Power FET with 60V DS Breakdown Voltage, 305A IDM, and 0.023 ohm RDS(on). Ideal for automotive applications due to AEC-Q101 standard compliance.

Median Price

$0.680

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 1,478 parts In-Stock

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-

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$0.692

10k+ parts

$0.617

1,478

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$0.692

$0.617

Rochester

USA . 1,478 parts In-Stock

1+ parts

-

100+ parts

$0.667

1k+ parts

$0.554

10k+ parts

$0.494

1,478

-

$0.667

$0.554

$0.494

Distributors (In-Stock)

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ComSIT Distribution GmbH

Germany . 50,000 parts In-Stock

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Vyrian

USA . 4,903 parts In-Stock

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Digiode

USA . 785 parts In-Stock

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785

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AZTECH Wire

Italy . 762 parts In-Stock

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$9.620

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762

$9.620

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Problanco Electronics

Mexico . 5,390 parts In-Stock

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TANS Electronics

Latvia . 4,141 parts In-Stock

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Kulean Microsystems

USA . 4,132 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 2,431 parts In-Stock

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Corphita

USA . 2,315 parts In-Stock

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SupplyDigital Components

Austria . 1,823 parts In-Stock

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Corohmni

South Africa . 420 parts In-Stock

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UHIMA Technologies

Türkiye . 287 parts In-Stock

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Overview

Unleash the power of innovation with the NVD5484NLT4G-VF01 by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Power Field Effect Transistors that are designed for maximum performance and reliability. With applications ranging from automotive to industrial electronics, this N-CHANNEL transistor offers unparalleled value and benefits. Experience enhanced efficiency and superior functionality with the NVD5484NLT4G-VF01, making it the ideal choice for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the FET, ensuring longevity and reliability.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower on-state resistance and faster switching speed compared to P-channel FETs, making them a popular choice for power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for more efficient energy transfer and protection against reverse voltage spikes, making this FET suitable for various power applications.

Surface Mount: YES

Surface mount packaging allows for easy installation on circuit boards, saving space and simplifying assembly processes.

Maximum Pulsed Drain Current (IDM): 305 A

The high pulsed drain current rating indicates that this FET can handle short bursts of high current, making it suitable for applications that require high power output.

Maximum Power Dissipation (Abs): 100 W

With a high power dissipation rating, this FET can effectively handle heat dissipation, ensuring stable performance under heavy load conditions.

Maximum Operating Temperature: 175 °C

The high maximum operating temperature allows this FET to operate in harsh environments with elevated temperatures, increasing its versatility in various applications.

Technical Specifications

Power Field Effect Transistors (FET) NVD5484NLT4G-VF01 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

125 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

54 A

Maximum Drain Current (ID):

54 A

Maximum Drain-Source On Resistance:

.023 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

305 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NVD5484NLT4G-VF01 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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