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NVBG060N090SC1

Onsemi

NVBG060N090SC1 by Onsemi

The Onsemi NVBG060N090SC1 is a N-CHANNEL Power FET with 900V DS Breakdown Voltage, ideal for SWITCHING applications. It features a max IDM of 176A and EAS of 162mJ, making it suitable for high-power operations. With a package style of SMALL OUTLINE and operating temperature range from -55 to 175 °C, it offers reliable performance in various environments.

Median Price

$18.090

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 2,071 parts In-Stock

1+ parts

$18.090

100+ parts

$12.157

1k+ parts

$9.932

10k+ parts

-

2,071

$18.090

$12.157

$9.932

-

Mouser Electronics

USA . 1,003 parts In-Stock

1+ parts

$18.090

100+ parts

$12.130

1k+ parts

$11.360

10k+ parts

-

1,003

$18.090

$12.130

$11.360

-

Chip1Stop

Japan . 640 parts In-Stock

1+ parts

$58.200

100+ parts

$27.600

1k+ parts

$18.700

10k+ parts

-

640

$58.200

$27.600

$18.700

-

Verical

USA . 19,200 parts In-Stock

1+ parts

-

100+ parts

$12.425

1k+ parts

$11.113

10k+ parts

$10.463

19,200

-

$12.425

$11.113

$10.463

Rochester

USA . 19,200 parts In-Stock

1+ parts

-

100+ parts

$9.940

1k+ parts

$8.890

10k+ parts

$8.370

19,200

-

$9.940

$8.890

$8.370

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 126 parts In-Stock

1+ parts

$15.181

100+ parts

-

1k+ parts

-

10k+ parts

-

126

$15.181

-

-

-

Vyrian

USA . 1,455 parts In-Stock

1+ parts

$15.980

100+ parts

-

1k+ parts

-

10k+ parts

-

1,455

$15.980

-

-

-

Flip Electronics

USA . 334,400 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

334,400

-

-

-

-

NAC Semi

USA . 1,600 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$19.100

10k+ parts

$17.630

1,600

-

-

$19.100

$17.630

Cyclops Electronics Ltd

UK . 100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

100

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,436 parts In-Stock

1+ parts

$14.382

100+ parts

-

1k+ parts

-

10k+ parts

-

2,436

$14.382

-

-

-

Corohmni

South Africa . 69 parts In-Stock

1+ parts

$16.850

100+ parts

-

1k+ parts

-

10k+ parts

-

69

$16.850

-

-

-

Microchip USA

USA . 7,740 parts In-Stock

1+ parts

$36.852

100+ parts

-

1k+ parts

-

10k+ parts

-

7,740

$36.852

-

-

-

Perfect Parts

USA . 23,865 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

23,865

-

-

-

-

TANS Electronics

Latvia . 7,776 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,776

-

-

-

-

Problanco Electronics

Mexico . 7,248 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,248

-

-

-

-

SupplyDigital Components

Austria . 4,874 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,874

-

-

-

-

Eastek

USA . 3,200 parts In-Stock

1+ parts

-

100+ parts

$30.560

1k+ parts

-

10k+ parts

-

3,200

-

$30.560

-

-

Kulean Microsystems

USA . 767 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

767

-

-

-

-

UHIMA Technologies

Türkiye . 368 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

368

-

-

-

-

Overview

Unlock the power of efficient switching with the NVBG060N090SC1 by Onsemi. This high-quality Power FET offers a single configuration with a built-in diode, making it perfect for a wide range of applications. With a maximum DS breakdown voltage of 900V and a maximum power dissipation of 211W, this transistor ensures reliable performance and durability. Experience enhanced efficiency and control with the Onsemi NVBG060N090SC1 - your go-to solution for all your switching needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, ideal for applications where weight and durability are important factors.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have better performance characteristics compared to P-channel FETs, making this product a good choice for high-performance applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies the circuit design and can provide added protection, making this product more versatile and cost-effective.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers fast switching speeds and low on-resistance, ideal for high-frequency switching circuits.

Surface Mount: YES

Being surface-mount compatible allows for easier and more efficient PCB assembly, making this product suitable for automated manufacturing processes.

Minimum DS Breakdown Voltage: 900 V

With a high breakdown voltage, this FET can handle high voltage applications with ease, offering reliability and robustness.

Maximum Pulsed Drain Current (IDM): 176 A

The high pulsed drain current capability makes this FET suitable for applications requiring high peak currents, providing flexibility and reliability.

Maximum Power Dissipation (Abs): 211 W

With a high power dissipation rating, this FET can handle high power levels without overheating, ensuring reliable operation in demanding conditions.

Maximum Operating Temperature: 175 °C

The high operating temperature range makes this FET suitable for applications where elevated temperatures are present, ensuring stable performance in harsh environments.

Technical Specifications

Power Field Effect Transistors (FET) NVBG060N090SC1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Additional Features:

AVALANCHE RATED

Avalanche Energy Rating (EAS):

162 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

900 V

Maximum Drain Current (Abs) (ID):

44 A

Maximum Drain Current (ID):

44 A

Maximum Drain-Source On Resistance:

.084 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G7

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

7

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

245

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

176 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

94 ns

Maximum Turn On Time (ton):

106 ns

Trade Compliance

NVBG060N090SC1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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