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NVBG015N065SC1

Onsemi

NVBG015N065SC1 by Onsemi

NVBG015N065SC1 by Onsemi is a N-CHANNEL FET with 650V DS Breakdown Voltage, ideal for SWITCHING applications. It features 873A IDM, 867W Power Dissipation, and operates in ENHANCEMENT MODE. With SILICON CARBIDE element material and -55 to 175 °C operating temperature range, it offers high performance in various power applications.

Median Price

$36.190

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 471 parts In-Stock

1+ parts

$36.190

100+ parts

-

1k+ parts

$23.891

10k+ parts

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471

$36.190

-

$23.891

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Mouser Electronics

USA . 454 parts In-Stock

1+ parts

$36.190

100+ parts

$29.090

1k+ parts

$27.310

10k+ parts

-

454

$36.190

$29.090

$27.310

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Chip1Stop

Japan . 3,075 parts In-Stock

1+ parts

$121.000

100+ parts

$60.100

1k+ parts

$39.900

10k+ parts

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3,075

$121.000

$60.100

$39.900

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Rochester

USA . 18,000 parts In-Stock

1+ parts

-

100+ parts

$23.890

1k+ parts

$21.380

10k+ parts

$20.120

18,000

-

$23.890

$21.380

$20.120

Verical

USA . 18,000 parts In-Stock

1+ parts

-

100+ parts

$29.863

1k+ parts

$26.725

10k+ parts

$25.150

18,000

-

$29.863

$26.725

$25.150

Distributors (In-Stock)

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Digiode

USA . 641 parts In-Stock

1+ parts

$25.222

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641

$25.222

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Vyrian

USA . 256 parts In-Stock

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$26.550

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256

$26.550

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Flip Electronics

USA . 219,200 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 1,805 parts In-Stock

1+ parts

$23.895

100+ parts

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1,805

$23.895

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Corohmni

South Africa . 200 parts In-Stock

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$26.550

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200

$26.550

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Microchip USA

USA . 7,106 parts In-Stock

1+ parts

$85.336

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7,106

$85.336

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QUARKTWIN TECHNOLOGY LTD

USA . 22,353 parts In-Stock

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Problanco Electronics

Mexico . 6,687 parts In-Stock

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6,687

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TANS Electronics

Latvia . 4,338 parts In-Stock

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4,338

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Kulean Microsystems

USA . 4,073 parts In-Stock

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4,073

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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GreenTree Electronics

Israel . 2,380 parts In-Stock

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2,380

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SupplyDigital Components

Austria . 1,097 parts In-Stock

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1,097

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UHIMA Technologies

Türkiye . 579 parts In-Stock

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579

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Overview

Power up your devices with the NVBG015N065SC1 by Onsemi, a high-quality Power Field Effect Transistor designed for switching applications. Manufactured with precision and expertise, this N-CHANNEL transistor offers unmatched performance and reliability. With a minimum DS breakdown voltage of 650V and maximum power dissipation of 867W, this transistor is perfect for demanding applications. Say goodbye to overheating and inefficiency with the NVBG015N065SC1 - the ultimate solution for all your power needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body provides durability and resistance to external elements, making it a reliable choice for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower ON-resistance and higher efficiency compared to P-channel FETs, making them suitable for high-performance switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Having a built-in diode simplifies circuit design and protects the transistor from reverse voltage spikes, enhancing overall performance and reliability.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers fast switching times and low power consumption, making it ideal for power management systems.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly onto PCBs, saving space and improving thermal performance.

Minimum DS Breakdown Voltage: 650 V

With a high breakdown voltage, this FET can handle high voltage applications without breakdown, ensuring reliability and safety.

Maximum Pulsed Drain Current (IDM): 873 A

The high pulsed drain current capability makes this FET suitable for high-power and transient load applications where high current surges are expected.

Maximum Power Dissipation (Abs): 867 W

The high power dissipation rating allows the FET to handle high power levels without overheating, ensuring long-term reliability in demanding conditions.

Maximum Operating Temperature: 175 °C

With a high maximum operating temperature, this FET can perform reliably in high-temperature environments without risking damage or performance degradation.

Maximum Drain Current (ID): 176 A

The high drain current rating allows the FET to handle significant current loads, making it suitable for high-power applications.

Technical Specifications

Power Field Effect Transistors (FET) NVBG015N065SC1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

650 V

Maximum Drain Current (ID):

176 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-263CB

JESD-30 Code:

R-PSSO-G7

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

7

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

873 A

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON CARBIDE

Trade Compliance

NVBG015N065SC1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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