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NVBG060N065SC1

Onsemi

NVBG060N065SC1 by Onsemi

NVBG060N065SC1 by Onsemi is a Power FET with 650V DS Breakdown Voltage, 231A IDM, and 344W Power Dissipation. Ideal for high-power applications in industries like automotive, renewable energy, and industrial equipment due to its N-CHANNEL configuration and SILICON CARBIDE material.

Median Price

$17.580

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

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Mouser Electronics

USA . 800 parts In-Stock

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$16.690

100+ parts

$11.230

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$10.200

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800

$16.690

$11.230

$10.200

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DigiKey

USA . 1,576 parts In-Stock

1+ parts

$18.470

100+ parts

$12.489

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$10.203

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1,576

$18.470

$12.489

$10.203

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Distributors (In-Stock)

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Vyrian

USA . 6,217 parts In-Stock

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Flip Electronics

USA . 1,600 parts In-Stock

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Digiode

USA . 195 parts In-Stock

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195

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Corohmni

South Africa . 420 parts In-Stock

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$11.954

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420

$11.954

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Microchip USA

USA . 2,168 parts In-Stock

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$35.437

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2,168

$35.437

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Problanco Electronics

Mexico . 7,347 parts In-Stock

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SupplyDigital Components

Austria . 3,908 parts In-Stock

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Corphita

USA . 1,604 parts In-Stock

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TANS Electronics

Latvia . 1,564 parts In-Stock

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Kulean Microsystems

USA . 1,554 parts In-Stock

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UHIMA Technologies

Türkiye . 523 parts In-Stock

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523

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Overview

Unleash the power of innovation with the NVBG060N065SC1 by Onsemi. As a leader in Power Field Effect Transistors, Onsemi guarantees top-quality products that deliver unrivaled performance and reliability. Ideal for a wide range of applications, this N-CHANNEL FET offers a single configuration with a built-in diode, making it a versatile solution for your power needs. With a maximum DS Breakdown Voltage of 650V and a maximum Drain Current of 57.5A, this transistor ensures optimal efficiency and durability. Elevate your projects with the NVBG060N065SC1 and experience superior quality like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the FET, making it suitable for various environments.

Polarity or Channel Type: N-CHANNEL

N-Channel FETs are known for their high efficiency and low on-resistance, making this product efficient in power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for convenient circuit design and ensures better performance in rectification applications.

Minimum DS Breakdown Voltage: 650 V

With a high breakdown voltage, this FET can handle high voltages with reliability and safety.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB mounting, saving space and improving overall system performance.

Maximum Pulsed Drain Current (IDM): 231 A

High pulsed drain current capability makes this FET suitable for applications requiring short bursts of high power.

Maximum Power Dissipation (Abs): 344 W

The high power dissipation capability ensures the FET can handle high power levels without overheating.

Maximum Operating Temperature: 175 °C

With a high operating temperature range, this FET can perform reliably in a wide range of environmental conditions.

Maximum Drain Current (ID): 57.5 A

High drain current rating allows this FET to handle higher continuous power levels, making it suitable for power applications.

Technical Specifications

Power Field Effect Transistors (FET) NVBG060N065SC1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

650 V

Maximum Drain Current (ID):

57.5 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

10.18 pF

JEDEC-95 Code:

TO-263CB

JESD-30 Code:

R-PSSO-G7

No. of Elements:

1

No. of Terminals:

7

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

231 A

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Element Material:

SILICON CARBIDE

Trade Compliance

NVBG060N065SC1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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