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NVBG045N065SC1

Onsemi

NVBG045N065SC1 by Onsemi

NVBG045N065SC1 by Onsemi is a N-CHANNEL Power FET with 650V DS Breakdown Voltage, 315A IDM, and 425W Abs Power Dissipation. Ideal for high-power applications requiring robust performance in a compact SMALL OUTLINE package.

Median Price

$15.230

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 790 parts In-Stock

1+ parts

$18.060

100+ parts

$12.138

1k+ parts

$9.916

10k+ parts

-

790

$18.060

$12.138

$9.916

-

Mouser Electronics

USA . 428 parts In-Stock

1+ parts

$18.060

100+ parts

$12.130

1k+ parts

$11.340

10k+ parts

-

428

$18.060

$12.130

$11.340

-

Chip1Stop

Japan . 25 parts In-Stock

1+ parts

$57.700

100+ parts

-

1k+ parts

-

10k+ parts

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25

$57.700

-

-

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Future Electronics

Canada . 800 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$10.100

10k+ parts

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800

-

-

$10.100

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Verical

USA . 800 parts In-Stock

1+ parts

-

100+ parts

$12.400

1k+ parts

$11.750

10k+ parts

-

800

-

$12.400

$11.750

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Rochester

USA . 800 parts In-Stock

1+ parts

-

100+ parts

$9.920

1k+ parts

$8.870

10k+ parts

$8.350

800

-

$9.920

$8.870

$8.350

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,929 parts In-Stock

1+ parts

$8.720

100+ parts

-

1k+ parts

-

10k+ parts

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1,929

$8.720

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-

-

Digiode

USA . 2,459 parts In-Stock

1+ parts

$10.469

100+ parts

-

1k+ parts

-

10k+ parts

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2,459

$10.469

-

-

-

Flip Electronics

USA . 52,800 parts In-Stock

1+ parts

-

100+ parts

-

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-

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52,800

-

-

-

-

NAC Semi

USA . 1,600 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$20.200

10k+ parts

$18.360

1,600

-

-

$20.200

$18.360

IBS Electronics

USA . 800 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$14.165

10k+ parts

-

800

-

-

$14.165

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 312 parts In-Stock

1+ parts

$8.720

100+ parts

-

1k+ parts

-

10k+ parts

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312

$8.720

-

-

-

Corphita

USA . 1,190 parts In-Stock

1+ parts

$9.918

100+ parts

-

1k+ parts

-

10k+ parts

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1,190

$9.918

-

-

-

Microchip USA

USA . 184 parts In-Stock

1+ parts

$38.350

100+ parts

-

1k+ parts

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184

$38.350

-

-

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Problanco Electronics

Mexico . 8,357 parts In-Stock

1+ parts

-

100+ parts

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8,357

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TANS Electronics

Latvia . 2,753 parts In-Stock

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2,753

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-

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SupplyDigital Components

Austria . 2,008 parts In-Stock

1+ parts

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2,008

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UHIMA Technologies

Türkiye . 769 parts In-Stock

1+ parts

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769

-

-

-

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Perfect Parts

USA . 627 parts In-Stock

1+ parts

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627

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Kulean Microsystems

USA . 135 parts In-Stock

1+ parts

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135

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GreenTree Electronics

Israel . 125 parts In-Stock

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125

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Authorized Procurement Solutions

USA . 65 parts In-Stock

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65

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Overview

Unlock the power of innovation with the NVBG045N065SC1 by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Power Field Effect Transistors (FET) that are designed to exceed expectations. With a maximum DS Breakdown Voltage of 650V and a Pulsed Drain Current of 315A, this N-CHANNEL FET offers unparalleled performance and reliability. Whether you're in the automotive, industrial, or consumer electronics sector, this single configuration with built-in diode is the perfect solution for your power management needs. Experience the value and benefits of Onsemi's cutting-edge technology today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and protection for the internal components of the transistor, making it durable and reliable.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically have lower ON-resistance and higher switching speeds compared to P-channel transistors, making them suitable for high-performance applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for easier circuit design and protection against reverse voltage, making the transistor versatile and efficient.

Surface Mount: YES

Surface mount technology enables easy and efficient PCB assembly, saving space and reducing production costs.

Minimum DS Breakdown Voltage: 650 V

With a high breakdown voltage, this transistor can handle high voltage applications without the risk of damage or failure.

Maximum Pulsed Drain Current (IDM): 315 A

The high pulsed drain current allows for robust and reliable performance in high-power applications, ensuring safe operation under heavy loads.

Maximum Power Dissipation (Abs): 425 W

The high power dissipation capability enables the transistor to handle high power levels without overheating, ensuring long-term reliability.

Maximum Operating Temperature: 175 °C

The high operating temperature range makes this transistor suitable for use in harsh environments or applications where temperature fluctuations are common.

Maximum Drain Current (ID): 73.7 A

The high drain current rating enables the transistor to handle large current loads, making it ideal for power applications that require high current handling capabilities.

Maximum Feedback Capacitance (Crss): 13.78 pF

Low feedback capacitance helps in reducing switching losses and improving overall efficiency in high-frequency applications.

Technical Specifications

Power Field Effect Transistors (FET) NVBG045N065SC1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

650 V

Maximum Drain Current (ID):

73.7 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

13.78 pF

JEDEC-95 Code:

TO-263CB

JESD-30 Code:

R-PSSO-G7

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

7

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

245

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

315 A

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON CARBIDE

Trade Compliance

NVBG045N065SC1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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