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NVBG022N120M3S

Onsemi

NVBG022N120M3S by Onsemi

NVBG022N120M3S by Onsemi is a N-CHANNEL FET with 1200V DS breakdown voltage, ideal for switching applications. It features a max IDM of 159A and EAS of 267mJ, suitable for high-power operations. With a package style of small outline and operating temperature up to 175°C, it offers reliable performance in various environments.

Median Price

$19.550

Lifecycle Status

Suppliers In-Stock

16

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Newark

USA . 13 parts In-Stock

1+ parts

$12.960

100+ parts

-

1k+ parts

$12.960

10k+ parts

-

13

$12.960

-

$12.960

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Arrow

USA . 1,200 parts In-Stock

1+ parts

$16.463

100+ parts

-

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-

10k+ parts

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1,200

$16.463

-

-

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Farnell

UK . 597 parts In-Stock

1+ parts

$19.550

100+ parts

$14.260

1k+ parts

-

10k+ parts

-

597

$19.550

$14.260

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-

Master Electronics

USA . 800 parts In-Stock

1+ parts

$26.280

100+ parts

$19.730

1k+ parts

$16.160

10k+ parts

-

800

$26.280

$19.730

$16.160

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Mouser Electronics

USA . 661 parts In-Stock

1+ parts

$26.770

100+ parts

$19.910

1k+ parts

$18.980

10k+ parts

-

661

$26.770

$19.910

$18.980

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DigiKey

USA . 1,230 parts In-Stock

1+ parts

$27.080

100+ parts

-

1k+ parts

$16.604

10k+ parts

-

1,230

$27.080

-

$16.604

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Chip1Stop

Japan . 2,284 parts In-Stock

1+ parts

$92.300

100+ parts

$43.200

1k+ parts

$28.700

10k+ parts

-

2,284

$92.300

$43.200

$28.700

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Verical

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

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$16.708

10k+ parts

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4,000

-

-

$16.708

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Element14

Singapore . 597 parts In-Stock

1+ parts

-

100+ parts

$25.300

1k+ parts

$23.990

10k+ parts

-

597

-

$25.300

$23.990

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Avnet

USA . 96 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$11.842

10k+ parts

$11.111

96

-

-

$11.842

$11.111

Rochester

USA . 80 parts In-Stock

1+ parts

-

100+ parts

$16.610

1k+ parts

$14.860

10k+ parts

$13.980

80

-

$16.610

$14.860

$13.980

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,358 parts In-Stock

1+ parts

$12.312

100+ parts

-

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1,358

$12.312

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Vyrian

USA . 1,715 parts In-Stock

1+ parts

$12.960

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10k+ parts

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1,715

$12.960

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IBS Electronics

USA . 1,600 parts In-Stock

1+ parts

$36.760

100+ parts

$27.237

1k+ parts

$22.664

10k+ parts

-

1,600

$36.760

$27.237

$22.664

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Flip Electronics

USA . 4,000 parts In-Stock

1+ parts

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4,000

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NAC Semi

USA . 64 parts In-Stock

1+ parts

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100+ parts

$24.120

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64

-

$24.120

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 393 parts In-Stock

1+ parts

$8.878

100+ parts

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393

$8.878

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Corphita

USA . 2,026 parts In-Stock

1+ parts

$11.664

100+ parts

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2,026

$11.664

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Continental Prestige Electronics

USA . 800 parts In-Stock

1+ parts

$39.460

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800

$39.460

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Microchip USA

USA . 217 parts In-Stock

1+ parts

$84.031

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217

$84.031

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Kulean Microsystems

USA . 4,778 parts In-Stock

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4,778

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TANS Electronics

Latvia . 3,726 parts In-Stock

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3,726

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SupplyDigital Components

Austria . 3,580 parts In-Stock

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3,580

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Problanco Electronics

Mexico . 2,369 parts In-Stock

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2,369

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Glotronic Ltd.

UK . 1,280 parts In-Stock

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1,280

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UHIMA Technologies

Türkiye . 985 parts In-Stock

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985

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Eastek

USA . 115 parts In-Stock

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$56.210

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115

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GreenTree Electronics

Israel . 115 parts In-Stock

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115

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Overview

Unleash the power of innovation with the NVBG022N120M3S by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-notch quality and reliability, making this Power Field Effect Transistor (FET) a game-changer for switching applications. With a built-in diode, high breakdown voltage of 1200V, and a maximum drain current of 58A, this transistor ensures optimal performance and efficiency. Trust Onsemi to provide cutting-edge technology that exceeds expectations, driving your projects to new heights. Elevate your designs with the NVBG022N120M3S and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material that provides protection to the internal components of the FET.

Minimum DS Breakdown Voltage: 1200 V

High breakdown voltage ensures reliable operation and protection against voltage spikes.

Maximum Pulsed Drain Current (IDM): 159 A

High pulsed drain current allows for efficient power switching applications.

Maximum Drain Current (ID): 58 A

Allows for handling of high drain currents for various applications.

Maximum Power Dissipation (Abs): 234 W

High power dissipation capability ensures the FET can handle high power applications without overheating.

Transistor Element Material: SILICON

Silicon material provides good performance characteristics and reliability for the FET.

Technical Specifications

Power Field Effect Transistors (FET) NVBG022N120M3S attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

267 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

1200 V

Maximum Drain Current (ID):

58 A

Maximum Drain-Source On Resistance:

.03 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

14 pF

JEDEC-95 Code:

TO-263

JESD-30 Code:

R-PSSO-G7

No. of Elements:

1

No. of Terminals:

7

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

159 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NVBG022N120M3S Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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